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NXP Semiconductors MCIMX6Y2CVK08AB

Part No.:
MCIMX6Y2CVK08AB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
272-LFBGA
Datasheet:
AetrixMCIMX6Y2CVK08AB.pdf
Description:
IC MPU I.MX6 792MHZ 272MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,287

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Product details

Overview

MCIMX6Y2CVK08AB from NXP Semiconductors is an industrial-grade Arm Cortex-A7 single-core applications processor operating at 792 MHz, integrating LCD/CSI interfaces, dual CAN, dual 10/100 Ethernet, two 12-bit ADCs (10-channel total), and hardware-accelerated multimedia processing (PXP, ASRC, SDMA) for embedded HMI and IoT gateway systems.

For engineers reviewing the MCIMX6Y2CVK08AB datasheet, MCIMX6Y2CVK08AB pinout, MCIMX6Y2CVK08AB application, or MCIMX6Y2CVK08AB equivalent, key selection criteria include its 9×9 mm MAPBGA-0.5 mm pitch package, -40°C to +105°C junction temperature rating, basic security features (TrustZone, SNVS, HABv4), and support for LPDDR2/DDR3L, eMMC 4.5, NAND flash with 40-bit BCH ECC.

Technical Context

The MCIMX6Y2CVK08AB implements a single Arm Cortex-A7 core with 32 KB L1 instruction and data caches, 128 KB unified L2 cache, NEON MPE coprocessor, and TrustZone security extensions. It integrates a dedicated Power Management Unit (PMU) with on-chip LDOs, DVFS support, and thermal/voltage monitoring.

Its peripheral subsystem includes dual FlexCAN controllers compliant with CAN 2.0B, two IEEE 1588-compliant Ethernet MACs, three SAI audio interfaces, ESAI, SPDIF, quad SPI, GPMI NAND controller with 40-bit BCH, and a Pixel Processing Pipeline (PXP) supporting real-time image rotation, alpha blending, and color-space conversion for display pipelines.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Single Arm Cortex-A7 with TrustZone, 792 MHz max frequency - enables deterministic real-time response in industrial control and secure boot execution.
Memory Interfaces LPDDR2-800 / DDR3L-800 (16-bit), eMMC 4.5 (HS200 mode), NAND flash with 40-bit BCH ECC - supports cost-optimized, high-reliability storage in harsh environments.
Display & Imaging LCDIF parallel interface (up to WXGA @60 Hz), CSI camera port (24-bit, 133.3 MHz pixel clock), PXP accelerator - enables local HMI with live video feed and electrophoretic display (EPD) support.
Connectivity Dual 10/100 Ethernet (IEEE 1588), dual FlexCAN 2.0B, USB 2.0 OTG ×2 with integrated PHY, SAI ×3, ESAI, SPDIF - meets deterministic networking and automotive-grade fieldbus requirements.
Analog & Timing Two 12-bit ADC modules (10 total input channels), EPIT ×2, GPT ×2, system timer, RTC in SNVS - provides sensor acquisition and precise timekeeping without external components.
Security HABv4 with AES-128, SHA-1/SHA-256 acceleration, SNVS with tamper detection, CSU policy enforcement, TrustZone isolation - satisfies secure boot, firmware authentication, and key storage for industrial IoT.
Package & Environment MAPBGA, 9×9 mm, 0.5 mm pitch, 289 balls; industrial temperature range (-40°C to +105°C) - ensures mechanical robustness and thermal reliability in enclosed enclosures and uncontrolled ambient conditions.

Pinout & Package

MCIMX6Y2CVK08AB is housed in a 9×9 mm, 0.5 mm pitch MAPBGA package with 289 I/O balls. Pin assignments follow the i.MX 6ULL 9×9 mm ball map defined in Section 6.2 of IMX6ULLIEC Rev. 1.2, including dedicated power domains (VDD_ARM, VDD_SOC, VDDA_ADC), differential clock inputs (ENET_RX_CLK/ENET_TX_CLK), and multiplexed function pins for CSI, LCDIF, and FlexCAN.

Pin/Terminal Circuit Role Design Meaning
VDD_ARM Core voltage supply 1.0–1.3 V regulated input for Arm Cortex-A7 core and L1/L2 caches - requires low-noise, high-PSRR LDO with tight transient response.
VDD_SOC System-on-chip domain supply 1.0–1.25 V input powering MMDC, GPC, CCM, and peripheral logic - shared rail with DDR I/O and must be sequenced after VDD_ARM.
VDDA_ADC Analog ADC reference supply 3.0–3.6 V clean analog supply for both 12-bit ADC modules - isolated from digital noise sources to maintain ≤1 LSB INL/DNL performance.
ENET1_MDC / ENET1_MDIO PHY management interface Open-drain bidirectional bus for IEEE 802.3 MDIO register access - requires 1.8–3.3 V pull-up and supports auto-negotiation with external PHYs.
FLEXCAN1_TX / FLEXCAN1_RX Differential CAN transceiver interface High-speed CMOS outputs/inputs compatible with ISO 11898-2 physical layer - routed as controlled-impedance 120 Ω differential pair.
CSI_DATA00–CSI_DATA23 Parallel camera data bus 24-bit LVCMOS inputs supporting BT.656 and raw Bayer formats - require matched trace lengths and termination for >100 MHz pixel clock timing closure.

Key Features

Feature Design Value
Smart DMA (SDMA) engine 32-channel programmable micro-RISC DMA offloads CPU from memory-to-peripheral transfers - reduces host load during simultaneous NAND read, LCD refresh, and audio playback.
Pixel Processing Pipeline (PXP) Hardware-accelerated 2D image operations (rotation, CSC, alpha-blending) at 1 pixel/clock - enables smooth GUI rendering on 1366×768 displays without GPU or external frame buffer.
Asynchronous Sample Rate Converter (ASRC) 10-channel concurrent sample rate conversion with <−120 dB THD+N - eliminates clock domain mismatches between multiple audio codecs and SAI peripherals.
Secure Non-Volatile Storage (SNVS) Dedicated tamper-resistant domain with RTC, voltage/temp monitors, and 10 tamper inputs - protects cryptographic keys and enables secure time-stamped logging in untrusted environments.
Electrophoretic Display Controller (EPDC) Direct-drive E-Ink panel controller supporting up to 2048×1536 resolution - eliminates external display driver IC and reduces BOM cost for battery-powered e-readers and smart labels.

Applications

Industrial HMI Terminal IoT Gateway Edge Node

Use Scenario: Wall-mounted factory control panel with resistive touchscreen, 7-inch LCD, and CAN-connected PLCs.

IC Role / Device Role / Timing Role: Main applications processor executing Linux-based UI stack, driving LCDIF and CSI for camera-based quality inspection, managing dual CAN for fieldbus communication.

Use Value: Integrated PXP and LCDIF eliminate external display controller; dual Ethernet enables redundant network uplinks; industrial temp grade ensures operation in non-climate-controlled facilities.

Use Scenario: Secure edge gateway aggregating sensor data from Modbus RTU, CAN bus, and BLE peripherals before forwarding via TLS-encrypted MQTT to cloud.

IC Role / Device Role / Timing Role: Central compute node running Yocto Linux, handling protocol translation, local decision logic, and secure OTA updates using HABv4 and SNVS.

Use Value: Hardware AES/SHA acceleration enables real-time encryption without CPU overhead; dual Ethernet supports LAN/WAN separation; eMMC 4.5 interface ensures fast, reliable firmware storage.

Medical Point-of-Care Device Smart Building Access Panel

Use Scenario: Portable vital signs monitor with OLED display, pulse oximeter ADC input, and Wi-Fi co-processor connected via USB OTG.

IC Role / Device Role / Timing Role: Host processor managing real-time sensor sampling (dual 12-bit ADC), ASRC-driven audio alerts, and secure patient data logging to encrypted eMMC.

Use Value: Low-power DVFS and SW state retention extend battery life; TrustZone isolates medical firmware from OS services; SNVS RTC enables accurate timestamping of clinical events.

Use Scenario: Touch-enabled door access terminal with RFID reader, biometric fingerprint sensor, and PoE-powered Ethernet backhaul.

IC Role / Device Role / Timing Role: System controller interfacing with UART-based RFID module, SPI-connected fingerprint ASIC, and dual Ethernet for PoE negotiation and upstream communication.

Use Value: Integrated USB OTG supports firmware update via thumb drive; GPIO-interrupt capable KPP handles keypad entry; industrial temp rating ensures outdoor deployment in varying climates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCIMX6Y2CVM08AB Same core, frequency, and feature set but in 14×14 mm MAPBGA-0.8 mm pitch (289-ball) package - larger footprint, lower I/O density, higher thermal mass. Better suited for prototyping or designs requiring easier rework; less optimal for space-constrained industrial enclosures. Select MCIMX6Y2CVM08AB only when PCB layout constraints favor larger pitch or thermal dissipation over miniaturization.
i.MX 6ULZ (MCIMX6U5DVM08AB) Same i.MX 6ULL family architecture but adds 256 KB on-die SRAM (vs. 128 KB OCRAM), enhanced security (CAAM), and extended temperature support (−40°C to +125°C). Targeted at safety-critical applications requiring larger code/data buffers and extended environmental tolerance - not drop-in compatible due to different pinout and power sequencing. Choose i.MX 6ULZ when functional safety certification (IEC 61508 SIL2) or extended temperature operation is mandatory; otherwise, MCIMX6Y2CVK08AB offers optimal cost/performance balance.

Compared with MCIMX6Y2CVM08AB, MCIMX6Y2CVK08AB saves board area and improves signal integrity via finer pitch; compared with i.MX 6ULZ, it trades off extended temp and CAAM for lower unit cost and proven qualification in volume industrial deployments.

Availability

MCIMX6Y2CVK08AB is available at Aetrix Electronics and suitable for industrial HMI terminals, IoT gateway edge nodes, and smart building access panels requiring stable component supply across multi-year production cycles.

Supply support for MCIMX6Y2CVK08AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based application processors and edge AI acceleration.

The i.MX 6ULL product line was designed specifically for cost-sensitive, power-efficient industrial and connected device applications - delivering rich multimedia, deterministic connectivity, and hardware-enforced security in compact packages.

FAQ

What is the maximum operating frequency of the MCIMX6Y2CVK08AB processor core?

The MCIMX6Y2CVK08AB features a single Arm Cortex-A7 core rated for a maximum operating frequency of 792 MHz under industrial temperature conditions (−40°C to +105°C). This frequency is guaranteed across the full junction temperature range and supported by the integrated PMU's DVFS capabilities, enabling dynamic scaling between 100 MHz and 792 MHz based on workload and thermal headroom.

Does the MCIMX6Y2CVK08AB support secure boot, and what hardware blocks enable it?

Yes, the MCIMX6Y2CVK08AB supports secure boot via Advanced High Assurance Boot (HABv4), which leverages multiple hardware blocks: the Central Security Unit (CSU) for policy enforcement, Secure Non-Volatile Storage (SNVS) for key protection, and the Arm TrustZone architecture for runtime isolation. These elements collectively enable authenticated firmware loading, AES-128 decryption, and SHA-1/SHA-256 hash verification during boot sequence.

What display interfaces does the MCIMX6Y2CVK08AB support, and what resolutions are achievable?

The MCIMX6Y2CVK08AB supports parallel LCD via LCDIF (up to WXGA 1366×768 @60 Hz) and electrophoretic displays via EPDC (up to 2048×1536 @106 Hz). It also includes a Pixel Processing Pipeline (PXP) for real-time image scaling, rotation, and color-space conversion - enabling high-fidelity GUI rendering without external graphics accelerators or frame buffers.

Can the MCIMX6Y2CVK08AB interface directly with NAND flash, and what ECC capability is provided?

Yes, the MCIMX6Y2CVK08AB integrates a General Purpose Memory Interface (GPMI) supporting Raw and Managed NAND flash with up to 40-bit BCH error correction. This allows direct connection to SLC/MLC NAND devices with page sizes of 2 KB, 4 KB, or 8 KB - eliminating the need for external ECC controllers and simplifying NAND-based storage design for industrial logging and firmware storage.

What is the package type and ball pitch of the MCIMX6Y2CVK08AB, and how many I/Os does it provide?

The MCIMX6Y2CVK08AB uses a 9×9 mm MAPBGA package with 0.5 mm ball pitch and 289 I/O balls. This compact footprint supports high-density routing while maintaining compatibility with standard PCB fabrication processes. The pinout includes dedicated power domains, differential Ethernet and CAN signals, and multiplexed functions for LCD, CSI, USB, and serial interfaces - all documented in Section 6.2 of the IMX6ULLIEC datasheet.

MCIMX6Y2CVK08AB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
272-LFBGA
Series:
i.MX6
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
792MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
SATA:
-
USB:
USB 2.0 OTG + PHY (2)
Voltage - I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Supplier Device Package:
272-MAPBGA (9x9)
Additional Interfaces:
CANbus, I2C, SPI, UART

MCIMX6Y2CVK08AB FAQ

1.How can I place an order for MCIMX6Y2CVK08AB through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6Y2CVK08AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6Y2CVK08AB reliable?

The price and inventory of MCIMX6Y2CVK08AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Y2CVK08AB is usually 5 days.

3.What payment methods are accepted for MCIMX6Y2CVK08AB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Y2CVK08AB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6Y2CVK08AB?

MCIMX6Y2CVK08AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6Y2CVK08AB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6Y2CVK08AB?

For technical support, including MCIMX6Y2CVK08AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Y2CVK08AB requirements.

6.How does Aetrix verify that MCIMX6Y2CVK08AB is sourced from the original manufacturer or authorized distributors?

All MCIMX6Y2CVK08AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Y2CVK08AB meets industry standards.

7.What is the process for return or replacement of MCIMX6Y2CVK08AB?

All MCIMX6Y2CVK08AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Y2CVK08AB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6Y2CVK08AB part is unused and in its original packaging.

Return procedure for MCIMX6Y2CVK08AB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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