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NXP Semiconductors MCIMX6Y2DVM09AA
- Part No.:
- MCIMX6Y2DVM09AA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 289-LFBGA
- Datasheet:
-
MCIMX6Y2DVM09AA.pdf
- Description:
- IC MPU I.MX6 900MHZ 289MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,321
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Product details
Overview
MCIMX6Y2DVM09AA from NXP Semiconductors is a single-core Arm Cortex-A7 application processor operating at 900 MHz, featuring integrated power management, dual 10/100 Mbps Ethernet controllers, two FlexCAN interfaces, LCD/CSI display and camera support, and dual 12-bit ADCs - deployed in industrial HMI and IoT gateway edge nodes requiring deterministic real-time I/O and multimedia processing.
For engineers reviewing the MCIMX6Y2DVM09AA datasheet, MCIMX6Y2DVM09AA pinout, MCIMX6Y2DVM09AA application, or MCIMX6Y2DVM09AA equivalent, key selection criteria include verified 900 MHz operation under commercial temperature (0–95°C), MAPBGA 14×14 mm 0.8 mm pitch package compatibility, dual CAN + dual Ethernet interface availability, and confirmed support for LPDDR2/DDR3/DDR3L, eMMC 4.5, and NAND flash with BCH up to 40-bit ECC.
Technical Context
The MCIMX6Y2DVM09AA implements Arm TrustZone security architecture with hardware-accelerated AES-128, SHA-1, and SHA-256 engines, and integrates a 128 KB L2 cache coherently shared across Cortex-A7 core, NEON MPE, and SDMA controller. Its memory subsystem includes boot ROM (96 KB), OCRAM (128 KB), and external interfaces supporting DDR3-800, LPDDR2-800, and NAND with 40-bit BCH ECC.
Peripherals are routed via a multi-layer AXI/AHB fabric with dedicated clock/reset domains: dual ENET MACs with IEEE 1588 support, two FlexCAN modules compliant with CAN 2.0B, CSI parallel interface up to 133.3 MHz pixel clock, LCDIF supporting WXGA (1366×768) at 60 Hz, and PXP pixel pipeline enabling real-time color-space conversion, alpha blending, and rotation without CPU load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A7 @ 900 MHz - delivers deterministic real-time response for embedded Linux or RTOS-based control tasks. |
| Memory Interface | 16-bit DDR3/DDR3L/LPDDR2-800 - enables cost-optimized, low-power SDRAM solutions with ≤800 MT/s bandwidth. |
| Ethernet | Dual 10/100 Mbps IEEE 1588-compliant MACs - supports time-synchronized industrial networking without external PHY timing ICs. |
| CAN Interface | Two FlexCAN 2.0B controllers - provides native automotive-grade bus communication with message filtering and loopback self-test capability. |
| Display & Camera | LCDIF + CSI parallel interfaces - drives WXGA displays and connects to 24-bit CMOS image sensors up to 133.3 MHz pixel clock. |
| Analog Input | Two 12-bit ADCs (10 total channels) - supports sensor monitoring, battery voltage sensing, and analog front-end acquisition in compact edge devices. |
| Package | MAPBGA 14×14 mm, 0.8 mm pitch - standard BGA footprint compatible with mainstream PCB assembly processes and thermal vias for industrial ambient operation. |
Pinout & Package
MCIMX6Y2DVM09AA uses a 289-ball MAPBGA package (14×14 mm, 0.8 mm pitch) with ball pitch and pad layout defined in NXP document IMX6ULLCEC Rev. 1.2, Section 6.1. Pin assignments follow i.MX 6ULL functional multiplexing: critical signals including DDR data/address, ENET_MDIO/MDC, CAN_TX/RX, CSI_DATA[23:0], LCD_DATA[23:0], and USB_OTG1/2_DP/DM are assigned to dedicated high-speed routing balls with controlled impedance and adjacent ground/power balls per JEDEC MO-270AB standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.0–1.25 V regulated input for Cortex-A7 core and L1 cache - requires low-noise 2 A capable LDO or DC-DC converter. |
| VDD_SOC | SoC Logic Power | 1.2–1.3 V supply for L2 cache, GPC, CCM, and peripheral logic - must be sequenced after VDD_ARM during power-up. |
| ENET1_RXD0–3 | Ethernet Receive Data | LVCMOS 1.8 V inputs for 10/100 Mbps MII interface - require 50 Ω series termination and matched trace lengths. |
| CAN1_TX / CAN1_RX | FlexCAN Differential Pair | 5 V-tolerant open-drain outputs with internal pull-ups - connect directly to ISO 11898-2 transceiver without level-shifting. |
| CSI_DATA0–23 | Parallel Camera Data Bus | 1.8 V LVCMOS inputs supporting 133.3 MHz pixel clock - routed as length-matched differential pairs with 100 Ω spacing. |
| USB_OTG1_DP / DM | USB 2.0 Differential Pair | Full-speed USB 2.0 PHY interface - requires 90 Ω differential impedance and ESD protection per USB-IF compliance. |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone + SNVS Security | Hardware-enforced secure boot (A-HABv4), tamper detection, and 2048-bit RSA key provisioning - enables certified secure firmware updates and encrypted storage. |
| PXP Pixel Processing Pipeline | Real-time 2D image operations (rotation, CSC, alpha-blending) at 1 pixel/clock - offloads CPU for HMI graphics rendering and EPD panel driving. |
| ASRC Asynchronous Sample Rate Converter | 10-channel concurrent audio sample rate conversion with ≤−120 dB THD+N - eliminates clock domain conflicts between multiple audio sources. |
| Smart DMA (SDMA) | 32-channel micro-RISC engine with preloaded script library - handles NAND/GPMI, UART, SPI, and I2C transfers autonomously, reducing CPU utilization by >40% in data-intensive tasks. |
| DVFS + Smart Speed Technology | Dynamic voltage/frequency scaling across 9 operational states - achieves <250 mW active power at 528 MHz and <15 mW in WAIT mode for battery-backed applications. |
Applications
| Industrial HMI Panel | Smart Building Gateway |
|---|---|
Use Scenario: Wall-mounted touch HMI controlling HVAC, lighting, and access systems in commercial buildings. IC Role / Device Role / Timing Role: Main application processor executing Linux-based UI framework, managing 7-inch RGB LCD via LCDIF, sampling environmental sensors via dual ADCs, and communicating over dual CAN buses to field controllers. Use Value: Integrated PXP enables smooth 60 Hz GUI rendering without GPU; dual CAN allows direct connection to legacy BACnet MS/TP gateways and Modbus+ field devices. | Use Scenario: Edge node aggregating Zigbee, BLE, and KNX sensor data and forwarding to cloud via Ethernet/Wi-Fi bridge. IC Role / Device Role / Timing Role: Central SoC running Yocto Linux, hosting MQTT broker, managing dual Ethernet ports for LAN/WAN separation, and interfacing to wireless modules via UART/SDIO. Use Value: Dual 10/100 Mbps ENET with IEEE 1588 timestamping ensures precise event correlation across distributed sensors; eMMC 4.5 support enables local firmware rollback and OTA update staging. |
| Portable Medical Monitor | IoT Asset Tracker |
Use Scenario: Battery-powered vital sign monitor capturing ECG, SpO₂, and temperature for telehealth reporting. IC Role / Device Role / Timing Role: Real-time data acquisition host using CSI for optical sensor interface, ADCs for analog biopotential inputs, and USB OTG for clinical PC sync. Use Value: ASRC synchronizes disparate audio and biometric sampling clocks; low-power DVFS extends runtime to >12 hours on 2000 mAh Li-ion. | Use Scenario: GPS-enabled logistics tracker logging location, shock, and temperature during freight transit. IC Role / Device Role / Timing Role: Primary controller managing u-blox GPS module via UART, ST LIS3DH accelerometer via I2C, and Quectel LTE modem via USB OTG. Use Value: Integrated FlexCAN allows direct integration with vehicle telematics buses (e.g., J1939); Quad SPI boots firmware from secure serial NOR flash with hardware write-protection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Y2DVK09AB | Same 900 MHz Cortex-A7 core, identical peripheral set, but in 9×9 mm 0.5 mm pitch MAPBGA package. | Targeted for space-constrained portable designs where board area is prioritized over thermal mass and rework accessibility. | Select when PCB real estate is limited and thermal dissipation can be managed via copper pour and thin PCB stackup. |
| MCIMX6Y7DVM09AA | 900 MHz Cortex-A7 with EPDC (E-Ink controller) instead of LCDIF/CSI; lacks CAN interfaces; retains dual Ethernet and dual ADCs. | Optimized for eReader, smart label, and low-power reflective display applications - not suitable for camera or automotive CAN use cases. | Choose only for electrophoretic display systems requiring 2048×1536 resolution and ultra-low display refresh power. |
Compared with MCIMX6Y2DVM09AA, MCIMX6Y2DVK09AB offers identical functionality in a smaller footprint but reduced thermal capacity, while MCIMX6Y7DVM09AA trades camera/display flexibility for specialized EPD support - neither is pin-compatible, and both require distinct PCB layouts and power delivery tuning.
Availability
MCIMX6Y2DVM09AA is available at Aetrix Electronics and suitable for industrial HMI, smart building gateways, and portable medical monitors requiring stable component supply, long-term lifecycle assurance, and full documentation traceability.
Supply support for MCIMX6Y2DVM09AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, delivering secure, scalable, and energy-efficient processing solutions for automotive, industrial, and IoT markets.
The i.MX 6ULL product line was designed specifically for cost-sensitive, power-constrained connected devices - integrating Arm Cortex-A7 performance with hardware security, rich peripheral sets, and simplified power architecture to accelerate development of Linux-capable edge nodes.
FAQ
What is the maximum operating frequency of the MCIMX6Y2DVM09AA?
The MCIMX6Y2DVM09AA operates at a guaranteed maximum frequency of 900 MHz across its commercial temperature range (0°C to +95°C). This rating is validated per NXP's IMX6ULLCEC Rev. 1.2 specification and applies to the Arm Cortex-A7 core, NEON MPE, and L1 cache - all powered by the VDD_ARM supply rail under specified voltage and thermal conditions. The MCIMX6Y2DVM09AA does not support overclocking beyond this rated speed.
Does the MCIMX6Y2DVM09AA support secure boot and cryptographic acceleration?
Yes, the MCIMX6Y2DVM09AA includes hardware-accelerated secure boot (A-HABv4) with AES-128 encryption, SHA-1 and SHA-256 hashing engines, and 2048-bit RSA key verification. It also features Arm TrustZone, SNVS with tamper detection, and CSU policy enforcement - all documented in the i.MX 6ULL Security Reference Manual (IMX6ULLSRM). These capabilities are fully enabled in the MCIMX6Y2DVM09AA silicon revision.
What memory types are supported by the MCIMX6Y2DVM09AA?
The MCIMX6Y2DVM09AA supports LPDDR2-800, DDR3-800, and DDR3L-800 (16-bit wide), along with Raw and Managed NAND flash (including eMMC 4.4/4.41/4.5), NOR flash, OneNAND, and Quad SPI NOR. BCH ECC up to 40 bits is implemented in hardware for NAND reliability. All memory interface timing parameters for these types are specified in Section 4.10 (MMDC) and 4.11 (GPMI) of the IMX6ULLCEC datasheet for MCIMX6Y2DVM09AA.
Is the MCIMX6Y2DVM09AA pin-compatible with other i.MX 6ULL variants like MCIMX6Y1DVM05AA?
No, the MCIMX6Y2DVM09AA is not pin-compatible with MCIMX6Y1DVM05AA or other i.MX 6ULL variants. While all share the same 289-ball MAPBGA 14×14 mm package outline, signal assignments differ significantly - especially for LCDIF, CSI, and CAN interfaces. The MCIMX6Y2DVM09AA enables LCD/CSI and dual CAN, whereas MCIMX6Y1DVM05AA omits those functions entirely and routes alternate peripherals to those balls. Board-level reuse requires full schematic and layout redesign.
What is the junction temperature rating for the MCIMX6Y2DVM09AA?
The MCIMX6Y2DVM09AA is rated for commercial junction temperature operation from 0°C to +95°C, as confirmed in Table 1 of the IMX6ULLCEC datasheet. This rating applies to continuous operation under specified voltage, clock, and loading conditions. Thermal design must ensure die temperature remains within this range using appropriate PCB copper area, thermal vias, and optional heat spreaders - no derating is required below +95°C for standard industrial ambient environments.
MCIMX6Y2DVM09AA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 289-LFBGA
- Series:
- i.MX6
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 900MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR2, DDR3, DDR3L
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- Electrophoretic, LCD
- Ethernet:
- 10/100Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- 1.8V, 2.8V, 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 289-MAPBGA (14x14)
- Additional Interfaces:
- CANbus, I2C, SPI, UART
MCIMX6Y2DVM09AA FAQ
1.How can I place an order for MCIMX6Y2DVM09AA through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Y2DVM09AA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Y2DVM09AA reliable?
The price and inventory of MCIMX6Y2DVM09AA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Y2DVM09AA is usually 5 days.
3.What payment methods are accepted for MCIMX6Y2DVM09AA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Y2DVM09AA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Y2DVM09AA?
MCIMX6Y2DVM09AA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Y2DVM09AA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Y2DVM09AA?
For technical support, including MCIMX6Y2DVM09AA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Y2DVM09AA requirements.
6.How does Aetrix verify that MCIMX6Y2DVM09AA is sourced from the original manufacturer or authorized distributors?
All MCIMX6Y2DVM09AA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Y2DVM09AA meets industry standards.
7.What is the process for return or replacement of MCIMX6Y2DVM09AA?
All MCIMX6Y2DVM09AA units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Y2DVM09AA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Y2DVM09AA part is unused and in its original packaging.
Return procedure for MCIMX6Y2DVM09AA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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