NXP Semiconductors MCIMX6X1CVO08ABR

Overview

MCIMX6X1CVO08ABR from NXP Semiconductors is an industrial-grade heterogeneous applications processor integrating a single Arm Cortex-A9 core (800 MHz) and an Arm Cortex-M4 core (227 MHz) in a 17×17 mm, 0.8 mm pitch BGA package. It supports DDR3/DDR3L/LPDDR2-800 memory, dual Gigabit Ethernet with AVB, two FlexCAN 2.0B interfaces, and dual 4-channel 12-bit ADCs - deployed in industrial HMIs, portable medical devices, and smart energy gateways.

For engineers reviewing the MCIMX6X1CVO08ABR datasheet, MCIMX6X1CVO08ABR pinout, MCIMX6X1CVO08ABR application, or MCIMX6X1CVO08ABR equivalent, key selection considerations include its dual-core asymmetric runtime (Linux on A9 + RTOS on M4), absence of GPU/PCIe/LVDS/MLB peripherals, industrial temperature range (−40°C to +105°C), and BGA-484 pinout with 17×17 mm footprint.

Technical Context

The MCIMX6X1CVO08ABR implements a tightly coupled dual-core architecture where the Cortex-A9 handles high-level OS tasks and the Cortex-M4 executes deterministic real-time control - enabled by shared memory (OCRAM, TCM) and inter-core messaging (MU, SEMAPHORE). Its power management includes DVFS, LDO-integrated voltage regulation, and hardware-accelerated security (CAAM, SNVS, TrustZone).

It features a multilayer memory subsystem with 32 KB L1 I/D caches per core, 256 KB unified L2 cache, 128 KB OCRAM, and boot ROM with HABv4 secure boot. Peripheral connectivity includes four eCSPI, four I²C, six UARTs (one RS485-capable), two GbE controllers compliant with IEEE 1588 and AVB, and dual 12-bit ADCs - all mapped to dedicated BGA signal balls per the 17×17 mm package layout.

Key Specifications

Pinout & Package

MCIMX6X1CVO08ABR uses a 17×17 mm, 0.8 mm pitch MAPBGA package with 484 signal balls (package code "VO", no PCIe variant). Pin assignments follow the i.MX 6SoloX 17×17 NP BGA map defined in Section 6.4 of IMX6SXIEC Rev. 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous multicore applications.

Compared with MCIMX6X1CVO08ABR, MCIMX6X3CVO08AB adds graphics capability at higher power and layout cost, while MCIMX6X1CVK08AB trades package size for thermal and assembly trade-offs - making MCIMX6X1CVO08ABR optimal for balanced industrial control with moderate I/O density and proven thermal performance.

Availability

MCIMX6X1CVO08ABR is available at Aetrix Electronics and suitable for industrial HMIs, portable medical monitors, and smart energy gateways requiring stable component supply, long-term lifecycle assurance, and industrial temperature compliance.

Supply support for MCIMX6X1CVO08ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications - delivering high-reliability processors with integrated security and power efficiency.

The i.MX 6SoloX product line was designed specifically for industrial and medical edge devices requiring real-time responsiveness, graphical user interfaces, and hardware-enforced security - with MCIMX6X1CVO08ABR targeting cost-sensitive, non-GPU applications needing dual-core determinism and extended temperature operation.

FAQ

What is the maximum operating frequency of the Cortex-A9 core in MCIMX6X1CVO08ABR?

The Cortex-A9 core in MCIMX6X1CVO08ABR operates at a maximum frequency of 800 MHz, as specified in Table 1 of the IMX6SXIEC datasheet. This speed grade is fixed for the "08" suffix and validated across the full industrial temperature range (−40°C to +105°C) with appropriate voltage and cooling conditions. The MCIMX6X1CVO08ABR does not support 1 GHz operation.

Does MCIMX6X1CVO08ABR include a GPU or graphics acceleration unit?

No, MCIMX6X1CVO08ABR explicitly excludes 2D/3D GPU and PXP graphics acceleration, as confirmed in the "Features not supported" line for this part number in Table 1 of IMX6SXIEC Rev. 4. Unlike higher variants (e.g., MCIMX6X3CVO08AB), the MCIMX6X1CVO08ABR is intended for headless or text-based industrial applications where display rendering is handled externally or omitted entirely.

What package type and ball count does MCIMX6X1CVO08ABR use?

MCIMX6X1CVO08ABR uses a 17 mm × 17 mm MAPBGA package with 0.8 mm pitch and 484 signal balls (package code "VO", "NP" = No PCIe). This matches the 17×17 NP BGA mapping detailed in Section 6.4 of the IMX6SXIEC datasheet and is distinct from the 14×14 mm ("VK") or 19×19 mm ("VM") variants.

Which ADC capabilities are enabled in MCIMX6X1CVO08ABR?

MCIMX6X1CVO08ABR integrates two independent 12-bit ADC modules (ADC1 and ADC2), each with four dedicated single-ended inputs - totaling eight analog channels. This configuration is confirmed in Table 1 and the "Part Differentiator" matrix on page 5 of IMX6SXIEC Rev. 4, and applies specifically to VO and VK package variants.

Is MCIMX6X1CVO08ABR qualified for automotive applications?

No, MCIMX6X1CVO08ABR is qualified for industrial applications only (temperature grade "C", −40°C to +105°C), as stated in Table 1 and Figure 1 of IMX6SXIEC Rev. 4. Automotive-grade variants (e.g., those with "A" temperature suffix) are covered under the separate IMX6SXAEC datasheet and undergo additional AEC-Q100 stress testing - MCIMX6X1CVO08ABR lacks that qualification.