NXP Semiconductors MCIMX6X3EVO10AC
- Part No.:
- MCIMX6X3EVO10AC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 400-LFBGA
- Datasheet:
-
MCIMX6X3EVO10AC.pdf
- Description:
- IC MPU I.MX6SX 1GHZ 400MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6X3EVO10AC from NXP Semiconductors is an i.MX 6SoloX heterogeneous applications processor integrating a 1 GHz Arm Cortex-A9 core and a 227 MHz Arm Cortex-M4 core in a single die, supporting DDR3/DDR3L/LPDDR2-800 memory, dual Gigabit Ethernet with AVB, and dual 12-bit ADCs. It targets HMI-rich connected devices operating across -20°C to +105°C junction temperature.
For engineers reviewing the MCIMX6X3EVO10AC datasheet, MCIMX6X3EVO10AC pinout, MCIMX6X3EVO10AC application, or MCIMX6X3EVO10AC equivalent, key selection criteria include its 17×17 mm 0.8 mm pitch BGA package (VO code), PCIe-disabled configuration, absence of LVDS and MLB interfaces, and extended commercial qualification tier for industrial HMI and smart appliance designs.
Technical Context
The MCIMX6X3EVO10AC implements a tightly coupled dual-core architecture where the Cortex-A9 runs Linux-based UI stacks while the Cortex-M4 handles real-time sensor processing and power management tasks-enabling deterministic response without OS interference. Its memory subsystem includes 256 KB L2 cache, 128 KB OCRAM, and boot ROM with HABv4 secure boot.
It integrates dedicated hardware accelerators including GC400T 2D/3D GPU (OpenGL ES 2.0), PXP pixel pipeline, ASRC audio sample rate converter, and CAAM cryptographic engine with 32 KB secure RAM. Power management relies on integrated LDOs, DVFS, and software-controlled power gating for both CPU cores and NEON coprocessor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Heterogeneous dual-core: 1 GHz Arm Cortex-A9 + 227 MHz Arm Cortex-M4, enabling concurrent Linux + RTOS execution. |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 interface supporting up to 2 GB; no DDR4 or LPDDR3 support. |
| ADC | Two independent 12-bit ADC modules, each with 4 dedicated single-ended inputs-suitable for analog sensor monitoring. |
| Ethernet | Dual 10/100/1000 Mbps controllers compliant with IEEE 1588 and Audio Video Bridging (AVB) standards. |
| Security | Hardware-accelerated CAAM with SHA-256, RSA-2048, TRNG, and 32 KB secure RAM; A-HABv4 secure boot with eFUSE-based key provisioning. |
| Package | 17×17 mm MAPBGA, 0.8 mm pitch, 361-ball layout (VO code); no PCIe, LVDS, or MLB interfaces enabled. |
| Temperature Range | Extended commercial grade: -20°C to +105°C junction temperature-validated for industrial HMI and medical edge devices. |
Pinout & Package
MCIMX6X3EVO10AC uses a 17×17 mm, 0.8 mm pitch MAPBGA package (VO code) with 361 I/O balls. Pin assignments follow the i.MX 6SoloX 17×17NP signal mapping defined in Section 6.3 of IMX6SXCEC Rev. 4. This variant excludes PCIe, LVDS, and MLB interface signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Cortex-A9 Core Supply | 1.0–1.25 V regulated input; requires external PMIC sequencing per Section 4.2. |
| VDD_SOC | SoC Logic & L2 Cache Supply | 1.0–1.25 V domain powering MMDC, GPC, CCM, and interconnect fabric. |
| VDDA_3P3 | Analog I/O Reference | 3.3 V supply for ADC reference, USB PHY, and analog comparators-must be low-noise. |
| ENET1_RX_CLK | Gigabit Ethernet Receive Clock | Input clock sourced from external PHY; supports IEEE 1588 timestamping alignment. |
| ADC1_IN0–ADC1_IN3 | Analog Input Channels | Four dedicated single-ended inputs for ADC1; no shared muxing with GPIO or other peripherals. |
| BOOT_MODE0–BOOT_MODE1 | Boot Configuration | Strapped at reset to select boot source (eMMC, NAND, SPI NOR, or SD); determines initial firmware load path. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | Enables Linux UI stack on Cortex-A9 while offloading real-time control, sensor fusion, and low-power state management to Cortex-M4-no RTOS porting overhead. |
| Integrated graphics acceleration | GC400T GPU delivers OpenGL ES 2.0 and OpenVG 1.1 compliance for smooth 1080p HMI rendering without external GPU. |
| Hardware security engine | CAAM provides NIST-certified DRBG and SHS, enabling secure boot, encrypted firmware updates, and DRM-compliant media playback. |
| Audio subsystem integration | ASRC supports concurrent conversion of up to 10 audio channels with <−120 dB THD+N-eliminates need for external sample rate converters. |
| Flexible memory support | Native interface to DDR3, DDR3L, LPDDR2, NAND (with BCH up to 62-bit), NOR, OneNAND, and eMMC 4.41-reduces BOM count for storage. |
Applications
| Industrial HMI Panels | Smart Home Gateways |
|---|---|
Use Scenario: Touch-enabled wall-mounted control panels for HVAC, lighting, and energy monitoring in commercial buildings. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based Qt UI, managing dual-display output (parallel LCD + LVDS), and sampling environmental sensors via integrated ADCs. Use Value: Dual-core separation ensures UI responsiveness during real-time sensor polling and network stack operation-no frame drops or latency spikes under load. |
Use Scenario: Central hub aggregating Zigbee, Z-Wave, and BLE device data while running local automation logic and streaming video to cloud services. IC Role / Device Role / Timing Role: Host controller for multiple wireless co-processors, managing dual Ethernet AVB streams for synchronized audio/video backhaul and local OTA firmware distribution. Use Value: Integrated AVB-capable Ethernet eliminates external switch ICs; CAAM enables secure TLS handshake acceleration for encrypted cloud communication. |
| Portable Medical Devices | IP Intercom Systems |
Use Scenario: Battery-powered vital sign monitors with ECG, SpO₂, and temperature sensing requiring FDA-grade data integrity and low-power operation. IC Role / Device Role / Timing Role: Real-time acquisition controller using Cortex-M4 for analog front-end timing-critical sampling and CRC validation, while Cortex-A9 handles Bluetooth LE connectivity and UI. Use Value: On-die ADCs with dedicated inputs reduce external signal conditioning components; secure boot prevents unauthorized firmware modification. |
Use Scenario: Two-way audio/video intercom units with door release, motion-triggered recording, and PoE-powered operation in multi-tenant residential buildings. IC Role / Device Role / Timing Role: Media processor handling H.264 encode/decode, AES-128 encryption, and synchronized audio playback via ESAI/SPDIF interfaces. Use Value: GC400T GPU accelerates video overlay (e.g., tenant directory), while ASRC maintains lip-sync accuracy across variable network jitter conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6X3EVN10AC | Same core speeds and temperature grade, but includes PCIe v2.0 x1 and retains LVDS interface-requires larger PCB footprint and additional power rails. | Required for designs needing FPGA co-processing or high-resolution LVDS display output. | Select when PCIe expansion or LVDS panel interface is mandatory; not drop-in compatible due to pinout and power delivery differences. |
| MCIMX6X4EVM10AC | 19×19 mm 0.8 mm pitch BGA (VM code); adds MLB interface and removes ADC2-supports higher memory bandwidth via wider DDR bus. | Suitable for automotive infotainment head units requiring MOST networking and enhanced multimedia throughput. | Choose only if MLB protocol support or increased DDR capacity is required; incompatible pinout and thermal profile preclude direct substitution. |
Compared with MCIMX6X3EVO10AC, MCIMX6X3EVN10AC adds PCIe and LVDS at the cost of higher layout complexity and power, while MCIMX6X4EVM10AC trades ADC capability for MLB and larger package-neither offers pin compatibility, and all three require distinct PCB revisions.
Availability
MCIMX6X3EVO10AC is available at Aetrix Electronics and suitable for industrial HMI panels, smart home gateways, and portable medical devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCIMX6X3EVO10AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6SoloX product line was designed specifically for resource-constrained, HMI-intensive connected devices-balancing Linux-capable performance with real-time responsiveness and hardware security in a single SoC.
FAQ
What is the maximum operating frequency of the Cortex-A9 core in MCIMX6X3EVO10AC?
The MCIMX6X3EVO10AC features a Cortex-A9 core rated for up to 1 GHz operation under specified voltage and thermal conditions. When using a 24 MHz input clock (required for USB functionality), the maximum achievable Cortex-A9 speed is limited to 996 MHz per Section 1.1 of IMX6SXCEC Rev. 4. This derating ensures stable USB PHY operation without compromising system timing margins.
Does MCIMX6X3EVO10AC support PCIe interface?
No, MCIMX6X3EVO10AC does not support PCIe. Its VO package code explicitly denotes "NP = No PCIe", and Table 1 in IMX6SXCEC Rev. 4 confirms PCIe is disabled for this part number. Designs requiring PCIe must use variants with VN or VM package codes, such as MCIMX6X3EVN10AC or MCIMX6X4EVM10AC.
How many ADC channels does MCIMX6X3EVO10AC provide?
MCIMX6X3EVO10AC integrates two independent 12-bit ADC modules (ADC1 and ADC2), each with four dedicated single-ended analog inputs-totaling eight usable channels. This configuration is confirmed in the "Part Differentiator" matrix on page 5 of IMX6SXCEC Rev. 4 and applies specifically to VO and VK package variants.
What is the junction temperature range for MCIMX6X3EVO10AC?
The MCIMX6X3EVO10AC is qualified for extended commercial operation with a junction temperature range of -20°C to +105°C. This rating is explicitly stated in Table 1 of IMX6SXCEC Rev. 4 and distinguishes it from industrial (-40°C to +105°C) and automotive (-40°C to +125°C) variants-making it suitable for enclosed industrial enclosures without active cooling.
Which graphics APIs are supported by the GPU in MCIMX6X3EVO10AC?
The GC400T GPU integrated into MCIMX6X3EVO10AC supports OpenGL ES 2.0 and OpenVG 1.1 APIs for hardware-accelerated 2D and 3D graphics rendering. These APIs are documented in Section 1.2 of IMX6SXCEC Rev. 4 and enable efficient UI composition, vector graphics, and basic gaming workloads without external graphics silicon.
MCIMX6X3EVO10AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 400-LFBGA
- Series:
- i.MX6SX
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 227MHz, 1GHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-MAPBGA (17x17)
- Additional Interfaces:
- AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
MCIMX6X3EVO10AC FAQ
1.How can I place an order for MCIMX6X3EVO10AC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6X3EVO10AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6X3EVO10AC reliable?
The price and inventory of MCIMX6X3EVO10AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6X3EVO10AC is usually 5 days.
3.What payment methods are accepted for MCIMX6X3EVO10AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6X3EVO10AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6X3EVO10AC?
MCIMX6X3EVO10AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6X3EVO10AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6X3EVO10AC?
For technical support, including MCIMX6X3EVO10AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6X3EVO10AC requirements.
6.How does Aetrix verify that MCIMX6X3EVO10AC is sourced from the original manufacturer or authorized distributors?
All MCIMX6X3EVO10AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6X3EVO10AC meets industry standards.
7.What is the process for return or replacement of MCIMX6X3EVO10AC?
All MCIMX6X3EVO10AC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6X3EVO10AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6X3EVO10AC part is unused and in its original packaging.
Return procedure for MCIMX6X3EVO10AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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