NXP Semiconductors MCIMX6Y2DVK09AB

Overview

MCIMX6Y2DVK09AB from NXP Semiconductors is a single-core Arm Cortex-A7 application processor operating at 900 MHz, featuring integrated LCD/CSI interfaces, dual CAN, dual 10/100 Ethernet, two 12-bit ADCs (10 total channels), and basic hardware security (TrustZone, AES-128, SHA-256). It targets cost-sensitive, power-efficient embedded systems such as industrial HMIs and IoT gateways.

For engineers reviewing the MCIMX6Y2DVK09AB datasheet, MCIMX6Y2DVK09AB pinout, MCIMX6Y2DVK09AB application, or MCIMX6Y2DVK09AB equivalent, key selection criteria include its 9×9 mm MAPBGA package with 0.5 mm pitch, 900 MHz performance grade, dual FlexCAN support, and compatibility with LPDDR2/DDR3L/eMMC/NAND memory interfaces.

Technical Context

The MCIMX6Y2DVK09AB implements a single Arm Cortex-A7 core with 32 KB L1 instruction and data caches, 128 KB unified L2 cache, NEON MPE coprocessor, and TrustZone security. Its memory subsystem supports LPDDR2-800, DDR3-800, DDR3L-800, and managed NAND including eMMC up to v4.5.

Peripherals include two 10/100 Ethernet controllers (IEEE 1588 compliant), dual FlexCAN 2.0B modules, three SAI audio interfaces, eight UARTs (up to 5 Mbps), four I²C buses (400 kbps), four eCSPI ports (52 Mbps), and a Pixel Processing Pipeline (PXP) for real-time 2D image operations including rotation and color-space conversion.

Key Specifications

Pinout & Package

MCIMX6Y2DVK09AB is housed in a 9×9 mm, 0.5 mm pitch MAPBGA package with 289 solder balls. Pin assignments follow the i.MX 6ULL 9×9 mm ball map defined in Section 6.2 of IMX6ULLCEC Rev. 1.3, including dedicated banks for DDR, NAND, USB, Ethernet, CAN, CSI, LCDIF, and I/O multiplexing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar application processor applications.

Compared with MCIMX6Y2DVK09AB, MCIMX6Y2DVM09AB offers identical functionality in a larger package for easier assembly and thermal management, while MCIMX6Y7DVK05AB trades performance and connectivity for lower power and EPD-specific features - neither is pin-compatible nor functionally interchangeable without hardware and firmware revision.

Availability

MCIMX6Y2DVK09AB is available at Aetrix Electronics and suitable for industrial HMI, IoT gateway, and smart building controller designs requiring stable component supply, long-term lifecycle assurance, and qualified commercial-grade operation (0°C to +95°C).

Supply support for MCIMX6Y2DVK09AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based application processors and edge AI acceleration.

The i.MX 6ULL family - including MCIMX6Y2DVK09AB - was designed specifically for cost-sensitive, power-efficient Linux-capable embedded systems requiring rich peripheral integration without external PMIC or memory controllers.

FAQ

What is the maximum operating frequency of the MCIMX6Y2DVK09AB?

The MCIMX6Y2DVK09AB operates at a guaranteed maximum frequency of 900 MHz across its commercial temperature range (0°C to +95°C). This rating is validated per IMX6ULLCEC Rev. 1.3 Section 4.1 and applies to the Arm Cortex-A7 core, L1/L2 caches, and NEON coprocessor under specified voltage and thermal conditions.

Does the MCIMX6Y2DVK09AB support secure boot and hardware encryption?

Yes, the MCIMX6Y2DVK09AB includes Advanced High Assurance Boot (A-HABv4) with AES-128, SHA-1, and SHA-256 hardware acceleration engines, plus Secure Non-Volatile Storage (SNVS) with tamper detection. These features enable authenticated, encrypted boot and runtime key protection as documented in the i.MX 6ULL Security Reference Manual (IMX6ULLSRM).

What display interfaces does the MCIMX6Y2DVK09AB support?

The MCIMX6Y2DVK09AB supports a parallel LCD interface (LCDIF) driving WXGA (1366×768@60Hz) panels and an Electrophoretic Display Controller (EPDC) for E-Ink panels up to 2048×1536@106 Hz. Both interfaces are enabled in this part variant, as confirmed in Table 1 of IMX6ULLCEC Rev. 1.3.

Can the MCIMX6Y2DVK09AB interface directly with DDR3L memory?

Yes, the MCIMX6Y2DVK09AB supports DDR3L-800 memory via its Multi-Mode DDR Controller (MMDC), with full electrical compliance to JEDEC standards. The device requires external DDR3L SDRAM chips and matching termination; reference design guidelines are provided in Section 4.10 of IMX6ULLCEC Rev. 1.3.

What is the package type and ball count of the MCIMX6Y2DVK09AB?

The MCIMX6Y2DVK09AB uses a 9×9 mm plastic MAPBGA package with 0.5 mm pitch and 289 solder balls. This package variant is explicitly listed in Table 1 of IMX6ULLCEC Rev. 1.3 and corresponds to the "VK" nomenclature in the part number decoding diagram (Figure 1).