NXP Semiconductors MCIMX6X3CVK08AC

Overview

MCIMX6X3CVK08AC from NXP Semiconductors is an industrial-grade heterogeneous applications processor integrating a 800 MHz Arm Cortex-A9 core and a 227 MHz Arm Cortex-M4 core in a single 14×14 mm MAPBGA package with 0.65 mm pitch. It supports DDR3/DDR3L/LPDDR2-800 memory, dual Gigabit Ethernet with AVB, two 12-bit ADCs (4-channel each), and operates across –40°C to +105°C junction temperature. It targets real-time industrial HMI systems requiring concurrent Linux and RTOS execution.

For engineers reviewing the MCIMX6X3CVK08AC datasheet, MCIMX6X3CVK08AC pinout, MCIMX6X3CVK08AC application, or MCIMX6X3CVK08AC equivalent, key selection criteria include its dual-core asymmetric architecture, absence of PCIe/LVDS/MLB interfaces, 14 mm × 14 mm BGA footprint, industrial temperature qualification, and integrated CAAM/TrustZone security for secure boot and cryptographic acceleration.

Technical Context

The MCIMX6X3CVK08AC implements a tightly coupled heterogeneous architecture where the Cortex-A9 handles high-level OS tasks (Linux) while the Cortex-M4 executes deterministic real-time control (e.g., motor sequencing or sensor fusion) without OS interference. Its memory subsystem includes 256 KB L2 cache, 128 KB OCRAM, and 16 KB OCRAM_S for low-latency data retention.

Power management leverages dynamic voltage and frequency scaling (DVFS), integrated LDOs, and hardware-accelerated clock gating across domains. Security is enforced via Arm TrustZone, CAAM (32 KB secure RAM, SHA-256, 2048-bit RSA), SNVS, and A-HABv4 boot authentication - all confirmed active on this industrial-grade variant.

Key Specifications

Pinout & Package

MCIMX6X3CVK08AC is housed in a 14 mm × 14 mm, 0.65 mm pitch MAPBGA package (package code "VK") with 361 I/O balls. Pin assignments follow the i.MX 6SoloX 14×14 NP (No PCIe) signal map per Section 6.5 of IMX6SXIEC Rev. 4. Ball count and mechanical dimensions are fully specified; thermal pad and power ball placement align with NXP's recommended PCB land pattern for industrial thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous applications processor applications.

Compared with MCIMX6X3CVO08AC, the MCIMX6X3CVK08AC trades GPU/PCIe capability for reduced size and cost - ideal for space-constrained HMI. Versus i.MX 8M Nano, it delivers deeper hardware security and proven real-time determinism at lower power, making it preferable for legacy-compatibility and certification-driven designs.

Availability

MCIMX6X3CVK08AC is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical monitors, smart energy gateways, and factory floor controllers requiring stable component supply across long product lifecycles.

Supply support for MCIMX6X3CVK08AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of embedded systems expertise.

The i.MX 6SoloX product line was designed specifically for industrial and medical applications demanding heterogeneous processing, hardware security, and extended temperature operation - with MCIMX6X3CVK08AC optimized for compact, cost-sensitive, dual-core real-time systems.

FAQ

What is the maximum operating frequency of the Cortex-A9 core in MCIMX6X3CVK08AC?

The Cortex-A9 core in MCIMX6X3CVK08AC is rated for up to 800 MHz operation under industrial temperature conditions (–40°C to +105°C). This speed is guaranteed with proper power delivery (VDD_ARM 1.05–1.3 V) and thermal management; actual sustained frequency depends on silicon revision (4N19K mask set) and board-level cooling performance.

Does MCIMX6X3CVK08AC support PCIe or LVDS interfaces?

No, MCIMX6X3CVK08AC explicitly omits PCIe and LVDS functionality as confirmed in Table 1 of the IMX6SXIEC datasheet. These interfaces are disabled in this variant - unlike MCIMX6X3CVO08AC or MCIMX6X3CVN08AC - making it suitable for cost-optimized designs where those features are unnecessary.

How many ADC channels does MCIMX6X3CVK08AC provide, and what is their resolution?

MCIMX6X3CVK08AC integrates two independent 12-bit ADC modules, each with four dedicated single-ended input channels (ADC1_IN0–ADC1_IN3 and ADC2_IN0–ADC2_IN3). No external multiplexer is required to access all eight analog inputs, and full 12-bit linearity is specified across the industrial temperature range.

What security features are active on MCIMX6X3CVK08AC?

MCIMX6X3CVK08AC includes Arm TrustZone, CAAM (with 32 KB secure RAM, SHA-256, 2048-bit RSA), SNVS, CSU, and A-HABv4 secure boot - all enabled and validated for industrial use. These features support secure firmware authentication, encrypted storage, and runtime cryptographic operations without software-only fallbacks.

What package type and dimensions does MCIMX6X3CVK08AC use?

MCIMX6X3CVK08AC uses a 14 mm × 14 mm MAPBGA package with 0.65 mm ball pitch and 361 I/O balls (package code "VK"). This compact footprint is documented in Section 6.5 of IMX6SXIEC Rev. 4 and requires adherence to NXP's recommended land pattern and solder mask design for reliable assembly.