NXP Semiconductors MCIMX6X1CVO08AC

Overview

MCIMX6X1CVO08AC from NXP Semiconductors is an industrial-grade heterogeneous applications processor integrating a single Arm Cortex-A9 core (800 MHz) and an Arm Cortex-M4 core (227 MHz) in a 17×17 mm, 0.8 mm pitch MAPBGA package. It supports DDR3/DDR3L/LPDDR2-800 memory, dual Gigabit Ethernet with AVB, two FlexCAN interfaces, and two 4-channel 12-bit ADCs - deployed in industrial control panels and portable medical devices requiring deterministic real-time response alongside Linux-based UI processing.

For engineers reviewing the MCIMX6X1CVO08AC datasheet, MCIMX6X1CVO08AC pinout, MCIMX6X1CVO08AC application, or MCIMX6X1CVO08AC equivalent, key selection considerations include its no-GPU/no-PCIe/no-LVDS feature set, industrial temperature range (−40°C to +105°C), mask set 4N19K silicon revision, and BGA package compatibility with i.MX 6SoloX 17×17 NP footprint.

Technical Context

The MCIMX6X1CVO08AC implements a tightly coupled dual-core architecture where the Cortex-A9 runs Linux for HMI and connectivity tasks while the Cortex-M4 executes time-critical firmware (e.g., motor control or sensor fusion) with MPU and FPU support. Its memory subsystem includes 256 KB L2 cache, 128 KB OCRAM, and boot ROM with HABv4 secure boot.

Power management integrates on-die LDOs, DVFS, and hardware-accelerated clock gating across domains. Peripheral routing uses IOMUXC with multiplexed signals - including dedicated pins for ENET1/ENET2, CSI0/CSI1, and eCSPI1–eCSPI5 - constrained by the VO package's signal availability per Table 6.1 of IMX6SXIEC Rev. 4.

Key Specifications

Pinout & Package

MCIMX6X1CVO08AC is housed in a 17×17 mm, 0.8 mm pitch MAPBGA package (package code "VO") with 361 balls. Pin assignments follow the "17x17NP" map defined in Section 6.4 of IMX6SXIEC Rev. 4, excluding PCIe, LVDS, and MLB signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous processor applications.

Compared with MCIMX6X1CVK08AC, MCIMX6X1CVO08AC offers greater signal routing margin and thermal dissipation in space-tolerant industrial enclosures; versus MCIMX6X3CVO08AC, it provides lower BOM cost and simpler power delivery by omitting unused high-speed interfaces.

Availability

MCIMX6X1CVO08AC is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical analyzers, and smart energy gateways requiring stable component supply across extended product lifecycles.

Supply support for MCIMX6X1CVO08AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 6SoloX product line was designed specifically for cost-sensitive industrial and medical edge devices needing Linux-capable processing plus deterministic real-time control - bridging the gap between application processors and microcontrollers.

FAQ

What is the maximum operating frequency of the Cortex-A9 core in MCIMX6X1CVO08AC?

The Cortex-A9 core in MCIMX6X1CVO08AC operates at a fixed maximum frequency of 800 MHz, as specified in Table 1 of the IMX6SXIEC Rev. 4 datasheet. This speed is guaranteed across the full industrial temperature range (−40°C to +105°C) and does not scale beyond 800 MHz even with optimized cooling or voltage tuning. The MCIMX6X1CVO08AC uses mask set 4N19K, which implements this speed grade without requiring external clock dividers or PLL reconfiguration.

Does MCIMX6X1CVO08AC support hardware-accelerated graphics?

No, MCIMX6X1CVO08AC explicitly excludes 2D and 3D GPU functionality as stated in its ordering information row: "Features not supported: - 2D&3D GPU - PCIe - LVDS - MLB". Unlike higher-tier i.MX 6SoloX variants (e.g., MCIMX6X4CVM08AC), this part omits the GC400T graphics engine and associated pixel processing pipeline (PXP), making it unsuitable for OpenGL ES or OpenVG rendering workloads.

What package type and dimensions does MCIMX6X1CVO08AC use?

MCIMX6X1CVO08AC uses a 17×17 mm, 0.8 mm pitch MAPBGA package with 361 solder balls, designated by package code "VO" and labeled "17x17NP" (No PCIe) in NXP documentation. This package is physically and electrically compatible with other i.MX 6SoloX VO variants, enabling drop-in replacement within the same PCB land pattern when feature requirements align.

Can MCIMX6X1CVO08AC boot from NAND flash memory?

Yes, MCIMX6X1CVO08AC supports booting from NAND flash using its GPMI interface with BCH ECC up to 62 bits, as confirmed in Section 1.2 of IMX6SXIEC Rev. 4. It supports raw MLC/SLC NAND with 2 KB, 4 KB, and 8 KB page sizes, and includes boot ROM with HABv4 secure boot - allowing authenticated firmware loading directly from NAND without external boot ROM or SPI flash.

What security features are implemented in MCIMX6X1CVO08AC?

MCIMX6X1CVO08AC includes Arm TrustZone, CAAM cryptographic accelerator (with NIST-certified PRNG and 32 KB secure RAM), SNVS with secure RTC, CSU for fuse-based policy enforcement, and A-HABv4 secure boot supporting SHA-256 and 2048-bit RSA keys. These features are fully enabled and documented in the i.MX 6SoloX Security Reference Manual (IMX6XSRM), and operate identically across all VO-package industrial-grade variants including MCIMX6X1CVO08AC.