My Inquiry
My Account
NXP Semiconductors MCIMX6U6AVM08AD
- Part No.:
- MCIMX6U6AVM08AD
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6U6AVM08AD.pdf
- Description:
- IC MPU I.MX6DL 800MHZ 624MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,179
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6U6AVM08AD from NXP Semiconductors is an automotive-grade i.MX 6DualLite applications processor featuring dual Arm Cortex-A9 cores (64-bit DDR), 800 MHz operation, integrated VPU, GPU, and MLB interface, and MAPBGA-21x21 mm (0.8 mm pitch) packaging. It delivers hardware-accelerated 1080p video decode/encode, OpenGL ES 2.0 3D graphics, and dual CAN for infotainment head units and digital instrument clusters.
For engineers reviewing the MCIMX6U6AVM08AD datasheet, MCIMX6U6AVM08AD pinout, MCIMX6U6AVM08AD application, or MCIMX6U6AVM08AD equivalent, key selection considerations include automotive temperature range (−40°C to +125°C), dual-core Cortex-A9 with TrustZone, integrated power management, and support for LPDDR2-800/DDR3L-800 memory interfaces.
Technical Context
The MCIMX6U6AVM08AD implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 512 KB shared L2 cache, NEON MPE coprocessor, and TrustZone security. Its memory subsystem supports 64-bit DDR3L-800 and LPDDR2-800 with interleaving mode enabled.
It integrates dedicated accelerators including VPU (H.264/VC-1/MPEG-4 decode/encode), GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), IPUv3H (image processing), and ASRC (asynchronous sample rate conversion). Dual FlexCAN controllers (1 Mbps), MLB150/50 interface, ESAI audio, and HDMI 1.4 are natively supported per the automotive variant configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 MPCore with TrustZone, 800 MHz max (792 MHz when 24 MHz USB clock used) |
| Memory Interface | 64-bit DDR3L-800 / LPDDR2-800 with interleaving support for bandwidth optimization |
| Graphics Acceleration | GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 (BitBlt) enabling concurrent 3D UI rendering and 2D overlay composition |
| Video Processing | VPU supporting 1080p30 H.264/VC-1/MPEG-4 decode and encode with low-power hardware acceleration |
| Automotive Interfaces | Dual FlexCAN (1 Mbps), MLB150/50, ESAI (260 kHz I2S, 7.1-channel), and DCIC for display integrity checking |
| Security Features | CAAM (NIST-certified PRNG, AES/SHA), SNVS (secure RTC), CSU, A-HAB v4 (RSA-2048, SHA-256) |
| Package | MAPBGA, 21 mm × 21 mm, 0.8 mm pitch, 484-ball footprint (BGA Case 2240) |
Pinout & Package
MCIMX6U6AVM08AD uses a 484-ball MAPBGA package (21 mm × 21 mm, 0.8 mm pitch), designated BGA Case 2240. Pin assignments follow the i.MX 6DualLite functional contact map defined in Section 6.2 of IMX6SDLAEC Rev. 9.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2 V ±3% input for Arm Cortex-A9 cores and L1/L2 caches; requires low-noise regulation |
| VDD_SOC | SoC logic voltage | 1.2 V ±3% supply for system logic, CCM, GPC, and interconnect fabric |
| VDDA_3P3 | Analog I/O supply | 3.3 V analog rail for USB PHY, HDMI, and analog audio interfaces |
| ENET_MDIO | Ethernet management data I/O | Open-drain bidirectional interface for IEEE 802.3 MDIO register access to external PHY |
| FLEXCAN1_TX | CAN1 differential transmitter output | High-speed (1 Mbps) CAN bus signaling compliant with ISO 11898-2; requires external transceiver |
| MLB_CLK | MediaLB clock input | 25 MHz or 50 MHz reference clock for MOST25/50/150 network synchronization |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | Dynamic voltage and frequency scaling (DVFS) across CPU, GPU, VPU, and memory domains reduces active power by up to 40% vs. fixed-frequency operation |
| Hardware Security Subsystem | CAAM with 16 KB secure RAM, NIST-certified DRBG, and A-HAB v4 enable secure boot, encrypted firmware updates, and DRM key handling |
| Dual Display Support | Simultaneous parallel LCD + HDMI 1.4 or LVDS output at up to WUXGA (1920×1200@60 Hz) with independent timing control |
| Camera Interface Flexibility | Two parallel CSI ports (24-bit, 240 MHz) plus MIPI CSI-2 (2-lane, 1 Gbps/lane) allow direct connection to multiple camera sensors without bridge ICs |
| Automotive Audio Integration | ESAI + ASRC + AUDMUX enable multi-source, multi-rate audio routing (e.g., Bluetooth A2DP + tuner + microphone array) with sample rate conversion up to 260 kHz |
Applications
| Infotainment Head Unit | Digital Instrument Cluster |
|---|---|
Use Scenario: Central multimedia hub in vehicle dashboard integrating navigation, media playback, voice assistant, and smartphone projection (CarPlay/Android Auto). IC Role / Device Role / Timing Role: Primary application processor executing Linux/QNX OS, managing GPU/VPU rendering pipelines, and coordinating CAN/MLB communication with vehicle networks. Use Value: Hardware-accelerated 1080p video decode and OpenGL ES 2.0 graphics ensure smooth UI transitions and real-time map rendering under thermal constraints. | Use Scenario: Driver-facing display showing speed, warnings, ADAS alerts, and vehicle status with high reliability and low latency. IC Role / Device Role / Timing Role: Safety-critical display controller with DCIC modules verifying pixel integrity and dual CAN interfaces for redundant ECU communication. Use Value: Integrated DCIC and automotive-grade temperature range (−40°C to +125°C) eliminate need for external display safety monitors in ASIL-B designs. |
| Telematics Control Unit (TCU) | Advanced Rear-Seat Entertainment |
Use Scenario: Cellular-connected module providing remote diagnostics, OTA updates, emergency call (eCall), and fleet management services. IC Role / Device Role / Timing Role: Host processor for LTE modem interfacing via PCIe/USB, managing secure CAAM-encrypted data transmission and SNVS-backed time-stamped logs. Use Value: PCIe v2.0 x1 interface enables direct high-bandwidth connection to LTE modems; CAAM accelerates TLS handshake and firmware signature verification. | Use Scenario: Multi-screen entertainment system delivering HD video, gaming, and streaming to rear passengers via HDMI and LVDS outputs. IC Role / Device Role / Timing Role: Media processing engine decoding dual 1080p streams while driving independent displays with synchronized audio via ESAI/ASRC. Use Value: Concurrent VPU decode + GPU2D composition allows simultaneous playback on two displays with zero frame drop at 60 Hz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive infotainment processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6U6AVM10AD | Same dual-core Cortex-A9 architecture but rated for 1 GHz operation (996 MHz with 24 MHz USB clock); identical VPU/GPU/MLB feature set | Higher CPU throughput for complex middleware stacks (e.g., Android Automotive OS) and real-time audio DSP tasks | Select MCIMX6U6AVM10AD when sustained >800 MHz performance is required and thermal design supports higher TDP |
| MCIMX6S6AVM08AD | Solo variant: single Cortex-A9 core, 32-bit DDR interface, same 800 MHz speed grade and automotive temp rating; lacks VPU and GPU3D | Cost-optimized HMI with basic graphics (2D only), no hardware video acceleration, suitable for non-multimedia dashboards | Choose MCIMX6S6AVM08AD for simpler cluster applications where 3D graphics and 1080p video are unnecessary |
Compared with MCIMX6U6AVM08AD, MCIMX6U6AVM10AD offers higher deterministic compute bandwidth for OS-level multitasking, while MCIMX6S6AVM08AD reduces BOM cost and power by removing VPU/GPU3D-making it viable only where multimedia acceleration is excluded from requirements.
Availability
MCIMX6U6AVM08AD is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6U6AVM08AD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in secure edge processing and connectivity solutions.
The i.MX 6DualLite product line was designed specifically for cost-sensitive automotive infotainment and HMI systems requiring robust multimedia acceleration, functional safety support, and long-term automotive qualification.
FAQ
What is the maximum operating junction temperature for MCIMX6U6AVM08AD?
The MCIMX6U6AVM08AD is qualified for automotive temperature grade A, with a specified junction temperature range of −40°C to +125°C. This rating is validated per AEC-Q100 Grade 2 requirements and applies to all functional blocks including CPU, GPU, VPU, and I/O interfaces under full load conditions with proper PCB thermal design.
Does MCIMX6U6AVM08AD support HDMI 2.0 or only HDMI 1.4?
The MCIMX6U6AVM08AD supports HDMI 1.4 only, as confirmed in Section 1.2 and Figure 3 of IMX6SDLAEC Rev. 9. It provides 1080p60 video output with HDCP 1.4 compliance but does not implement HDMI 2.0 features such as 4K resolution, HDR metadata, or enhanced audio return channel (eARC).
Can MCIMX6U6AVM08AD boot directly from eMMC 4.5 without external SPI NOR flash?
Yes, MCIMX6U6AVM08AD supports booting directly from eMMC 4.4/4.41 devices using the uSDHC controller in boot mode, as documented in Section 5.2 of IMX6SDLAEC Rev. 9. No external SPI NOR flash is required if eMMC contains a valid boot image in the first boot partition with proper HAB-signed headers.
Is the MLB interface on MCIMX6U6AVM08AD compatible with MOST25, MOST50, and MOST150 physical layers?
Yes, the MLB interface on MCIMX6U6AVM08AD supports MOST25, MOST50, and MOST150 physical layer standards, as explicitly stated in Section 1.2 and Figure 3 of IMX6SDLAEC Rev. 9. It includes DTCP cipher acceleration for content-protected traffic over MOST networks.
What debug interfaces are available on MCIMX6U6AVM08AD for JTAG-based development?
MCIMX6U6AVM08AD provides IEEE 1149.6-compliant JTAG interface via dedicated debug pins (TCK, TMS, TDI, TDO, TRST_B), accessible through the ARM CoreSight DAP module. It supports real-time memory/peripheral access without halting the Cortex-A9 cores, as detailed in Section 2.1 and Table 2 of IMX6SDLAEC Rev. 9.
MCIMX6U6AVM08AD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6DL
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6U6AVM08AD FAQ
1.How can I place an order for MCIMX6U6AVM08AD through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6U6AVM08AD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6U6AVM08AD reliable?
The price and inventory of MCIMX6U6AVM08AD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6U6AVM08AD is usually 5 days.
3.What payment methods are accepted for MCIMX6U6AVM08AD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6U6AVM08AD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6U6AVM08AD?
MCIMX6U6AVM08AD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6U6AVM08AD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6U6AVM08AD?
For technical support, including MCIMX6U6AVM08AD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6U6AVM08AD requirements.
6.How does Aetrix verify that MCIMX6U6AVM08AD is sourced from the original manufacturer or authorized distributors?
All MCIMX6U6AVM08AD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6U6AVM08AD meets industry standards.
7.What is the process for return or replacement of MCIMX6U6AVM08AD?
All MCIMX6U6AVM08AD units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6U6AVM08AD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6U6AVM08AD part is unused and in its original packaging.
Return procedure for MCIMX6U6AVM08AD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6U6AVM08AD Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
