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NXP Semiconductors MCIMX6Y1DVK05AB

Part No.:
MCIMX6Y1DVK05AB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
272-LFBGA
Datasheet:
AetrixMCIMX6Y1DVK05AB.pdf
Description:
IC MPU I.MX6 528MHZ 272MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,391

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Product details

Overview

MCIMX6Y1DVK05AB from NXP Semiconductors is a single-core Arm Cortex-A7 application processor operating at 528 MHz, featuring basic security (TrustZone, HABv4, AES-128, SHA-256), one FlexCAN interface, dual USB 2.0 OTG with integrated PHY, eight UARTs, three SAI audio interfaces, and ESAI - all in a 9 × 9 mm, 0.5 mm pitch MAPBGA package rated for 0 to +95 °C junction temperature. It targets cost-sensitive, power-efficient embedded gateways and industrial HMIs.

For engineers reviewing the MCIMX6Y1DVK05AB datasheet, MCIMX6Y1DVK05AB pinout, MCIMX6Y1DVK05AB application, or MCIMX6Y1DVK05AB equivalent, key selection criteria include its 528 MHz CPU frequency, 9 × 9 mm MAPBGA footprint, single CAN channel, absence of LCD/CSI interfaces, and support for DDR3/LPDDR2, eMMC 4.5, and Quad SPI boot - critical for compact, secure, low-power edge node designs.

Technical Context

The MCIMX6Y1DVK05AB implements Arm Cortex-A7 with 32 KB L1 instruction and data caches, 128 KB unified L2 cache, NEON MPE coprocessor, and TrustZone-enabled security architecture. Its memory subsystem supports LPDDR2-800, DDR3-800, DDR3L-800, NAND (with up to 40-bit BCH ECC), NOR, and eMMC 4.5.

Peripherals include two 10/100 Mbps Ethernet controllers (only one enabled per variant), dual USB OTG (HS, 480 Mbps), three SAI modules (up to 1.4 Mbps each), ESAI, four I²C (400 kbps), four eCSPI (52 Mbps), eight PWM, and two 12-bit ADCs (10 total channels). Power management integrates on-die LDOs and supports DVFS and multiple low-power states.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-A7, single-core, 528 MHz - delivers deterministic real-time response for Linux-based edge applications without thermal throttling in commercial-grade environments.
Package MAPBGA, 9 × 9 mm, 0.5 mm pitch, 289 balls - enables high-density PCB layouts and reduces board area vs. 14 × 14 mm variants, critical for space-constrained IoT gateways.
Memory Interface LPDDR2-800 / DDR3-800 / DDR3L-800, 16-bit bus - supports low-cost, low-power DRAM options compatible with industrial temperature-rated components.
Security TrustZone, HABv4, AES-128, SHA-1/SHA-256 hardware acceleration, SNVS, CSU - enables secure boot, encrypted firmware updates, and tamper-resistant key storage without external secure elements.
Connectivity FlexCAN ×1, USB 2.0 OTG ×2 (HS, 480 Mbps), UART ×8, SAI ×3, ESAI ×1, I²C ×4, eCSPI ×4 - provides native CAN bus integration for industrial control and multi-channel audio routing for voice-enabled devices.
Analog Input Two 12-bit ADC modules, up to 10 total input channels - supports direct sensor monitoring (e.g., temperature, voltage, current) without external signal conditioning ICs.
Operating Range Junction temperature: 0 to +95 °C - validated for reliable operation in enclosed consumer and industrial enclosures without active cooling.

Pinout & Package

MCIMX6Y1DVK05AB uses a 9 × 9 mm, 0.5 mm pitch MAPBGA package with 289 solder balls. Pin assignments follow the i.MX 6ULL 9 mm package layout defined in Section 6.2 of IMX6ULLCEC Rev. 1.3, including dedicated ball groups for VDD_SOC, VDD_ARM, VDD_PU, VDD_USB, VDDA, VDDA_3V3, VSS, and functional I/O banks (e.g., USDHC, ENET, CAN, UART, SAI, I²C, eCSPI).

Pin/Terminal Circuit Role Design Meaning
WDOG_B Watchdog reset output Active-low system reset assertion upon timeout - used for fail-safe recovery in unattended embedded systems.
CAN1_TX / CAN1_RX FlexCAN1 differential transceiver interface Direct connection to external CAN transceiver (e.g., TJA1042) for ISO 11898-2 compliant bus communication at up to 1 Mbps.
ENET1_RX_DATA[3:0] / ENET1_TX_DATA[3:0] 10/100 Mbps Ethernet MAC interface 4-bit nibble-mode RMII-compatible signals - requires external PHY (e.g., KSZ8081) and magnetics for full IEEE 802.3 compliance.
USB_OTG1_DP / USB_OTG1_DM USB 2.0 differential data pair Integrated HS PHY eliminates need for external transceiver - supports host/peripheral mode via ID pin detection.
SAI1_TX_BCLK / SAI1_TX_SYNC / SAI1_TX_DATA0 Synchronous Audio Interface channel 1 transmit Configurable I²S/AC97/TDM timing - drives codecs (e.g., SGTL5000) or digital audio amplifiers with sample-rate flexibility.

Key Features

Feature Design Value
Smart Speed Power Management On-chip LDOs, DVFS, and multiple low-power states reduce system-level power supply complexity and enable <100 mW idle power in suspend-to-RAM mode.
Secure Boot & Cryptographic Acceleration HABv4 with AES-128, SHA-1/SHA-256 engines and SNVS tamper detection ensure firmware integrity and protect cryptographic keys from physical and logical attacks.
Audio Processing Subsystem Three SAI modules + ESAI + ASRC support concurrent multi-source audio streams (e.g., VoIP + local playback + Bluetooth A2DP sink) with independent sample rate conversion.
Flexible Memory Boot Options Quad SPI, eMMC 4.5, NAND (with 40-bit BCH), NOR, and SD card boot - simplifies field firmware updates and enables robust recovery mechanisms.
Industrial-Grade Peripheral Set Single CAN, dual USB OTG, eight UARTs, and GPIO with interrupt capability provide native connectivity for PLCs, access panels, and sensor concentrators without bridge ICs.

Applications

Industrial HMI Terminal Secure IoT Gateway

Use Scenario: Wall-mounted panel PC in factory automation displaying real-time machine status and accepting operator inputs via touchscreen or keypad.

IC Role / Device Role / Timing Role: Main application processor executing Linux with Qt-based GUI, managing display refresh (via parallel RGB), UART-connected PLCs, and CAN-linked sensors.

Use Value: 528 MHz Cortex-A7 delivers smooth 60 Hz UI rendering while integrated PXP offloads image scaling and alpha-blending - reducing CPU load and extending thermal headroom.

Use Scenario: Cellular-connected edge gateway aggregating Modbus RTU data from legacy equipment and forwarding to cloud via TLS-secured MQTT over LTE.

IC Role / Device Role / Timing Role: Central protocol translator and security enforcer - running lightweight OS, terminating TLS, validating firmware signatures, and isolating CAN/RS485 domains.

Use Value: Hardware-accelerated AES-128 and SHA-256 enable sub-10 ms TLS handshake latency; dual USB OTG supports simultaneous cellular modem and local debug port without hub ICs.

VoIP Endpoint Device Medical Sensor Hub

Use Scenario: SIP-based desk phone with HD audio, Bluetooth headset pairing, and local call logging to eMMC.

IC Role / Device Role / Timing Role: Audio-centric SoC handling codec processing (via SAI/ESAI), echo cancellation (NEON), VoIP stack, and secure credential storage.

Use Value: Three SAI interfaces allow concurrent connections to speakerphone codec, Bluetooth HCI, and local audio DAC - eliminating external audio switches and reducing BOM cost.

Use Scenario: Portable patient monitor collecting ECG, SpO₂, and temperature via analog front-ends and transmitting alerts via Wi-Fi or BLE.

IC Role / Device Role / Timing Role: Low-power data aggregator with secure boot, ADC-driven sensor sampling, and encrypted local storage before wireless transmission.

Use Value: Two 12-bit ADCs with 10-channel mux support simultaneous multi-sensor acquisition; SNVS tamper detection prevents unauthorized access to stored health records.

Equivalent & Alternatives

The following parts are listed as comparable options for similar application processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCIMX6Y2DVK05AB Includes LCDIF and CSI interfaces; adds second FlexCAN channel and second ADC module. Required for designs needing parallel display output or camera input - not suitable if display/camera are omitted to reduce cost and layout complexity. Select MCIMX6Y2DVK05AB only when LCD/CSI functionality is mandatory; otherwise MCIMX6Y1DVK05AB reduces BOM and simplifies routing.
MCIMX6Y1DVM05AB Same core, frequency, and feature set but in 14 × 14 mm, 0.8 mm pitch MAPBGA (289 balls). Compatible for prototyping or where larger PCB real estate is available; incompatible with 9 mm footprint constraints. Choose MCIMX6Y1DVM05AB only when board layout allows larger package; MCIMX6Y1DVK05AB is preferred for miniaturized production designs.

Compared with MCIMX6Y2DVK05AB, MCIMX6Y1DVK05AB removes LCD/CSI and second CAN to lower cost and power; compared with MCIMX6Y1DVM05AB, it delivers identical functionality in a 30% smaller footprint - making it optimal for volume production of space-constrained, CAN-enabled edge nodes.

Availability

MCIMX6Y1DVK05AB is available at Aetrix Electronics and suitable for industrial HMI terminals, secure IoT gateways, and VoIP endpoint devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for MCIMX6Y1DVK05AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based application processors and edge AI acceleration.

The i.MX 6ULL product line - including MCIMX6Y1DVK05AB - was designed specifically for cost-sensitive, power-efficient Linux-capable edge devices such as gateways, HMIs, and smart appliances, emphasizing security, peripheral flexibility, and small-footprint integration.

FAQ

What is the maximum operating frequency of the MCIMX6Y1DVK05AB?

The MCIMX6Y1DVK05AB operates at a fixed maximum frequency of 528 MHz. This speed is guaranteed across the full 0 to +95 °C junction temperature range and does not support dynamic frequency scaling beyond this rating. The 528 MHz clock is derived from internal PLLs and is validated for stable Linux kernel execution with real-time responsiveness in commercial-grade applications.

Does the MCIMX6Y1DVK05AB support secure boot, and what cryptographic algorithms are hardware-accelerated?

Yes, the MCIMX6Y1DVK05AB supports Advanced High Assurance Boot (A-HABv4) with hardware-accelerated AES-128 encryption, SHA-1, and SHA-256 hashing. These functions are implemented in the DCP and SNVS modules, enabling fast, tamper-resistant firmware authentication during cold boot and warm reset - essential for deploying MCIMX6Y1DVK05AB in regulated or security-critical environments.

What memory types and interfaces are supported by the MCIMX6Y1DVK05AB?

The MCIMX6Y1DVK05AB supports LPDDR2-800, DDR3-800, DDR3L-800 (16-bit bus), raw and managed NAND flash (with up to 40-bit BCH ECC), NOR flash, Quad SPI, and eMMC 4.5. It does not support DDR4 or LPDDR3. Memory configuration is controlled via fuses and boot ROM settings, and all interfaces are validated per IMX6ULLCEC Rev. 1.3 electrical specifications.

How many CAN interfaces does the MCIMX6Y1DVK05AB include, and are they fully compliant?

The MCIMX6Y1DVK05AB includes one fully compliant FlexCAN module supporting CAN 2.0B protocol with standard and extended frame formats, bit rates up to 1 Mbps, and built-in message buffering and filtering. It requires an external CAN transceiver (e.g., TJA1042 or MCP2551) to complete the physical layer - no additional protocol translation or bridging logic is needed for standard CAN bus integration.

Is the MCIMX6Y1DVK05AB pin-compatible with other i.MX 6ULL variants in the same package size?

Yes, the MCIMX6Y1DVK05AB is pin-compatible with all other i.MX 6ULL parts using the 9 × 9 mm, 0.5 mm pitch MAPBGA package (e.g., MCIMX6Y2DVK05AB, MCIMX6Y7DVK05AB), sharing identical ball mapping, power sequencing, and I/O voltage requirements. Functional differences (e.g., LCDIF presence or CAN count) are fuse-configured and do not affect mechanical or electrical compatibility at the PCB level.

MCIMX6Y1DVK05AB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
272-LFBGA
Series:
i.MX6
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (1)
SATA:
-
USB:
USB 2.0 OTG + PHY (2)
Voltage - I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Grade:
-
Qualification:
-
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Supplier Device Package:
272-MAPBGA (9x9)
Additional Interfaces:
CAN, I2C, SPI, UART

MCIMX6Y1DVK05AB FAQ

1.How can I place an order for MCIMX6Y1DVK05AB through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6Y1DVK05AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6Y1DVK05AB reliable?

The price and inventory of MCIMX6Y1DVK05AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Y1DVK05AB is usually 5 days.

3.What payment methods are accepted for MCIMX6Y1DVK05AB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Y1DVK05AB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6Y1DVK05AB?

MCIMX6Y1DVK05AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6Y1DVK05AB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6Y1DVK05AB?

For technical support, including MCIMX6Y1DVK05AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Y1DVK05AB requirements.

6.How does Aetrix verify that MCIMX6Y1DVK05AB is sourced from the original manufacturer or authorized distributors?

All MCIMX6Y1DVK05AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Y1DVK05AB meets industry standards.

7.What is the process for return or replacement of MCIMX6Y1DVK05AB?

All MCIMX6Y1DVK05AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Y1DVK05AB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6Y1DVK05AB part is unused and in its original packaging.

Return procedure for MCIMX6Y1DVK05AB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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