NXP Semiconductors MCIMX6X3EVN10AB
- Part No.:
- MCIMX6X3EVN10AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 400-LFBGA
- Datasheet:
-
MCIMX6X3EVN10AB.pdf
- Description:
- IC MPU 227MHZ/1GHZ 400MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:138
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Product details
Overview
MCIMX6X3EVN10AB from NXP Semiconductors (formerly Freescale) is a heterogeneous dual-core application processor integrating one ARM Cortex-A9 core running at 1 GHz and one ARM Cortex-M4 core running at 227 MHz, housed in a 17×17 mm, 0.8 mm pitch BGA package with PCIe support. It delivers integrated 2D/3D graphics acceleration (GC400T), dual Gigabit Ethernet with AVB/IEEE 1588 support, and hardware security (CAAM, SNVS, TrustZone), targeting HMI-rich connected devices operating across –20°C to +105°C.
For engineers reviewing the MCIMX6X3EVN10AB datasheet, MCIMX6X3EVN10AB pinout, MCIMX6X3EVN10AB application, or MCIMX6X3EVN10AB equivalent, key selection considerations include PCIe v2.0 x1 capability, absence of LVDS and video ADC interfaces, extended commercial temperature rating, and verified boot via A-HABv4 with SHA-256 and 2048-bit RSA.
Technical Context
The MCIMX6X3EVN10AB implements a tightly coupled asymmetric multiprocessing architecture: the Cortex-A9 handles Linux-based application workloads while the Cortex-M4 executes real-time tasks (e.g., sensor fusion, motor control) with deterministic latency, enabled by 64 KB TCM and MPU isolation. Memory coherency is maintained via SCU and 256 KB L2 cache shared between cores.
Its system-level integration includes dual ENET controllers with AVB timestamping, two FlexCAN 2.0B ports (1 Mbps), four eCSPI interfaces (52 Mbit/s), and a GPMI NAND controller with up to 62-bit BCH ECC-enabling robust storage in industrial edge gateways without external ECC logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | ARM Cortex-A9 @ 1 GHz + ARM Cortex-M4 @ 227 MHz - Enables concurrent Linux OS and RTOS execution on separate domains. |
| Memory Interface | 32-bit DDR3/LVDDR3/LPDDR2-800 - Supports up to 2 GB external RAM with low-latency access for multimedia buffering. |
| Graphics Engine | GC400T GPU - Delivers OpenGL ES 2.0 and OpenVG 1.1 acceleration for smooth UI rendering on WXGA displays. |
| Connectivity | 2× Gigabit Ethernet w/ AVB & IEEE 1588, 2× FlexCAN, PCIe v2.0 x1 - Enables time-synchronized audio/video streaming and automotive-grade CAN communication in a single SoC. |
| Security | CAAM (32 KB secure RAM), SNVS, A-HABv4 (SHA-256, 2048-bit RSA), TrustZone - Provides hardware-rooted secure boot, encrypted storage, and runtime integrity verification. |
| Package | 17×17 mm BGA, 0.8 mm pitch, 364-ball - Matches standard PCB assembly processes; supports thermal dissipation up to 1.8 W typical power envelope. |
| Temperature Range | –20°C to +105°C junction - Qualified for extended commercial operation in enclosed industrial enclosures without active cooling. |
Pinout & Package
MCIMX6X3EVN10AB is packaged in a 17×17 mm, 0.8 mm pitch plastic BGA with 364 I/O balls. Pin assignments follow the "VN" package code mapping defined in Section 6.3 of IMX6SXCEC Rev. 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ENET1_TXD[3:0] | Gigabit Ethernet 1 Transmit Data | Drives 4-bit parallel TX data at 125 MHz; requires controlled impedance routing (100 Ω differential) to PHY. |
| PCIe_RXP/PCIe_RXN | PCIe v2.0 Differential Receive Pair | Accepts 5.0 GT/s serial data; must be routed as 100 Ω differential pair with ≤5 mil skew for signal integrity. |
| VDD_ARM_SOC | Cortex-A9 Core Power Supply | Requires dedicated 1.2 V ±3% LDO with ≤10 mV ripple; decoupled using 10 µF + 100 nF ceramics near ball. |
| BOOT_MODE[1:0] | Boot Configuration Strap Pins | Pulled high/low at reset to select boot source (eMMC, NAND, SPI NOR); internal weak pull-ups active if unconnected. |
| USB_OTG1_DP/USB_OTG1_DM | USB 2.0 OTG Differential Data Pair | Supports host/device mode; requires 90 Ω differential impedance and ESD protection per USB-IF spec. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Dual-Core Architecture | Enables Linux + RTOS coexistence: Cortex-A9 runs GUI stack and network services; Cortex-M4 handles real-time I/O control with <1 µs interrupt latency. |
| Hardware Security Subsystem | CAAM accelerates AES-128/256, SHA-256, and RSA-2048; SNVS provides tamper-resistant RTC and secure key storage-eliminates need for external secure element in medical HMI designs. |
| PCIe v2.0 x1 Interface | Allows direct attachment of Wi-Fi 5 (802.11ac) modules or FPGA co-processors without bridge ICs-reducing BOM cost and board area in gateway applications. |
| Dual AVB-Ethernet Controllers | Supports synchronized audio/video streaming with sub-1 µs clock synchronization across networks-critical for IP phone and smart speaker reference designs. |
| Integrated PXP Pixel Pipeline | Performs real-time image scaling, rotation, and color space conversion (RGB↔YUV) offloading CPU/GPU-enables 720p camera preview at 30 fps with <5% CPU utilization. |
Applications
| Industrial HMI Gateway | Smart Audio Endpoint |
|---|---|
|
Use Scenario: Edge gateway aggregating Modbus RTU sensors, displaying status on 7-inch resistive touchscreen, and streaming diagnostics over Ethernet. IC Role / Device Role / Timing Role: MCIMX6X3EVN10AB serves as main application processor executing Qt-based UI, managing dual Ethernet for fieldbus-to-IP bridging, and handling real-time CAN messaging via Cortex-M4. Use Value: Eliminates need for discrete Ethernet PHY, CAN transceiver, and GPU-reducing component count by 7+ parts while maintaining –20°C to +105°C operation in factory-floor cabinets. |
Use Scenario: Voice-controlled smart speaker with far-field microphone array, local speech processing, and synchronized multi-room audio playback. IC Role / Device Role / Timing Role: MCIMX6X3EVN10AB hosts Linux audio framework (ALSA/PulseAudio), runs ASRC for sample-rate conversion between mic array and DAC, and synchronizes playback across devices via AVB timestamps. Use Value: Integrated ASRC supports 10-channel concurrent resampling at –120 dB THD+N; dual Ethernet enables precise inter-speaker timing without external timing master. |
| Secure Access Control Panel | Portable Medical Monitor |
|
Use Scenario: Wall-mounted biometric access panel performing fingerprint matching, RFID card validation, and door lock actuation with audit logging. IC Role / Device Role / Timing Role: MCIMX6X3EVN10AB executes secure boot (A-HABv4), isolates biometric algorithms in TrustZone-protected memory, and uses CAAM for AES-256 encryption of log entries stored in eMMC. Use Value: Hardware-accelerated crypto reduces authentication latency to <80 ms; SNVS-backed RTC ensures tamper-proof time-stamping of all access events. |
Use Scenario: Battery-powered patient monitor acquiring ECG, SpO₂, and temperature, displaying waveforms locally, and transmitting alerts via cellular modem. IC Role / Device Role / Timing Role: MCIMX6X3EVN10AB runs FreeRTOS on Cortex-M4 for sensor acquisition and alarm triggering, while Cortex-A9 renders waveform UI and manages LTE modem interface via USB OTG. Use Value: Smart speed technology and DVFS enable 12-hour battery life; integrated ADC (12-bit, 4-channel) eliminates external analog front-end for basic vitals monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| i.MX 6SoloX MCIMX6X4EVM10AB | Larger 19×19 mm BGA (0.8 mm pitch), supports LVDS and video ADC; same dual-core speeds and security features. | Required for designs needing LVDS display output or analog NTSC/PAL video capture-adds 2.5 mm² PCB area and higher thermal budget. | Select when display interface flexibility outweighs size/cost constraints; not drop-in compatible due to different ball map and thermal pad. |
| i.MX 8M Mini EVK8MM15ADC | Quad Cortex-A53 + Cortex-M4, 1.8 GHz A53, 2 GB LPDDR4, MIPI-CSI/DSI, no PCIe; newer 14 nm process, lower power. | Better suited for AI inference (NN accelerator), higher-resolution displays, and Android-based UIs-but lacks PCIe and has different security model (HABv4 vs. HABv4.2). | Choose for next-gen designs prioritizing ML inference or Android compatibility; migration requires full hardware redesign and software revalidation. |
Compared with MCIMX6X3EVN10AB, the MCIMX6X4EVM10AB adds LVDS and video ADC at the cost of larger footprint and layout rework, while the i.MX 8M Mini offers higher performance and modern interfaces but abandons PCIe and introduces significant software porting effort.
Availability
MCIMX6X3EVN10AB is available at Aetrix Electronics and suitable for industrial HMI gateways, smart audio endpoints, secure access control panels, and portable medical monitors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCIMX6X3EVN10AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's i.MX processor lineage.
The i.MX 6SoloX product line was engineered to deliver heterogeneous compute for resource-constrained connected devices-balancing Linux-capable application processing with real-time responsiveness and hardware security in a single die.
FAQ
What is the maximum operating frequency of the Cortex-A9 core in MCIMX6X3EVN10AB?
The MCIMX6X3EVN10AB features an ARM Cortex-A9 core rated for operation at up to 1 GHz under extended commercial conditions (–20°C to +105°C). This speed assumes use of a 24 MHz crystal input and compliance with voltage and thermal specifications outlined in Section 4.1 of the IMX6SXCEC datasheet. The actual sustained frequency depends on thermal management and power delivery stability.
Does MCIMX6X3EVN10AB support PCIe Gen2, and what is its lane configuration?
Yes, MCIMX6X3EVN10AB integrates a PCIe v2.0 controller supporting x1 lane configuration in either Root Complex or Endpoint mode. It achieves 5.0 GT/s signaling rates and complies with PCI Express Base Specification Revision 2.0. The interface uses dedicated differential pairs (PCIe_RXP/N and PCIe_TXP/N) mapped to specific BGA balls per the VN package layout in Section 6.3 of IMX6SXCEC.
Which display interfaces are enabled on MCIMX6X3EVN10AB?
MCIMX6X3EVN10AB supports one parallel 24-bit LCD interface (LCDIF) capable of driving WXGA (1280×800) displays at 60 Hz. It does not support LVDS or HDMI output-those features are disabled per the "Features not supported" list in Table 1 of IMX6SXCEC. Display output must be implemented via RGB TTL or custom bridge ICs for LVDS conversion.
What hardware security features are integrated into MCIMX6X3EVN10AB?
MCIMX6X3EVN10AB includes CAAM (Cryptographic Acceleration and Assurance Module) with AES-128/256, SHA-256, and RSA-2048 acceleration; SNVS (Secure Non-Volatile Storage) with tamper-resistant RTC; A-HABv4 for secure boot using SHA-256 and 2048-bit RSA keys; and ARM TrustZone for memory and interrupt isolation. These features are fully functional and documented in the i.MX 6SoloX Security Reference Manual (IMX6XSRM).
Is MCIMX6X3EVN10AB pin-compatible with other i.MX 6SoloX variants like MCIMX6X1EVK10AB?
No, MCIMX6X3EVN10AB is not pin-compatible with MCIMX6X1EVK10AB. They use different package codes ("VN" vs. "VK"), differing in size (17×17 mm vs. 14×14 mm), ball count (364 vs. 289), and pin mapping. Even within the same package family, variant-specific signal disablements (e.g., PCIe presence) affect ball functionality-requiring unique PCB layouts for each part number.
MCIMX6X3EVN10AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 400-LFBGA
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 227MHz, 1GHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- DDR3, DDR3L, LPDDR2
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-MAPBGA (14x14)
- Additional Interfaces:
- CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
MCIMX6X3EVN10AB FAQ
1.How can I place an order for MCIMX6X3EVN10AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6X3EVN10AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6X3EVN10AB reliable?
The price and inventory of MCIMX6X3EVN10AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6X3EVN10AB is usually 5 days.
3.What payment methods are accepted for MCIMX6X3EVN10AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6X3EVN10AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6X3EVN10AB?
MCIMX6X3EVN10AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6X3EVN10AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6X3EVN10AB?
For technical support, including MCIMX6X3EVN10AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6X3EVN10AB requirements.
6.How does Aetrix verify that MCIMX6X3EVN10AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6X3EVN10AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6X3EVN10AB meets industry standards.
7.What is the process for return or replacement of MCIMX6X3EVN10AB?
All MCIMX6X3EVN10AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6X3EVN10AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6X3EVN10AB part is unused and in its original packaging.
Return procedure for MCIMX6X3EVN10AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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