NXP Semiconductors MCIMX6X3CVN08AB
- Part No.:
- MCIMX6X3CVN08AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 400-LFBGA
- Datasheet:
-
MCIMX6X3CVN08AB.pdf
- Description:
- IC MPU I.MX6SX 800MHZ 400MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,351
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6X3CVN08AB from NXP Semiconductors (formerly Freescale) is a single-core ARM Cortex-A9 application processor operating at 1.0 GHz, featuring 512 KB L2 cache, Vivante GC880 3D GPU (53 Mtri/s), hardware-accelerated 1080p30 video decode, and integrated EPD controller for e-paper displays. It targets cost-optimized, power-sensitive embedded HMI applications including smart energy meters and monochrome eReaders.
For engineers reviewing the MCIMX6X3CVN08AB datasheet, MCIMX6X3CVN08AB pinout, MCIMX6X3CVN08AB application, or MCIMX6X3CVN08AB equivalent, key selection criteria include its 1 GHz Cortex-A9 core frequency, 32-bit DDR3/LPDDR2 interface at 400 MHz, EPD controller integration, Vivante GC880 GPU performance, and automotive-grade qualification (AEC-Q100).
Technical Context
The MCIMX6X3CVN08AB implements a single ARM Cortex-A9 CPU core with Neon, VFPv4, and TrustZone security extensions, paired with 512 KB of shared L2 cache and 32 KB + 32 KB I/D L1 cache. It integrates dedicated hardware accelerators including a Video Processing Unit (VPU) supporting H.264/VC1/MPEG-4 decode up to 1080p30, an Image Processing Unit (IPU), and an EPD controller for waveform-driven e-ink display driving.
Its memory subsystem supports one channel of 32-bit DDR3 or LPDDR2 at 400 MHz (800 MT/s), delivering up to ~1.6 GB/s bandwidth. Peripheral integration includes 1× Gigabit Ethernet (limited to 480 Mbps), 4× USB 2.0 HS (1× OTG + 1× Host + 2× HSIC), 2× FlexCAN, 5× UART, 4× SPI, 4× I²C, 3× SD/MMC 4.4, MIPI-CSI2/DSI, HDMI 1.4a, LVDS, and parallel RGB interfaces - all mapped to a 21×21 mm FCBGA package with 0.8 mm pitch.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single ARM Cortex-A9 @ 1.0 GHz - delivers 2400 DMIPS for real-time UI rendering and middleware execution in resource-constrained devices. |
| L2 Cache | 512 KB - reduces memory latency and improves instruction/data throughput for deterministic HMI response. |
| GPU | Vivante GC880: 53 Mtri/s, OpenGL ES 1.1/2.0/3.0 - enables smooth 2D/3D graphics for touch-enabled dashboards and e-reader UIs. |
| Video Decode | H.264 HP, VC1, MPEG-4 up to 1080p30 - offloads CPU for local media playback without external codec ICs. |
| EPD Controller | Integrated E Ink® display controller - eliminates need for external timing/segment drivers in battery-powered e-paper terminals. |
| Memory Interface | 32-bit DDR3/LPDDR2 @ 400 MHz (800 MT/s) - balances bandwidth and power for low-cost, low-power embedded systems. |
| Package | 21×21 mm FCBGA, 0.8 mm pitch, 364-ball - compatible with i.MX 6DualLite/Solo footprint for scalable board reuse. |
| Qualification | AEC-Q100 Grade 3 (−40°C to +105°C) - certified for automotive infotainment head units and industrial HMIs requiring extended temperature operation. |
Pinout & Package
MCIMX6X3CVN08AB uses a 21×21 mm Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 364 solder balls and 0.8 mm pitch. The package is lidded for enhanced thermal and mechanical robustness in automotive and industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.1–1.3 V supply for Cortex-A9 core; requires tight regulation and low-noise filtering for stable 1 GHz operation. |
| VDD_SOC | SoC Logic & I/O Power | 1.2–1.35 V supply powering GPU, VPU, IPU, and digital peripherals; decoupling critical for video/audio integrity. |
| VDD_DDR | DDR Memory Interface Supply | 1.35–1.5 V supply for DDR3/LPDDR2 interface; must meet JEDEC timing specs for reliable 800 MT/s operation. |
| CLK_24M | 24 MHz Reference Clock Input | Primary crystal oscillator input for system clock generation; required for boot ROM initialization and PLL lock. |
| BOOT_MODE[1:0] | Boot Configuration Pins | Strapped at reset to select boot source (eMMC, NAND, SPI NOR, or USB); determines initial firmware load path. |
| EPDC_DATA[7:0] | E-Paper Display Data Bus | 8-bit parallel interface to E Ink® display panel; driven by integrated EPD controller with programmable waveform engine. |
| ENET_RXD[3:0] | Gigabit Ethernet Receive Data | 4-bit RMII/GMII receive bus; supports 10/100/1000 Mbps Ethernet with IEEE 1588 timestamping capability. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated EPD Controller | Direct drive of E Ink® displays with programmable waveform engine - eliminates external display timing IC and reduces BOM count by ≥3 components. |
| Hardware Video Decode | 1080p30 H.264/VC1/MPEG-4 decode in <350 mW - enables local video playback in battery-operated HMIs without thermal throttling. |
| TrustZone Security | ARM TrustZone + HAB (High Assurance Boot) + NIST-approved RNG - provides secure boot chain and isolated execution environment for payment or credential applications. |
| Scalable Pin Compatibility | Pin-to-pin compatible with MCIMX6Y2/6Y3/6Y4 series (i.MX 6DualLite/Solo) - allows single PCB design across performance tiers with software-defined feature enablement. |
| Automotive Qualification | AEC-Q100 Grade 3 qualified - validated for 10-year life cycle at 10% duty cycle in −40°C to +105°C ambient - suitable for dashboard clusters and telematics gateways. |
Applications
| Smart Energy Meter | Monochrome eReader |
|---|---|
|
Use Scenario: Utility-grade electricity meter with tamper-resistant display, remote firmware update, and time-of-use tariff calculation. IC Role / Device Role / Timing Role: Main application processor executing metering firmware, managing secure OTA updates via CAN/Ethernet, and driving segmented or E Ink® display. Use Value: Integrated EPD controller and AEC-Q100 qualification ensure long-term reliability in unattended outdoor installations with zero display power draw between updates. |
Use Scenario: Battery-powered, sunlight-readable e-book reader with PDF rendering, annotation, and Wi-Fi sync. IC Role / Device Role / Timing Role: Primary SoC handling UI rendering, document parsing, flash storage management, and low-power EPD refresh scheduling. Use Value: 1.0 GHz Cortex-A9 + GC880 GPU enables fast page turns and smooth zoom/pan on high-resolution e-paper panels while maintaining >1 month battery life. |
| Automotive Instrument Cluster | Industrial HMI Panel |
|
Use Scenario: Digital gauge cluster with analog-style speedometer, warning indicators, and ADAS status overlays. IC Role / Device Role / Timing Role: Real-time graphics processor rendering vector-based gauges, blending safety-critical CAN messages with non-critical infotainment data. Use Value: AEC-Q100 qualification and dual-display support (LVDS + HDMI) allow simultaneous analog instrument rendering and rear-seat entertainment output. |
Use Scenario: Factory-floor operator terminal with touch interface, barcode scanning, and PLC communication. IC Role / Device Role / Timing Role: Central controller interfacing with RS-485/Modbus, USB barcode scanners, capacitive touch overlay, and 7"–10" LCD. Use Value: 4× USB 2.0 HS (including HSIC), 2× FlexCAN, and 5× UART provide native connectivity to legacy industrial peripherals without bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Y2CVK08AB | Same 1 GHz Cortex-A9 core, but with 256 KB L2 cache and no EPD controller; lower GPU (GC355 only); consumer temp grade (−20°C to +105°C). | Targeted at cost-sensitive consumer tablets and IP phones where e-paper is not required and automotive qualification is unnecessary. | Select MCIMX6Y2CVK08AB only if EPD support and AEC-Q100 are not needed - reduces cost but forfeits e-reader and automotive use cases. |
| MCIMX6U5DVM08AB | Dual-core Cortex-A9 @ 1.0 GHz, 512 KB L2, GC2000 GPU (176 Mtri/s), dual-channel 64-bit DDR3 @ 533 MHz, AEC-Q100 Grade 3. | Designed for higher-performance automotive infotainment and multi-display HMIs requiring concurrent video playback and rich UI rendering. | Choose MCIMX6U5DVM08AB when dual-core processing, 2× GPU performance, or dual-display bandwidth exceeds MCIMX6X3CVN08AB capabilities - requires PCB redesign due to larger 21×21 mm footprint with different ball map. |
Compared with MCIMX6X3CVN08AB, MCIMX6Y2CVK08AB offers lower cost and power but lacks EPD control and automotive qualification, while MCIMX6U5DVM08AB delivers 2× CPU throughput and 3.3× GPU performance at the expense of higher power and layout complexity - making MCIMX6X3CVN08AB optimal for single-display, e-paper, or thermally constrained automotive/industrial HMIs.
Availability
MCIMX6X3CVN08AB is available at Aetrix Electronics and suitable for smart energy meters, monochrome eReaders, automotive instrument clusters, and industrial HMI panels requiring stable component supply across 10+ year production lifecycles.
Supply support for MCIMX6X3CVN08AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in ARM-based application processors and edge AI acceleration.
The i.MX 6 series - including MCIMX6X3CVN08AB - was designed to deliver scalable, power-efficient application processing for human-machine interfaces in automotive dashboards, smart meters, and portable industrial terminals, emphasizing long-term availability and functional safety readiness.
FAQ
What is the maximum supported DDR3 speed for MCIMX6X3CVN08AB?
The MCIMX6X3CVN08AB supports DDR3 and LPDDR2 memory at up to 400 MHz (800 MT/s) on a single 32-bit channel. This delivers approximately 1.6 GB/s peak bandwidth, sufficient for 1080p video decode and responsive GUI rendering in cost-optimized designs. Higher speeds are not supported per the i.MX 6Solo electrical specifications.
Does MCIMX6X3CVN08AB include hardware video encoding capability?
No, MCIMX6X3CVN08AB does not include hardware video encoding. Its Video Processing Unit (VPU) supports only decode functions - H.264, VC1, MPEG-4, VP8, and MJPEG up to 1080p30. Encoding must be performed in software using the Cortex-A9 core, limiting real-time encode to sub-D1 resolutions at acceptable frame rates.
Is MCIMX6X3CVN08AB pin-compatible with other i.MX 6 Solo variants?
Yes, MCIMX6X3CVN08AB is pin-compatible with MCIMX6Y2CVK08AB and MCIMX6Y3CVK08AB (i.MX 6Solo consumer-grade variants) and shares the same 21×21 mm FCBGA-364 package footprint. However, it is not pin-compatible with i.MX 6DualLite or i.MX 6Quad due to differing peripheral mappings and power rail requirements.
What operating systems are officially supported on MCIMX6X3CVN08AB?
NXP provides official BSP support for Linux (kernel 3.0.35 and later), Android Jelly Bean 4.2.2 and Ice Cream Sandwich 4.0.4, and Windows Embedded Compact 2013. All releases include optimized GPU drivers for Vivante GC880, VPU codecs, EPD controller support, and power management hooks for automotive thermal profiles.
What is the purpose of the EPD controller integrated into MCIMX6X3CVN08AB?
The integrated EPD (Electrophoretic Display) controller in MCIMX6X3CVN08AB directly drives E Ink® displays using programmable waveform tables, eliminating external timing generators and reducing system power to near-zero during static image display. It supports partial refresh, temperature compensation, and multiple waveform modes for optimal contrast and ghosting reduction in battery-powered e-readers and smart labels.
MCIMX6X3CVN08AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 400-LFBGA
- Series:
- i.MX6SX
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 200MHz, 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-MAPBGA (17x17)
- Additional Interfaces:
- AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
MCIMX6X3CVN08AB FAQ
1.How can I place an order for MCIMX6X3CVN08AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6X3CVN08AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6X3CVN08AB reliable?
The price and inventory of MCIMX6X3CVN08AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6X3CVN08AB is usually 5 days.
3.What payment methods are accepted for MCIMX6X3CVN08AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6X3CVN08AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6X3CVN08AB?
MCIMX6X3CVN08AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6X3CVN08AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6X3CVN08AB?
For technical support, including MCIMX6X3CVN08AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6X3CVN08AB requirements.
6.How does Aetrix verify that MCIMX6X3CVN08AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6X3CVN08AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6X3CVN08AB meets industry standards.
7.What is the process for return or replacement of MCIMX6X3CVN08AB?
All MCIMX6X3CVN08AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6X3CVN08AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6X3CVN08AB part is unused and in its original packaging.
Return procedure for MCIMX6X3CVN08AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6X3CVN08AB Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

