My Inquiry
My Account
NXP Semiconductors MCIMX6X1AVK08AC
- Part No.:
- MCIMX6X1AVK08AC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 400-LFBGA
- Datasheet:
-
MCIMX6X1AVK08AC.pdf
- Description:
- IC MPU I.MX6SX 800MHZ 400MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,254
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6X1AVK08AC from NXP Semiconductors is an automotive-grade heterogeneous multicore application processor integrating one Arm Cortex-A9 core (800 MHz) and one Arm Cortex-M4 core (227 MHz), packaged in a 14×14 mm, 0.65 mm pitch MAPBGA (VK package). It supports DDR3/DDR3L/LPDDR2-800 memory, dual Gigabit Ethernet with AVB, two FlexCAN 2.0B interfaces, and dual 4-channel 12-bit ADCs - deployed in automotive instrument clusters and entry-level infotainment head units.
For engineers reviewing the MCIMX6X1AVK08AC datasheet, MCIMX6X1AVK08AC pinout, MCIMX6X1AVK08AC application, or MCIMX6X1AVK08AC equivalent, key selection considerations include its automotive qualification (−40°C to +125°C), absence of GPU/PCIe/LVDS, 14 mm × 14 mm BGA footprint, dual-core asymmetric RTOS/Linux partitioning, and integrated security features including CAAM, SNVS, and TrustZone-enabled A9 core.
Technical Context
The MCIMX6X1AVK08AC implements a tightly coupled dual-core architecture where the Cortex-A9 handles rich OS tasks (Linux) and the Cortex-M4 executes deterministic real-time functions (e.g., CAN message scheduling, sensor preprocessing). Its memory subsystem includes 256 KB L2 cache, 128 KB OCRAM, 16 KB OCRAM_S, and boot ROM with HABv4 secure boot.
Electrical operation is governed by seven PLLs, on-chip oscillators (24 MHz crystal + 32.768 kHz RTC), and integrated LDOs supporting DVFS across multiple power domains. The device uses dedicated hardware accelerators - ASRC for multi-channel audio sample rate conversion, PXP for pixel processing, and SDMA for autonomous peripheral data movement - without GPU or PCIe functionality per its VK package configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Arm Cortex-A9 @ 800 MHz + Arm Cortex-M4 @ 227 MHz - enables Linux + RTOS coexistence with hardware-isolated execution environments |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 - supports up to 2 GB external RAM with configurable timing for automotive thermal margins |
| ADC | Two 12-bit, 4-channel SAR ADCs - provides redundant analog sensing for vehicle instrumentation (e.g., battery voltage, temperature, pedal position) |
| Connectivity | Dual 10/100/1000 Mbps Ethernet with IEEE 1588 & AVB - enables time-synchronized audio/video streaming and diagnostic over IP in vehicle networks |
| Automotive Interfaces | Two FlexCAN 2.0B controllers (1 Mbps) + MLB25/50 port + ESAI - meets CAN FD–adjacent communication requirements for body control and infotainment gateways |
| Security | CAAM (32 KB secure RAM), SNVS (secure RTC), CSU, TrustZone, A-HABv4 - enables secure boot, encrypted firmware updates, and isolated cryptographic operations |
| Package | MAPBGA, 14 mm × 14 mm, 0.65 mm pitch, 361 balls - compact automotive-qualified footprint compatible with standard reflow profiles and IPC Class 3 assembly |
Pinout & Package
MCIMX6X1AVK08AC is housed in a 14×14 mm, 0.65 mm pitch MAPBGA package (VK code) with 361 I/O balls. Pin assignments follow the i.MX 6SoloX 14×14 NP (No PCIe) signal map defined in Section 6.5 of IMX6SXAEC Rev. 4. Ball pitch and pad layout comply with JEDEC MO-270AB standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Cortex-A9 Core Supply | 1.05–1.3 V regulated input; requires low-noise decoupling due to dynamic current draw during burst execution |
| VDD_SOC | SoC Logic & Interconnect Supply | 1.05–1.3 V domain powering L2 cache, AXI/AHB fabric, and peripheral bridges - shared with DDR I/O termination |
| VDDA_3P3 | Analog I/O Reference | 3.3 V supply for ADC reference, ESAI, SPDIF, and analog PHYs - must be filtered independently to maintain <10 mV ripple |
| ENET1_RXD0–3 | Gigabit Ethernet Receive Data | LVDS-compatible differential inputs tied to ENET1 MAC; require 100 Ω termination and controlled impedance routing (≤100 ps skew) |
| FLEXCAN1_TX/RX | CAN Bus Transceiver Interface | CMOS-level signals routed to external CAN transceiver (e.g., TJA1043); support 1 Mbps bit rate with built-in loopback for self-test |
| ADC1_IN0–3 | Analog Input Channel 0–3 | Single-ended 0–3.3 V inputs with internal 12-bit SAR conversion; share common VREFH/VREFL pins and support hardware-triggered sampling |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Dual-Core Architecture | Enables concurrent Linux-based UI rendering on Cortex-A9 and hard real-time CAN/ADC control on Cortex-M4 without OS interference or context-switch latency |
| Automotive Temperature Range | Qualified from −40°C to +125°C junction temperature - validated for under-hood and dashboard mounting with no derating required |
| Dual FlexCAN 2.0B Controllers | Supports simultaneous CAN bus monitoring and actuation (e.g., cluster display + telematics ECU communication) with mailbox-based prioritization and error confinement |
| Secure Boot & Runtime Isolation | A-HABv4 with SHA-256/2048-bit RSA validates signed firmware images; TrustZone and CSU enforce memory access boundaries between secure/non-secure worlds |
| ASRC Audio Acceleration | Converts up to 10 asynchronous audio streams (e.g., Bluetooth A2DP, tuner, mic array) to synchronized sample rates - offloads CPU and eliminates software resampling jitter |
| Smart Power Management | DVFS, clock gating, and domain-level power gating reduce active power to ≤1.8 W typical at 800 MHz A9 + 227 MHz M4 under mixed workload |
Applications
| Instrument Cluster Display | Entry-Level Infotainment Head Unit |
|---|---|
Use Scenario: Real-time rendering of speedometer, tachometer, warning icons, and ADAS alerts on TFT-LCD panel within <50 ms latency. IC Role / Device Role / Timing Role: MCIMX6X1AVK08AC acts as primary display controller and CAN gateway - receives vehicle bus data via FlexCAN, processes graphics using PXP, and drives parallel RGB interface. Use Value: Eliminates need for discrete CAN controller and GPU; deterministic M4 core handles CAN filtering while A9 renders UI - reduces BOM count by ≥3 ICs. |
Use Scenario: Voice-controlled navigation, Bluetooth hands-free calling, and AM/FM radio playback in compact automotive dash design. IC Role / Device Role / Timing Role: MCIMX6X1AVK08AC serves as system-on-chip host - runs Linux for UI, manages USB/WiFi/BT connectivity, routes audio via ESAI/ASRC, and monitors system health via ADC. Use Value: Integrated ASRC synchronizes Bluetooth SCO, FM tuner, and microphone inputs - avoids external audio DSP and reduces audio path latency to <15 ms. |
| Telematics Control Unit (TCU) | Automotive Gateway Module |
Use Scenario: Cellular modem interfacing, GNSS data acquisition, OTA firmware update coordination, and vehicle diagnostics reporting over LTE. IC Role / Device Role / Timing Role: MCIMX6X1AVK08AC functions as secure application processor - isolates modem communication (USB/UART) from CAN bus traffic using TrustZone-protected memory partitions. Use Value: CAAM accelerates TLS handshake and firmware signature verification - cuts OTA update validation time from 800 ms to <120 ms. |
Use Scenario: Protocol translation between high-speed CAN FD backbone and legacy LIN/CAN 2.0 subnets in vehicle E/E architecture. IC Role / Device Role / Timing Role: MCIMX6X1AVK08AC operates as protocol-aware bridge - routes messages between FlexCAN1 (backbone) and FlexCAN2 (subsystem) with configurable filtering and priority arbitration. Use Value: Dual CAN controllers eliminate external CAN bridge IC; M4 core executes time-critical message forwarding with <2 µs jitter - meets ISO 11898-1 timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous automotive processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6X1AVO08AC | Same dual-core speeds and automotive temp grade, but in 17×17 mm, 0.8 mm pitch BGA (VO package) - larger footprint, same feature disable set (no GPU/PCIe/LVDS) | Preferred when PCB layout allows larger BGA and thermal dissipation margin exceeds 2.1 W | Select MCIMX6X1AVO08AC only if board space permits 17×17 mm package and existing layout accommodates 0.8 mm pitch routing. |
| S32G274A | NXP S32G2 series - Arm Cortex-A53 + Cortex-M7, supports CAN FD, Ethernet TSN, and virtualization; lacks integrated ASRC/PXP but adds HSE security engine | Targeted at zonal gateway and vehicle server applications requiring higher throughput and functional safety (ASIL-B) | Choose S32G274A when upgrading to CAN FD, TSN, or ISO 26262-compliant systems - not a drop-in replacement for MCIMX6X1AVK08AC. |
Compared with MCIMX6X1AVK08AC, MCIMX6X1AVO08AC offers identical functionality in a larger package for easier assembly, while S32G274A delivers next-generation networking and safety features at the cost of higher power and complexity - neither is pin-compatible, but both serve overlapping automotive compute tiers with distinct roadmap positioning.
Availability
MCIMX6X1AVK08AC is available at Aetrix Electronics and suitable for automotive instrument clusters, entry-level infotainment head units, and telematics control units requiring stable component supply across extended product lifecycles and rigorous environmental qualification.
Supply support for MCIMX6X1AVK08AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with >50 years of embedded systems expertise and ISO/TS 16949-certified manufacturing.
The i.MX 6SoloX family - including MCIMX6X1AVK08AC - was engineered specifically for cost-sensitive automotive infotainment and digital cluster applications requiring real-time responsiveness, functional safety readiness, and long-term supply stability.
FAQ
What is the maximum operating temperature specification for MCIMX6X1AVK08AC?
The MCIMX6X1AVK08AC is qualified for automotive operation with a junction temperature range of −40°C to +125°C. This rating is verified per AEC-Q100 Grade 2 requirements and applies to continuous operation under specified voltage, clock, and load conditions defined in Section 4.1 of the IMX6SXAEC datasheet.
Does MCIMX6X1AVK08AC support secure boot, and what cryptographic algorithms does it use?
Yes, MCIMX6X1AVK08AC implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing and 2048-bit RSA signature verification. Secure boot is enforced by the HAB module in ROM, validated against fuses programmed via OCOTP, and supported by CAAM's certified DRBG and hash engines.
Can MCIMX6X1AVK08AC interface directly with a camera sensor, and what protocols are supported?
Yes, MCIMX6X1AVK08AC integrates two parallel CSI interfaces supporting CCIR656, 24-bit RGB888/YUV444, and 8-/10-/12-bit Bayer formats at up to 133 MHz pixel clock. It does not support MIPI CSI-2; external bridging is required for MIPI-based sensors.
What memory types are supported by MCIMX6X1AVK08AC, and what is the maximum DDR bandwidth?
MCIMX6X1AVK08AC supports DDR3, DDR3L, and LPDDR2-800 (800 MHz data rate) via its 32-bit MMDC interface. Peak theoretical bandwidth is 6.4 GB/s (32-bit × 800 MHz × 2 transfers/cycle), subject to PCB layout, termination, and timing closure per JEDEC JESD79-3F specifications.
Is MCIMX6X1AVK08AC pin-compatible with other i.MX 6SoloX variants such as MCIMX6X2AVN08AC?
No, MCIMX6X1AVK08AC is not pin-compatible with MCIMX6X2AVN08AC. The VK package (14×14 mm, 0.65 mm pitch, 361 balls) differs physically and electrically from the VN package (17×17 mm, 0.8 mm pitch, 484 balls), and signal allocations vary significantly - especially for PCIe, LVDS, and GPU-related pins disabled in VK.
MCIMX6X1AVK08AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 400-LFBGA
- Series:
- i.MX6SX
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 200MHz, 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-MAPBGA (14x14)
- Additional Interfaces:
- AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
MCIMX6X1AVK08AC FAQ
1.How can I place an order for MCIMX6X1AVK08AC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6X1AVK08AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6X1AVK08AC reliable?
The price and inventory of MCIMX6X1AVK08AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6X1AVK08AC is usually 5 days.
3.What payment methods are accepted for MCIMX6X1AVK08AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6X1AVK08AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6X1AVK08AC?
MCIMX6X1AVK08AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6X1AVK08AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6X1AVK08AC?
For technical support, including MCIMX6X1AVK08AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6X1AVK08AC requirements.
6.How does Aetrix verify that MCIMX6X1AVK08AC is sourced from the original manufacturer or authorized distributors?
All MCIMX6X1AVK08AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6X1AVK08AC meets industry standards.
7.What is the process for return or replacement of MCIMX6X1AVK08AC?
All MCIMX6X1AVK08AC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6X1AVK08AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6X1AVK08AC part is unused and in its original packaging.
Return procedure for MCIMX6X1AVK08AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6X1AVK08AC Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
