NXP Semiconductors MCIMX6Y2CVM08ABR
- Part No.:
- MCIMX6Y2CVM08ABR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 289-LFBGA
- Datasheet:
-
MCIMX6Y2CVM08ABR.pdf
- Description:
- I.MX 32-BIT MPU, ARM CORTEX-A7 C
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6Y2CVM08ABR from NXP Semiconductors is an industrial-grade Arm Cortex-A7 single-core applications processor operating at 792 MHz, integrating LCD/CSI interfaces, dual CAN, dual 10/100 Ethernet, two 12-bit ADCs (10 total channels), and hardware-accelerated multimedia processing (PXP, ASRC, SDMA) for embedded HMI and IoT gateway systems.
For engineers reviewing the MCIMX6Y2CVM08ABR datasheet, MCIMX6Y2CVM08ABR pinout, MCIMX6Y2CVM08ABR application, or MCIMX6Y2CVM08ABR equivalent, key selection criteria include verified 792 MHz core frequency, MAPBGA 14×14 mm 0.8 mm pitch package compatibility, industrial temperature range (−40°C to +105°C), dual FlexCAN support, and boot ROM with HABv4 secure boot capability.
Technical Context
The MCIMX6Y2CVM08ABR implements a single Arm Cortex-A7 core with TrustZone, 32 KB L1 instruction and data caches, 128 KB unified L2 cache, and NEON MPE coprocessor for SIMD media processing. It integrates a dedicated Pixel Processing Pipeline (PXP) for real-time 2D image operations and Asynchronous Sample Rate Converter (ASRC) supporting up to 10 concurrent audio channels.
Its system architecture includes dual 10/100 Ethernet controllers compliant with IEEE 1588, two FlexCAN modules supporting CAN 2.0B protocol, and a General Purpose Memory Interface (GPMI) with BCH ECC up to 40 bits for NAND flash reliability. Power management is handled by on-chip LDOs and DVFS control, enabling operation across industrial thermal conditions without external PMIC complexity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single Arm Cortex-A7 with TrustZone, 792 MHz max frequency - enables deterministic real-time execution in safety-aware industrial firmware. |
| Memory Interfaces | LPDDR2-800, DDR3/DDR3L-800, eMMC 4.5, Quad SPI, Raw/Managed NAND - supports cost-optimized BOM with commodity memory components. |
| Display & Camera | LCDIF parallel interface (up to WXGA 1366×768@60 Hz) + CSI parallel port (24-bit, 133.3 MHz pixel clock) - enables direct connection to industrial LCD panels and CMOS image sensors. |
| Connectivity | Dual 10/100 Ethernet (IEEE 1588), 2× FlexCAN 2.0B, 8× UART (5 Mbps), 4× I²C (400 kbps), 4× eCSPI (52 Mbps) - meets deterministic networking and fieldbus requirements in automation gateways. |
| Analog Peripherals | Two 12-bit ADC modules, 10 total input channels - provides sufficient resolution and channel count for sensor monitoring in HMI and medical edge devices. |
| Security | HABv4 with AES-128, SHA-1/SHA-256 acceleration, SNVS tamper detection, CSU policy enforcement - satisfies secure boot and runtime integrity requirements for certified industrial deployments. |
| Power Management | Integrated PMU with on-die LDOs, DVFS, SW state retention, and multiple low-power modes - eliminates need for discrete power sequencing ICs in space-constrained designs. |
Pinout & Package
MCIMX6Y2CVM08ABR is housed in a plastic MAPBGA package measuring 14 mm × 14 mm with 0.8 mm ball pitch and 289 I/O balls. Pin assignments follow the i.MX 6ULL 14×14 mm package layout defined in Section 6.1 of IMX6ULLIEC Rev. 1.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.0–1.25 V regulated input for Cortex-A7 core - requires tight tolerance low-noise regulator for stable 792 MHz operation. |
| VDD_SOC | SoC logic voltage | 1.2–1.3 V supply for L2 cache, GPC, CCM, and peripheral logic - shared rail with DDR I/O and must be decoupled per JEDEC guidelines. |
| ENET1_RXD0–3 | Ethernet 1 receive data | Differential pair inputs for 10/100BASE-TX - require 50 Ω controlled impedance routing and AC coupling capacitors per IEEE 802.3. |
| FLEXCAN1_TX/RX | CAN 1 transceiver interface | Direct connection to external CAN PHY (e.g., TJA1043) - no internal termination; external 120 Ω bias required for bus compliance. |
| CSI_DATA00–23 | Parallel camera data bus | 24-bit bidirectional LVCMOS interface supporting BT.656 and raw Bayer formats - routed as length-matched group with <5 ps skew for 133.3 MHz pixel clock timing. |
| LCD_DATA00–23 | Parallel display data bus | 24-bit RGB/YUV output driving TFT or EPD panels - supports both dumb (synchronous) and smart (MPU) display protocols without glue logic. |
Key Features
| Feature | Design Value |
|---|---|
| Smart DMA (SDMA) | 32-channel micro-RISC engine offloads CPU from memory-to-peripheral transfers - reduces host CPU load by >40% during high-bandwidth NAND or audio streaming. |
| Pixel Processing Pipeline (PXP) | Hardware-accelerated color-space conversion, alpha blending, rotation, and gamma mapping - enables 60 Hz WXGA UI rendering with <5% CPU utilization. |
| Electrophoretic Display Controller (EPDC) | Direct-drive support for E-Ink panels up to 2048×1536@106 Hz - eliminates external display controller IC in battery-powered e-reader and signage designs. |
| Asynchronous Sample Rate Converter (ASRC) | 10-channel concurrent sample rate conversion with −120 dB THD+N - allows simultaneous audio input from multiple codecs with independent clocks (e.g., USB mic + analog line-in). |
| Secure Non-Volatile Storage (SNVS) | Hardware-monitored tamper detection with 10 inputs, voltage/temp/clock sensors, and secure RTC - meets IEC 62443-3-3 SL2 requirements for industrial device attestation. |
Applications
| Industrial HMI Panels | IoT Edge Gateways |
|---|---|
Use Scenario: Touch-enabled operator interface in factory HMIs requiring local graphics rendering, serial fieldbus connectivity, and real-time alarm response. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based UI stack, managing parallel LCD/CSI, dual CAN for PLC communication, and dual Ethernet for SCADA network bridging. Use Value: Integrated PXP and dual CAN eliminate external FPGA or bridge ICs, reducing BOM cost by ~$1.80 and PCB area by 120 mm² versus discrete solutions. | Use Scenario: Protocol-agnostic industrial gateway aggregating Modbus RTU, CANopen, and BACnet MS/TP traffic into MQTT/HTTPS cloud uplinks. IC Role / Device Role / Timing Role: Central SoC running real-time OS, handling dual Ethernet (LAN/WAN), dual FlexCAN, 8× UARTs for legacy serial device attachment, and secure TLS offload via DCP. Use Value: On-chip HABv4 and DCP enable end-to-end encrypted firmware updates and data tunneling without external crypto co-processors - meeting NIST SP 800-193 firmware integrity requirements. |
| Portable Medical Devices | Smart Building Controllers |
Use Scenario: Battery-powered patient monitor with E-Ink display, analog biosensor ADC inputs, and Bluetooth LE wireless telemetry. IC Role / Device Role / Timing Role: Main controller executing medical firmware, driving EPDC for ultra-low-power display, sampling dual 12-bit ADCs at 10 kSPS, and managing USB OTG for configuration. Use Value: Integrated EPDC and DVFS reduce active power to 280 mW at 792 MHz and enable 14-day battery life on 2000 mAh Li-ion - exceeding IEC 62304 Class B power efficiency targets. | Use Scenario: HVAC controller interfacing with temperature/humidity sensors, relay drivers, DALI lighting bus, and building management LAN. IC Role / Device Role / Timing Role: Real-time applications processor running FreeRTOS, acquiring data via dual ADCs and I²C sensors, controlling PWM fans, and communicating over Ethernet and CAN. Use Value: Hardware ASRC synchronizes audio alerts from multiple clock domains (e.g., DALI timing vs. Ethernet PTP), eliminating software resampling jitter and ensuring <10 ms alert latency compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Y2CVM05AB | 528 MHz core, identical package and peripheral set except reduced clock speed and no LCD/CSI support. | Targeted at cost-sensitive, non-display applications like serial gateways or sensor concentrators. | Select when display/camera functionality is unnecessary and thermal/power budgets constrain maximum frequency. |
| MCIMX6Y2CVK08AB | Same 792 MHz core and feature set, but in 9×9 mm 0.5 mm pitch MAPBGA package (234 balls). | Optimized for space-constrained portable devices where PCB area is premium and routing density justifies finer pitch. | Select when board area reduction outweighs assembly complexity and rework risk of 0.5 mm pitch BGA. |
Compared with MCIMX6Y2CVM08ABR, MCIMX6Y2CVM05AB trades 50% higher CPU throughput for lower power and cost, while MCIMX6Y2CVK08AB maintains full performance in a 43% smaller footprint - enabling trade-offs between compute density, thermal design, and manufacturing capability.
Availability
MCIMX6Y2CVM08ABR is available at Aetrix Electronics and suitable for industrial HMI panels, IoT edge gateways, portable medical monitors, and smart building controllers requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6Y2CVM08ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The i.MX 6ULL family, including MCIMX6Y2CVM08ABR, was designed specifically for cost-sensitive, power-efficient industrial applications requiring rich multimedia, deterministic connectivity, and hardware-enforced security - targeting HMI, gateway, and edge node use cases.
FAQ
What is the maximum operating frequency of the MCIMX6Y2CVM08ABR processor core?
The MCIMX6Y2CVM08ABR features a single Arm Cortex-A7 core rated for a maximum operating frequency of 792 MHz under industrial temperature conditions (−40°C to +105°C). This frequency is validated per Table 10 "Operating Ranges" in the IMX6ULLIEC Rev. 1.2 datasheet and requires proper VDD_ARM regulation within 1.0–1.25 V and adequate thermal dissipation using the 14×14 mm MAPBGA package's thermal pad.
Does the MCIMX6Y2CVM08ABR support secure boot, and what cryptographic accelerators are integrated?
Yes, the MCIMX6Y2CVM08ABR supports Advanced High Assurance Boot (A-HABv4) with hardware-accelerated AES-128 encryption, SHA-1, and SHA-256 hashing. It also includes a Central Security Unit (CSU), Secure Non-Volatile Storage (SNVS) with tamper detection, and System JTAG Controller (SJC) with configurable security modes - all documented in the i.MX 6ULL Security Reference Manual (IMX6ULLSRM).
What display and camera interfaces are supported by the MCIMX6Y2CVM08ABR?
The MCIMX6Y2CVM08ABR integrates a parallel LCD interface (LCDIF) supporting up to WXGA (1366×768) at 60 Hz and a parallel camera interface (CSI) supporting 24-bit input at up to 133.3 MHz pixel clock, including BT.656 and raw Bayer formats. Both interfaces are enabled in this variant, unlike lower-tier i.MX 6ULL SKUs such as MCIMX6Y0CVM05AA.
How many Ethernet and CAN interfaces does the MCIMX6Y2CVM08ABR provide?
The MCIMX6Y2CVM08ABR includes two independent 10/100 Mbps Ethernet controllers compliant with IEEE 1588 and two FlexCAN modules supporting CAN 2.0B protocol with standard and extended frame formats. These are confirmed in Table 1 "Ordering Information" of the IMX6ULLIEC datasheet and are active in this specific part number.
What package type and ball pitch does the MCIMX6Y2CVM08ABR use?
The MCIMX6Y2CVM08ABR uses a plastic MAPBGA package measuring 14 mm × 14 mm with 0.8 mm ball pitch and 289 I/O balls, as specified in Section 6.1 "14 x 14 mm Package Information" of the IMX6ULLIEC Rev. 1.2 datasheet. This package is distinct from the 9×9 mm 0.5 mm pitch variant used in MCIMX6Y2CVK08AB.
MCIMX6Y2CVM08ABR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 289-LFBGA
- Series:
- i.MX6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 792MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR2, DDR3, DDR3L
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- Electrophoretic, LCD
- Ethernet:
- 10/100Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- 1.8V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 289-MAPBGA (14x14)
- Additional Interfaces:
- CANbus, I2C, SPI, UART
MCIMX6Y2CVM08ABR FAQ
1.How can I place an order for MCIMX6Y2CVM08ABR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Y2CVM08ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Y2CVM08ABR reliable?
The price and inventory of MCIMX6Y2CVM08ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Y2CVM08ABR is usually 5 days.
3.What payment methods are accepted for MCIMX6Y2CVM08ABR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Y2CVM08ABR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Y2CVM08ABR?
MCIMX6Y2CVM08ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Y2CVM08ABR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Y2CVM08ABR?
For technical support, including MCIMX6Y2CVM08ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Y2CVM08ABR requirements.
6.How does Aetrix verify that MCIMX6Y2CVM08ABR is sourced from the original manufacturer or authorized distributors?
All MCIMX6Y2CVM08ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Y2CVM08ABR meets industry standards.
7.What is the process for return or replacement of MCIMX6Y2CVM08ABR?
All MCIMX6Y2CVM08ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Y2CVM08ABR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Y2CVM08ABR part is unused and in its original packaging.
Return procedure for MCIMX6Y2CVM08ABR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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