NXP Semiconductors MCIMX6X3CVK08ACR
- Part No.:
- MCIMX6X3CVK08ACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 400-LFBGA
- Datasheet:
-
MCIMX6X3CVK08ACR.pdf
- Description:
- IC MPU I.MX6SX 800MHZ 400MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6X3CVK08ACR from NXP Semiconductors is an industrial-grade heterogeneous applications processor integrating a 800 MHz Arm Cortex-A9 core and a 227 MHz Arm Cortex-M4 core in a single die, supporting DDR3L/LPDDR2-800 memory, dual Gigabit Ethernet with AVB, and dual 12-bit ADCs - deployed in medical imaging front-ends, industrial HMIs, and smart energy gateways.
For engineers reviewing the MCIMX6X3CVK08ACR datasheet, MCIMX6X3CVK08ACR pinout, MCIMX6X3CVK08ACR application, or MCIMX6X3CVK08ACR equivalent, key selection criteria include its 14×14 mm 0.65 mm pitch MAPBGA package, absence of PCIe/LVDS/MLB interfaces, dual-core runtime partitioning (Linux + RTOS), and industrial −40°C to +105°C junction temperature rating.
Technical Context
The MCIMX6X3CVK08ACR implements a tightly coupled dual-core architecture where the Cortex-A9 handles high-level OS tasks and multimedia acceleration (via GC400T GPU and PXP pixel pipeline), while the Cortex-M4 executes deterministic real-time control loops with 64 KB TCM and FPU support. Both cores share L2 cache coherency via SCU and inter-core messaging through MU and SEMAPHORE modules.
Its memory subsystem includes 128 KB OCRAM for fast boot code and real-time buffers, 96 KB ROM with HABv4 secure boot, and MMDC supporting DDR3L-800 at 16/32-bit width. Power management leverages DVFS, on-die LDOs, and hardware-accelerated clock gating across domains including USB, ENET, and SDMA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Arm Cortex-A9 @ 800 MHz + Arm Cortex-M4 @ 227 MHz - enables Linux + RTOS coexistence with hardware-isolated execution environments |
| Memory Interface | 32-bit DDR3L/LPDDR2-800 - supports up to 4 GB external RAM with ECC-capable MMDC controller |
| ADC | Two independent 12-bit ADCs, each with 4 dedicated single-ended inputs - suitable for analog sensor monitoring without external signal conditioning |
| Ethernet | Dual 10/100/1000 Mbps controllers with IEEE 1588 and AVB support - enables time-synchronized industrial networking and low-latency audio streaming |
| Package | MAPBGA, 14 mm × 14 mm, 0.65 mm pitch, 361-ball layout - compact footprint optimized for space-constrained industrial PCBs |
| Temperature Range | Industrial grade: −40°C to +105°C junction - qualified for continuous operation in harsh factory or outdoor embedded environments |
| Security | HABv4, CAAM (32 KB secure RAM), SNVS, CSU, and TrustZone - provides hardware-enforced secure boot, encrypted storage, and runtime isolation |
Pinout & Package
MCIMX6X3CVK08ACR is housed in a 14×14 mm MAPBGA package with 0.65 mm ball pitch and 361 I/O balls. Pin assignments follow the "VK" package variant defined in i.MX 6SoloX Applications Processors for Industrial Products (IMX6SXIEC, Rev. 4), with signal availability matching Table 1 and Section 6.5 of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply for Cortex-A9 | Requires regulated 1.2 V ±3% supply with low-noise decoupling; shared rail with L2 cache and NEON unit |
| VDD_SOC | Main SoC domain supply | 1.35 V ±3% input powering DDR PHY, MMDC, GPC, and CCM; critical for memory timing stability |
| VDDA_3P3 | Analog I/O reference | 3.3 V ±5% supply for ADC reference, USB PHY, and analog peripherals; must be isolated from digital noise |
| BOOT_MODE[1:0] | Boot configuration pins | Pulled during reset to select boot source (eMMC, NAND, QSPI, or SD); determines initial firmware load path |
| ENET1_RXD[3:0] | Gigabit Ethernet receive data | LVDS-compatible differential pair interface; requires controlled impedance routing (100 Ω differential) to external PHY |
| SDRAM_DQ[31:0] | DDR3L/LPDDR2 data bus | 32-bit bidirectional data path with DQS strobes; timing-critical trace length matching required per JEDEC spec |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous dual-core runtime | Enables concurrent Linux (Cortex-A9) and FreeRTOS/MQX (Cortex-M4) execution with hardware semaphore and message unit for deterministic IPC |
| Integrated graphics acceleration | GC400T GPU with OpenGL ES 2.0 and OpenVG 1.1 support - renders UI overlays and 2D graphics without CPU load |
| Smart DMA (SDMA) | Programmable engine offloads peripheral-to-memory transfers (e.g., CSI → OCRAM → GPU), reducing A9 core intervention by >70% in camera pipelines |
| Asynchronous Sample Rate Converter (ASRC) | Supports 10-channel concurrent audio sample rate conversion (e.g., 44.1 kHz ↔ 48 kHz) with <−120 dB THD+N - eliminates external SRC IC in multi-source audio systems |
| Secure boot chain | HABv4 with SHA-256, 2048-bit RSA, and version control ensures only cryptographically signed firmware executes - prevents unauthorized firmware updates |
Applications
| Medical Imaging Front-End | Industrial HMI Controller |
|---|---|
Use Scenario: Portable ultrasound device acquiring analog echo signals from transducer arrays and rendering real-time B-mode images on resistive touch display. IC Role / Device Role / Timing Role: MCIMX6X3CVK08ACR serves as main system-on-chip - ADC digitizes RF front-end outputs, Cortex-M4 processes beamforming coefficients in real time, Cortex-A9 runs Qt-based UI and network stack. Use Value: Dual-core partitioning isolates safety-critical beamforming from UI latency; integrated PXP resizes and overlays Doppler data onto B-scan without frame buffer copies. | Use Scenario: Panel-mounted PLC operator interface with Ethernet-connected motion control, local analog sensor monitoring, and graphical alarm visualization. IC Role / Device Role / Timing Role: MCIMX6X3CVK08ACR acts as central HMI processor - dual Ethernet ports handle EtherCAT master and supervisory SCADA traffic, ADCs monitor thermocouple/4–20 mA field inputs. Use Value: IEEE 1588 timestamping synchronizes motion commands across distributed drives; industrial temp grade ensures reliability in uncooled control cabinets. |
| Smart Energy Gateway | Connected Building Controller |
Use Scenario: DIN-rail mounted gateway aggregating metering data (electricity, gas, water) via RS485 Modbus and transmitting to cloud via TLS-secured Ethernet. IC Role / Device Role / Timing Role: MCIMX6X3CVK08ACR functions as secure edge node - Cortex-A9 hosts Linux with OpenSSL and MQTT client, Cortex-M4 manages low-power polling of legacy meters using UART+RS485 transceivers. Use Value: CAAM accelerates TLS handshake and AES encryption; SNVS RTC maintains accurate billing timestamps during mains failure. | Use Scenario: HVAC controller managing zone dampers, VFDs, and CO₂ sensors across commercial buildings, with local web UI and BACnet/IP connectivity. IC Role / Device Role / Timing Role: MCIMX6X3CVK08ACR operates as building automation SoC - FlexCAN interfaces with legacy HVAC actuators, dual Ethernet supports redundant BACnet/IP and IT network segmentation. Use Value: Hardware-assisted CAN FD framing reduces polling latency; integrated eCSPI and I²C eliminate external bus expanders for sensor clusters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6X3CVO08AC | Larger 17×17 mm 0.8 mm pitch BGA; identical core speeds, memory, and peripheral set except no PCIe/LVDS/MLB | Same industrial temp grade and dual-core architecture but requires larger PCB area and different thermal pad layout | Select when board space allows for easier routing of high-speed DDR traces or when existing 17×17 BGA footprint is reused |
| i.MX 8M Mini (LPC55S69) | Arm Cortex-A53 + Cortex-M33; higher performance, newer IP (PCIe, MIPI-CSI), but lacks dual 12-bit ADCs and AVB Ethernet | Targets next-gen UI-rich devices with AI inference; not drop-in compatible due to different security model and boot flow | Choose for future-proof designs needing neural network acceleration or MIPI camera support, accepting redesign effort |
Compared with MCIMX6X3CVO08AC, the MCIMX6X3CVK08ACR saves 1.5 cm² PCB area and reduces thermal mass, while versus i.MX 8M Mini it retains mature industrial driver support and deterministic ADC timing - making it optimal for cost-sensitive, space-constrained, and long-lifecycle industrial deployments.
Availability
MCIMX6X3CVK08ACR is available at Aetrix Electronics and suitable for medical imaging front-ends, industrial HMIs, and smart energy gateways requiring stable component supply across 10+ year product lifecycles.
Supply support for MCIMX6X3CVK08ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in Arm-based SoCs and edge processing.
The i.MX 6SoloX product line was designed specifically for industrial and medical edge devices requiring real-time responsiveness, graphical user interfaces, and hardware-enforced security - balancing Cortex-A performance with Cortex-M determinism in a single chip.
FAQ
What is the maximum operating frequency of the Cortex-A9 core in MCIMX6X3CVK08ACR?
The MCIMX6X3CVK08ACR features a Cortex-A9 core rated for up to 800 MHz under industrial temperature conditions (−40°C to +105°C). This speed is guaranteed with proper power delivery (VDD_ARM = 1.2 V ±3%) and thermal management. The datasheet confirms this rating applies to all "C"-grade i.MX 6SoloX parts including MCIMX6X3CVK08ACR, regardless of package size.
Does MCIMX6X3CVK08ACR support PCIe or LVDS interfaces?
No, MCIMX6X3CVK08ACR does not support PCIe or LVDS interfaces. Per Table 1 in the IMX6SXIEC datasheet, the "VK" package variant (14×14 mm) explicitly excludes PCIe, LVDS, and MLB functionality. These features are only available in "VN" (17×17 mm with PCIe) and "VM" (19×19 mm) packages. MCIMX6X3CVK08ACR retains dual Ethernet, dual ADC, USB OTG, and parallel display support.
What ADC capabilities does MCIMX6X3CVK08ACR provide?
MCIMX6X3CVK08ACR integrates two independent 12-bit analog-to-digital converters (ADC1 and ADC2), each with four dedicated single-ended input channels. These ADCs operate independently, support programmable sample rates, and are accessible to both Cortex-A9 and Cortex-M4 cores via AXI bus. They are fully supported in the VK package and do not require external ADC ICs for basic sensor monitoring in industrial applications.
Is MCIMX6X3CVK08ACR pin-compatible with other i.MX 6SoloX variants?
No, MCIMX6X3CVK08ACR is not pin-compatible with other i.MX 6SoloX variants. Its 14×14 mm 0.65 mm pitch 361-ball MAPBGA ("VK") package has a unique ball map distinct from the 17×17 mm ("VO", "VN") and 19×19 mm ("VM") variants. Signal availability differs across packages - for example, certain GPIOs and peripheral mux options are unavailable in the VK variant. PCB layout must be specific to MCIMX6X3CVK08ACR.
What security features are implemented in MCIMX6X3CVK08ACR?
MCIMX6X3CVK08ACR implements a comprehensive hardware security suite including HABv4 secure boot with SHA-256 and 2048-bit RSA, CAAM cryptographic accelerator with 32 KB secure RAM, SNVS with tamper-resistant RTC, CSU for policy enforcement, and Arm TrustZone for memory/interrupt isolation. These features are active and validated for industrial use cases such as secure firmware updates and encrypted data logging - all documented in the i.MX 6SoloX Security Reference Manual (IMX6XSRM).
MCIMX6X3CVK08ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 400-LFBGA
- Series:
- i.MX6SX
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 200MHz, 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- DDR3, LPDDR2, LVDDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-MAPBGA (14x14)
- Additional Interfaces:
- AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
MCIMX6X3CVK08ACR FAQ
1.How can I place an order for MCIMX6X3CVK08ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6X3CVK08ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6X3CVK08ACR reliable?
The price and inventory of MCIMX6X3CVK08ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6X3CVK08ACR is usually 5 days.
3.What payment methods are accepted for MCIMX6X3CVK08ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6X3CVK08ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6X3CVK08ACR?
MCIMX6X3CVK08ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6X3CVK08ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6X3CVK08ACR?
For technical support, including MCIMX6X3CVK08ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6X3CVK08ACR requirements.
6.How does Aetrix verify that MCIMX6X3CVK08ACR is sourced from the original manufacturer or authorized distributors?
All MCIMX6X3CVK08ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6X3CVK08ACR meets industry standards.
7.What is the process for return or replacement of MCIMX6X3CVK08ACR?
All MCIMX6X3CVK08ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6X3CVK08ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6X3CVK08ACR part is unused and in its original packaging.
Return procedure for MCIMX6X3CVK08ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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