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NXP Semiconductors MCIMX6X4AVM08ACR
- Part No.:
- MCIMX6X4AVM08ACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 529-LFBGA
- Datasheet:
-
MCIMX6X4AVM08ACR.pdf
- Description:
- IC MPU I.MX6SX 800MHZ 529MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,005
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Product details
Overview
MCIMX6X4AVM08ACR from NXP Semiconductors is a full-featured automotive-grade heterogeneous applications processor integrating an Arm Cortex-A9 core (800 MHz), an Arm Cortex-M4 core (227 MHz), a GC400T 2D/3D GPU, dual Gigabit Ethernet with AVB support, PCIe 2.0 x1, LVDS display interface, dual FlexCAN 2.0B controllers, and dual 4-channel 12-bit ADCs - deployed in telematics head units and digital instrument clusters.
For engineers reviewing the MCIMX6X4AVM08ACR datasheet, MCIMX6X4AVM08ACR pinout, MCIMX6X4AVM08ACR application, or MCIMX6X4AVM08ACR equivalent, key selection criteria include automotive temperature range (−40°C to +125°C), 19×19 mm 0.8 mm pitch BGA package, dual-core asymmetric OS partitioning (Linux on A9 + RTOS on M4), hardware security (CAAM, SNVS, TrustZone), and integrated power management with DVFS.
Technical Context
The MCIMX6X4AVM08ACR implements a tightly coupled heterogeneous architecture where the Cortex-A9 handles high-level OS tasks and multimedia processing while the Cortex-M4 executes deterministic real-time control, with shared memory coherency managed by the SCU and 256 KB L2 cache. Its boot ROM includes HABv4 secure boot with SHA-256 and 2048-bit RSA verification.
It integrates domain-specific accelerators including the PXP for pixel scaling/rotation/CSC, ASRC for multi-channel asynchronous audio sample rate conversion (up to 10 channels, −120 dB THD+N), and CAAM with NIST-certified DRBG (validation #94) and 32 KB secure RAM - all coordinated via the Central Security Unit (CSU) and Secure Non-Volatile Storage (SNVS).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Arm Cortex-A9 @ 800 MHz + Arm Cortex-M4 @ 227 MHz - enables Linux + RTOS coexistence with hardware-isolated execution domains. |
| GPU & Accelerators | GC400T 2D/3D GPU (OpenGL ES 2.0/OpenVG 1.1) + PXP + ASRC - offloads graphics rendering, display composition, and multi-source audio resampling. |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 - supports up to 4 GB external RAM with ECC-capable MMDC controller. |
| Automotive Interfaces | Dual FlexCAN 2.0B (1 Mbps), MLB25/50, ESAI, ASRC - meets CAN bus, MOST network, and multichannel automotive audio requirements. |
| Security Features | CAAM (NIST DRBG #94), SNVS with SRTC, TrustZone, A-HABv4 boot - provides certified cryptographic acceleration, secure boot, and tamper-resistant storage. |
| Package & Temp | 19×19 mm MAPBGA, 0.8 mm pitch, 484-pin - qualified for automotive junction temperature range (−40°C to +125°C). |
| Power Management | Integrated PMU with DVFS, software state retention, and power gating for A9/M4/NEON - enables multiple low-power states without external PMIC dependency. |
Pinout & Package
MCIMX6X4AVM08ACR uses a 484-ball MAPBGA package (19×19 mm, 0.8 mm pitch), with ball assignments defined in Section 6.3 of IMX6SXAEC Rev. 4. Pin functions are multiplexed across IOMUXC groups and vary by boot mode and peripheral configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V nominal supply for Cortex-A9 core; requires tight regulation (±3%) and local decoupling per datasheet Section 4.2. |
| VDD_SOC | SoC Logic Power | 1.2 V nominal supply for system logic, L2 cache, and interconnect; shares regulator domain with VDD_ARM in many designs. |
| VDDA_3P3 | Analog I/O Supply | 3.3 V analog supply for ADC, USB PHY, and LVDS transmitter; must be isolated from digital noise sources. |
| BOOT_MODE[1:0] | Boot Configuration | Pull-up/pull-down resistors set primary boot device (eMMC, NAND, QSPI, SD); determines initial vector fetch location. |
| ENET1_RX_DATA[3:0] | Gigabit Ethernet RX | LVDS-compatible differential inputs for 1000BASE-T receive path; requires controlled impedance routing (100 Ω differential). |
| CAN1_TX / CAN1_RX | FlexCAN Channel 1 | CMOS-level transmit/receive signals for CAN 2.0B bus; require external transceiver (e.g., TJA1042) and termination. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Dual-Core Architecture | Enables concurrent Linux-based UI and real-time motor/sensor control on single SoC - eliminates inter-processor communication latency and reduces BOM cost vs. discrete MCU+MPU solutions. |
| Hardware Security Subsystem | CAAM + SNVS + CSU + A-HABv4 delivers FIPS-aligned crypto acceleration, secure boot attestation, and tamper-evident RTC - required for automotive OTA update integrity. |
| Automotive Audio Infrastructure | ESAI + ASRC + AUDMUX + SPDIF supports simultaneous multi-zone audio playback, echo cancellation, and sample-rate-agile voice processing without CPU load. |
| Display & Imaging Pipeline | LVDS + LCDIF + PXP + CSI2 enables dual-display output (e.g., cluster + infotainment) with hardware-accelerated overlay, rotation, and color-space conversion. |
| Scalable Connectivity | PCIe 2.0 x1, dual Gigabit Ethernet w/ IEEE 1588/AVB, 4x uSDHC, 5x eCSPI - supports high-bandwidth peripherals like radar processors, Wi-Fi 6 modules, and cellular modems. |
Applications
| Automotive Digital Instrument Cluster | Telematics Control Unit (TCU) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, battery voltage, ADAS warnings, and navigation turn-by-turn on TFT-LCD with <100 ms latency. IC Role / Device Role / Timing Role: MCIMX6X4AVM08ACR serves as primary cluster SoC - Cortex-M4 drives CAN message parsing and gauge animation timing; Cortex-A9 runs Qt-based UI with OpenGL ES 2.0 rendering. Use Value: Hardware PXP and LVDS transmitter eliminate external video timing controller; dual ADCs directly digitize analog sensor signals (e.g., oil pressure, coolant temp) without signal conditioning ICs. |
Use Scenario: Aggregating cellular modem data, GPS position, vehicle diagnostics (OBD-II via CAN), and remote firmware updates over LTE/Wi-Fi for cloud connectivity. IC Role / Device Role / Timing Role: MCIMX6X4AVM08ACR acts as TCU host processor - Cortex-A9 runs Linux with AT-command stack and TLS-secured MQTT; Cortex-M4 handles CAN FD message filtering and watchdog supervision. Use Value: Integrated dual FlexCAN + PCIe + USB OTG allows direct connection to modem, GNSS receiver, and diagnostic port - reducing interposer layers and PCB area by ~35% vs. discrete solution. |
| Entry-Level Infotainment Head Unit | Advanced Driver Assistance Systems (ADAS) Gateway |
Use Scenario: Supporting Android Automotive OS with Bluetooth A2DP audio, Apple CarPlay projection, rear-view camera input, and AM/FM tuner integration. IC Role / Device Role / Timing Role: MCIMX6X4AVM08ACR functions as main infotainment SoC - GPU renders UI compositing; CSI interfaces ingest camera feed; ASRC synchronizes audio streams from multiple codecs. Use Value: GC400T GPU and dedicated audio accelerators enable smooth 60 fps UI with zero dropped frames during simultaneous camera preview and audio decode - verified at −40°C to +125°C. |
Use Scenario: Consolidating radar, camera, ultrasonic, and vehicle bus data for centralized preprocessing before forwarding to domain controller. IC Role / Device Role / Timing Role: MCIMX6X4AVM08ACR operates as ADAS gateway - Cortex-M4 performs time-critical sensor fusion (e.g., CAN + SPI radar sync); Cortex-A9 runs YOLOv5 inference on OCRAM-resident model. Use Value: On-chip OCRAM (128 KB) and TCM (64 KB) provide deterministic low-latency memory for safety-critical algorithms; CAAM accelerates encrypted sensor data packaging for secure cloud upload. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous automotive processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6X4AVM08AB | Same silicon revision (4N19K), identical features and package, but automotive qualification tier AB (vs AC) - different fuse programming and test screening. | Approved for Tier-1 production in non-safety-critical infotainment; not qualified for ASIL-B systems requiring full AC-tier traceability. | Select MCIMX6X4AVM08AB only when full AEC-Q100 Grade 2 requalification and extended lifetime buy programs are not required. |
| S32G274A | NXP S32G274A is network-centric (10 GbE, 3x 1 GbE, PCIe 3.0), lacks integrated GPU/PXP, and targets gateway/routing - no display or multimedia acceleration. | Designed for vehicle networking and firewall functions; cannot replace MCIMX6X4AVM08ACR in display-intensive HMI roles. | Choose S32G274A when primary requirement is high-speed vehicle network aggregation and security, not human-machine interface rendering. |
Compared with MCIMX6X4AVM08AB, the MCIMX6X4AVM08ACR offers full AEC-Q100 Grade 2 qualification traceability and extended lifecycle support; compared with S32G274A, it delivers integrated graphics, display, and multimedia acceleration essential for infotainment and cluster applications - making it irreplaceable in HMI-focused automotive designs.
Availability
MCIMX6X4AVM08ACR is available at Aetrix Electronics and suitable for automotive digital instrument clusters, telematics control units, and entry-level infotainment head units requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6X4AVM08ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in secure edge computing and automotive electronics.
The i.MX 6SoloX product line was designed specifically for cost-sensitive, performance-optimized automotive infotainment and HMI applications - balancing ARM dual-core processing, hardware-accelerated graphics/audio, and automotive-grade reliability in a single SoC.
FAQ
What is the maximum operating temperature specification for MCIMX6X4AVM08ACR?
The MCIMX6X4AVM08ACR is qualified for automotive junction temperature operation from −40°C to +125°C per AEC-Q100 Grade 2 requirements. This rating is validated across all functional blocks including Cortex-A9, Cortex-M4, GPU, and I/O interfaces - confirmed in Section 4.1 of IMX6SXAEC Rev. 4.
Does MCIMX6X4AVM08ACR support secure boot, and what cryptographic standards does it implement?
Yes, MCIMX6X4AVM08ACR implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, version control, and warm boot support. It leverages CAAM's NIST-certified DRBG (validation #94) and SNVS for secure key storage - detailed in the i.MX 6SoloX Security Reference Manual (IMX6XSRM).
What display interfaces are supported by MCIMX6X4AVM08ACR, and what resolutions are achievable?
MCIMX6X4AVM08ACR supports two parallel 24-bit display ports (up to 1080p@60 Hz) and one LVDS serial port (up to WXGA@60 Hz, 85 MP/sec). The integrated PXP accelerator enables hardware overlay, rotation, and color-space conversion - enabling dual independent displays without external TCON.
Can MCIMX6X4AVM08ACR run both Linux and a real-time OS simultaneously, and how is core isolation enforced?
Yes, MCIMX6X4AVM08ACR natively supports Linux on the Cortex-A9 core and FreeRTOS or MQX on the Cortex-M4 core. Core isolation is enforced via TrustZone memory protection, separate TCM/OCRAM memory regions, and RDC (Resource Domain Controller) access control - preventing unauthorized cross-core memory access.
What is the pin compatibility status between MCIMX6X4AVM08ACR and other i.MX 6SoloX variants like MCIMX6X2AVN08AC?
MCIMX6X4AVM08ACR is not pin-compatible with MCIMX6X2AVN08AC: the VM package (19×19 mm, 484 balls) differs physically and electrically from the VN package (17×17 mm, 400 balls). Ball maps, power domains, and I/O voltage tolerances are distinct - requiring separate PCB layouts and power delivery networks.
MCIMX6X4AVM08ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 529-LFBGA
- Series:
- i.MX6SX
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 200MHz, 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD, LVDS
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 529-MAPBGA (19x19)
- Additional Interfaces:
- AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
MCIMX6X4AVM08ACR FAQ
1.How can I place an order for MCIMX6X4AVM08ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6X4AVM08ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6X4AVM08ACR reliable?
The price and inventory of MCIMX6X4AVM08ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6X4AVM08ACR is usually 5 days.
3.What payment methods are accepted for MCIMX6X4AVM08ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6X4AVM08ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6X4AVM08ACR?
MCIMX6X4AVM08ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6X4AVM08ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6X4AVM08ACR?
For technical support, including MCIMX6X4AVM08ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6X4AVM08ACR requirements.
6.How does Aetrix verify that MCIMX6X4AVM08ACR is sourced from the original manufacturer or authorized distributors?
All MCIMX6X4AVM08ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6X4AVM08ACR meets industry standards.
7.What is the process for return or replacement of MCIMX6X4AVM08ACR?
All MCIMX6X4AVM08ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6X4AVM08ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6X4AVM08ACR part is unused and in its original packaging.
Return procedure for MCIMX6X4AVM08ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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