NXP Semiconductors MCIMX6X1CVK08AB

Overview

MCIMX6X1CVK08AB from NXP Semiconductors is an industrial-grade heterogeneous applications processor integrating an Arm Cortex-A9 core (800 MHz) and an Arm Cortex-M4 core (227 MHz) in a 14×14 mm, 0.65 mm pitch MAPBGA package. It supports DDR3/DDR3L/LPDDR2-800 memory, dual Gigabit Ethernet with AVB, two FlexCAN 2.0B interfaces, and two 4-channel 12-bit ADCs - deployed in portable medical devices, industrial HMIs, and smart energy gateways.

For engineers reviewing the MCIMX6X1CVK08AB datasheet, MCIMX6X1CVK08AB pinout, MCIMX6X1CVK08AB application, or MCIMX6X1CVK08AB equivalent, key selection considerations include its no-PCIe/no-LVDS/no-MLB/no-GPU configuration, industrial temperature range (−40°C to +105°C), dual-core asymmetric RTOS/Linux partitioning capability, and validated support for secure boot via HABv4 and CAAM cryptographic acceleration.

Technical Context

The MCIMX6X1CVK08AB implements a tightly coupled dual-core architecture where the Cortex-A9 handles high-level OS tasks (Linux) and the Cortex-M4 executes deterministic real-time control (FreeRTOS/MQX), communicating via MU (Message Unit) and shared OCRAM (128 KB). Its memory subsystem includes 256 KB L2 cache, 32 KB L1 I/D caches per A9 core, and 16 KB I/D caches plus 64 KB TCM for the M4.

Power management leverages integrated LDOs, DVFS, and hardware-accelerated clock gating across domains; security relies on Arm TrustZone, CAAM (32 KB secure RAM), SNVS, CSU, and A-HABv4 with SHA-256 and 2048-bit RSA key validation - all enabled without external security co-processors.

Key Specifications

Pinout & Package

MCIMX6X1CVK08AB is housed in a 14×14 mm, 0.65 mm pitch MAPBGA package with 361 solder balls. Pin assignments follow the "VK" package map defined in Section 6.5 of IMX6SXIEC Rev. 4, supporting industrial signal integrity requirements including controlled impedance routing and dedicated power/ground ball patterns.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous multicore applications.

Compared with MCIMX6X3CVK08AB and MCIMX6X1CVO08AB, the MCIMX6X1CVK08AB delivers identical dual-core compute and industrial qualification in the smallest footprint - optimizing PCB area and thermal design for portable and embedded edge nodes where PCIe and LVDS are unnecessary.

Availability

MCIMX6X1CVK08AB is available at Aetrix Electronics and suitable for portable medical devices, industrial HMIs, and smart energy gateways requiring stable component supply across extended product lifecycles.

Supply support for MCIMX6X1CVK08AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with annual R&D investment exceeding $1.2 billion.

The i.MX 6SoloX product line was engineered specifically for resource-constrained industrial edge devices demanding real-time responsiveness, graphical UI capability, and hardware-enforced security - targeting medical, energy, and factory automation applications.

FAQ

What is the maximum operating frequency of the Cortex-A9 core in the MCIMX6X1CVK08AB?

The MCIMX6X1CVK08AB features an Arm Cortex-A9 core rated for operation at up to 800 MHz under industrial temperature conditions (−40°C to +105°C junction). This speed is guaranteed with proper power delivery (VDD_ARM = 1.2 V ±3%) and thermal management; it does not support 1 GHz operation due to its "08" speed grade designation and industrial qualification tier.

Does the MCIMX6X1CVK08AB include a graphics processing unit (GPU)?

No, the MCIMX6X1CVK08AB explicitly excludes the 2D/3D GPU, PCIe, LVDS, and MLB interfaces as stated in its ordering information. This variant is optimized for cost-sensitive, non-graphic-intensive applications such as industrial control and medical data acquisition - where CPU and real-time core performance outweigh display acceleration needs.

How many analog-to-digital converter (ADC) channels does the MCIMX6X1CVK08AB support?

The MCIMX6X1CVK08AB integrates two independent 12-bit ADC modules (ADC1 and ADC2), each with four single-ended input channels - totaling eight usable analog inputs. These ADCs operate concurrently and support programmable sample rates up to 10 kSPS per channel, with dedicated reference voltage (VREF) and analog supply (VDDA_3P3) pins.

What security features are implemented in hardware on the MCIMX6X1CVK08AB?

The MCIMX6X1CVK08AB includes Arm TrustZone, CAAM (Cryptographic Acceleration and Assurance Module) with 32 KB secure RAM, SNVS (Secure Non-Volatile Storage), CSU (Central Security Unit), and A-HABv4 (Advanced High Assurance Boot) supporting SHA-256 and 2048-bit RSA key validation. These features enable secure boot, encrypted firmware updates, and runtime cryptographic operations without external security ICs.

Which package type and ball count does the MCIMX6X1CVK08AB use?

The MCIMX6X1CVK08AB uses a 14×14 mm MAPBGA package with 0.65 mm pitch and 361 solder balls, designated by package code "VK". This compact footprint reduces PCB area by ~40% compared to the 17×17 mm "VO" variant while maintaining full electrical compatibility for core, memory, and peripheral interfaces.