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NXP Semiconductors MCIMX6U6AVM08ADR
- Part No.:
- MCIMX6U6AVM08ADR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6U6AVM08ADR.pdf
- Description:
- IC MPU I.MX6DL 800MHZ 624MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,664
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Product details
Overview
MCIMX6U6AVM08ADR from NXP Semiconductors is an automotive-grade i.MX 6DualLite applications processor featuring dual Arm Cortex-A9 cores (64-bit DDR), 800 MHz operation, integrated VPU/GPU/MLB, and MAPBGA-256 (21 × 21 mm, 0.8 mm pitch) packaging. It delivers hardware-accelerated 1080p video decode/encode, OpenGL ES 2.0 3D graphics, dual CAN 2.0B interfaces, and ESAI audio for infotainment head units.
For engineers reviewing the MCIMX6U6AVM08ADR datasheet, MCIMX6U6AVM08ADR pinout, MCIMX6U6AVM08ADR application, or MCIMX6U6AVM08ADR equivalent, key selection considerations include automotive temperature range (−40°C to +125°C), dual-core Cortex-A9 with TrustZone, integrated power management unit (PMU), and support for DDR3L/LPDDR2-800 memory interfaces.
Technical Context
The MCIMX6U6AVM08ADR implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 512 KB shared L2 cache, NEON MPE coprocessor, and Snoop Control Unit (SCU). It integrates dedicated accelerators including VPU (H.264/MPEG-4/VC-1 decode/encode), GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), IPUv3H (image processing), and ASRC (asynchronous sample rate conversion).
Its system-level architecture includes four uSDHC ports supporting UHS-I SDR-104, PCIe v2.0 x1 root/endpoint mode, Gigabit Ethernet (IEEE 1588-compliant), two FlexCAN controllers (1 Mbps), MLB150/50 interface for MOST networks, and CAAM cryptographic acceleration with 16 KB secure RAM and NIST-certified PRNG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 MPCore with TrustZone, 64-bit DDR data path |
| Max Frequency | 800 MHz (792 MHz when 24 MHz USB clock used) |
| Memory Interface | 32/64-bit DDR3/DDR3L/LPDDR2-800 supporting interleaving mode |
| Graphics | GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 (BitBlt); 2D/3D rendering offloads CPU |
| Video Acceleration | VPU supports H.264, MPEG-4, VC-1 decode/encode up to 1080p@60fps |
| Automotive Interfaces | Two FlexCAN 2.0B ports (1 Mbps), MLB150/50, ESAI (260 kHz I2S), DTCP cipher accelerator |
| Security | CAAM with AES/SHA/RSA engines, 16 KB secure RAM, A-HAB v4 boot, SNVS RTC |
Pinout & Package
MCIMX6U6AVM08ADR uses a 256-ball MAPBGA package (21 × 21 mm, 0.8 mm pitch), RoHS-compliant, with ball map defined in NXP document IMX6SDLAEC Rev. 9 Section 6.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2 V ±3% input for Arm Cortex-A9 cores and L2 cache; requires low-noise regulation |
| VDD_SOC | SoC domain supply | 1.2 V ±3% for logic, interconnect, and most peripherals; decoupling critical for signal integrity |
| VDD_DDR | DDR memory interface supply | 1.35 V (DDR3L) or 1.5 V (DDR3); supports 32/64-bit bus width and interleaving |
| CLK_24M | USB reference clock input | 24 MHz crystal or oscillator input; required for USB OTG/host PHY operation |
| CAN1_TX / CAN1_RX | FlexCAN 1 differential pair | High-speed CAN 2.0B physical layer interface; supports 1 Mbps with external transceiver |
| MLB_CLK / MLB_DATA | MediaLB serial interface | MLB150/50 bus signals for MOST network connectivity; enables DTCP-secured audio/video transport |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling (DVFS) and power gating reduce active/idle power without sacrificing real-time response in automotive HMI |
| Integrated PMU | On-die linear regulators generate VDD_ARM, VDD_SOC, VDD_DDR, and analog supplies-eliminates 6+ external LDOs |
| Hardware Security Stack | A-HAB v4 boot with SHA-256/2048-RSA, CAAM crypto engine, and SNVS tamper-resistant storage enable secure firmware updates and DRM |
| Dual Display Support | Simultaneous parallel LCD + HDMI 1.4 or LVDS output at up to WUXGA (1920×1200@60Hz); no external TCON required |
| Camera Interface Flexibility | Two parallel CSI ports (240 MHz max) + MIPI CSI-2 (2-lane @ 1 Gbps/lane) support multi-sensor ADAS integration |
Applications
| Infotainment Head Unit | Digital Instrument Cluster |
|---|---|
Use Scenario: Central multimedia hub in vehicle dashboard integrating navigation, media playback, Bluetooth telephony, and rear-seat entertainment. IC Role / Device Role / Timing Role: Primary application processor executing Linux/QNX OS, managing GPU/VPU rendering pipelines, and coordinating CAN/MLB communication with body control modules. Use Value: Dual Cortex-A9 + GPU3Dv5 enables smooth 3D map rotation and video overlay while maintaining <50 ms UI latency under concurrent CAN bus load. | Use Scenario: Real-time driver information display with animated gauges, ADAS alerts, and camera feed fusion. IC Role / Device Role / Timing Role: Safety-critical rendering engine driving dual displays via parallel LCD + LVDS; ASRC synchronizes audio alerts with visual warnings across independent clock domains. Use Value: IPUv3H hardware compositing and DCIC-0/DCIC-1 display integrity checking ensure pixel-perfect, tamper-evident rendering for functional safety compliance. |
| Telematics Control Unit (TCU) | Advanced Driver Assistance System (ADAS) Sensor Hub |
Use Scenario: Cellular-connected gateway aggregating GPS, vehicle bus data, and OTA update management. IC Role / Device Role / Timing Role: Host controller for LTE modem, dual CAN interfaces (powertrain + chassis), and eMMC-based secure firmware storage managed by CAAM. Use Value: Integrated PCIe v2.0 x1 and uSDHC4 allow high-throughput modem interfacing while CAAM accelerates TLS handshake and signed firmware verification. | Use Scenario: Multi-camera preprocessing node fusing inputs from front/rear/side cameras before sending to central ADAS ECU. IC Role / Device Role / Timing Role: Vision pipeline accelerator using VPU for H.264 compression and SDMA for zero-copy sensor data routing between CSI ports and DDR memory. Use Value: Hardware ASRC and ESAI enable synchronized audio-video recording of driver alerts with sub-10 µs jitter across multiple sensor streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive infotainment processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6U6AVM10AC | 1 GHz core speed (vs. 800 MHz); same package, temperature grade, and peripheral set | Higher compute throughput for complex speech recognition or multi-zone audio DSP | Select when >800 MHz sustained performance is required and thermal design supports higher power dissipation |
| MCIMX6S6AVM08AB | Solo variant: single Cortex-A9 core, no VPU, GPU only (no 3D), no MLB interface | Cost-optimized entry-level HMI with basic graphics and CAN-only connectivity | Select for non-video applications where dual-core and multimedia acceleration are unnecessary |
Compared with MCIMX6U6AVM08ADR, MCIMX6U6AVM10AC offers +25% CPU frequency headroom for compute-intensive tasks but increases thermal load, while MCIMX6S6AVM08AB reduces BOM cost and power by removing VPU, MLB, and one core-suitable only for simpler HMIs without video or MOST integration.
Availability
MCIMX6U6AVM08ADR is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, telematics control units, and ADAS sensor hubs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCIMX6U6AVM08ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure markets, with deep expertise in secure edge computing and automotive-grade SoCs.
The i.MX 6DualLite product line was designed specifically for cost-sensitive, high-reliability automotive infotainment and HMI applications-balancing dual-core performance, hardware multimedia acceleration, and automotive qualification (AEC-Q100 Grade 2).
FAQ
What is the operating temperature range for MCIMX6U6AVM08ADR?
The MCIMX6U6AVM08ADR is qualified for automotive operation from −40°C to +125°C junction temperature (Grade A), meeting AEC-Q100 requirements for under-hood and dashboard-mounted systems. This rating applies to the full functional specification-including dual Cortex-A9 operation, VPU decoding, and FlexCAN communication-at all temperatures within this range.
Does MCIMX6U6AVM08ADR support LPDDR2 memory?
Yes, MCIMX6U6AVM08ADR supports 16/32-bit LPDDR2-800 memory interfaces at up to 800 MHz data rate. The MMDC controller provides configurable timing parameters and on-die termination control, enabling robust operation with JEDEC-compliant LPDDR2 components in automotive environments.
Can MCIMX6U6AVM08ADR boot directly from eMMC?
Yes, MCIMX6U6AVM08ADR supports booting from eMMC version 4.4/4.41 via its uSDHC4 interface. The internal Boot ROM implements HABv4 authentication, allowing secure boot with signed images stored in eMMC boot partitions-no external SPI NOR required for production deployment.
What security features are enabled in MCIMX6U6AVM08ADR?
MCIMX6U6AVM08ADR includes CAAM (AES-128/256, SHA-1/256, RSA-2048), SNVS with tamper detection and secure RTC, A-HABv4 for authenticated boot, and TrustZone-enabled memory isolation. All security blocks are silicon-fused and operational without external keys or configuration-enabling DRM, secure OTA, and encrypted storage out-of-box.
Is MCIMX6U6AVM08ADR pin-compatible with other i.MX 6DualLite variants?
Yes, MCIMX6U6AVM08ADR shares identical 256-ball MAPBGA-21x21mm (0.8 mm pitch) mechanical and electrical pinout with all i.MX 6DualLite automotive-grade parts (e.g., MCIMX6U4AVM08AC, MCIMX6U1AVM08AD), enabling PCB reuse across performance tiers-subject to matching power delivery and thermal design for the selected feature set.
MCIMX6U6AVM08ADR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6DL
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6U6AVM08ADR FAQ
1.How can I place an order for MCIMX6U6AVM08ADR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6U6AVM08ADR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6U6AVM08ADR reliable?
The price and inventory of MCIMX6U6AVM08ADR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6U6AVM08ADR is usually 5 days.
3.What payment methods are accepted for MCIMX6U6AVM08ADR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6U6AVM08ADR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6U6AVM08ADR?
MCIMX6U6AVM08ADR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6U6AVM08ADR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6U6AVM08ADR?
For technical support, including MCIMX6U6AVM08ADR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6U6AVM08ADR requirements.
6.How does Aetrix verify that MCIMX6U6AVM08ADR is sourced from the original manufacturer or authorized distributors?
All MCIMX6U6AVM08ADR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6U6AVM08ADR meets industry standards.
7.What is the process for return or replacement of MCIMX6U6AVM08ADR?
All MCIMX6U6AVM08ADR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6U6AVM08ADR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6U6AVM08ADR part is unused and in its original packaging.
Return procedure for MCIMX6U6AVM08ADR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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