NXP Semiconductors MCIMX6Y2DVM09AB

Overview

MCIMX6Y2DVM09AB from NXP Semiconductors is a single-core Arm Cortex-A7 application processor operating at 900 MHz, featuring integrated LCD/CSI interfaces, dual CAN, dual 10/100 Mbps Ethernet, two 12-bit ADCs (10 total channels), and basic hardware security (TrustZone, AES-128, SHA-256). It targets cost-sensitive, power-efficient embedded HMI and IoT gateway designs requiring rich peripheral integration in commercial temperature grade (0°C to +95°C).

For engineers reviewing the MCIMX6Y2DVM09AB datasheet, MCIMX6Y2DVM09AB pinout, MCIMX6Y2DVM09AB application, or MCIMX6Y2DVM09AB equivalent, key selection criteria include its 900 MHz Cortex-A7 performance with LCD/CSI support, dual FlexCAN and dual Ethernet capability, 14×14 mm MAPBGA package with 0.8 mm pitch, and compatibility with LPDDR2/DDR3/DDR3L/NAND/eMMC memory interfaces.

Technical Context

The MCIMX6Y2DVM09AB implements a single Arm Cortex-A7 core with 32 KB L1 instruction and data caches, 128 KB unified L2 cache, NEON MPE co-processor, and TrustZone security extensions. Its memory subsystem supports LPDDR2-800, DDR3-800, DDR3L-800, raw/managed NAND (with up to 40-bit BCH ECC), NOR flash, Quad SPI, and eMMC 4.41/4.5.

Peripherals include two 10/100 Mbps IEEE 1588-compliant Ethernet controllers, two FlexCAN 2.0B modules, one parallel LCD interface (up to WXGA @60 Hz), one parallel CSI interface (up to 133.3 MHz pixel clock), three SAI audio interfaces, ESAI, SPDIF, eight UARTs, four I²C, four eCSPI, eight PWM, and two 12-bit ADCs - all routed via a configurable IOMUXC with shared pin multiplexing.

Key Specifications

Pinout & Package

MCIMX6Y2DVM09AB is housed in a 14 × 14 mm plastic MAPBGA package with 0.8 mm ball pitch and 289 I/O balls. Pin assignments follow NXP's standardized i.MX 6ULL ball map (Document IMX6ULLCEC Rev. 1.3, Section 6.1), where critical functions are distributed across VDD/VSS banks for noise isolation and signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar application processor applications.

Compared with MCIMX6Y2DVM09AB, MCIMX6Y2DVK09AB trades package size for reduced I/O count and memory interface flexibility, while i.MX 6ULZ adds hardened security IP and industrial temp rating at higher cost and power - making MCIMX6Y2DVM09AB optimal for cost-sensitive commercial HMI and gateway designs needing full peripheral access in standard BGA.

Availability

MCIMX6Y2DVM09AB is available at Aetrix Electronics and suitable for industrial HMI panels, smart building gateways, and portable medical monitors requiring stable component supply, long-term lifecycle support, and consistent manufacturing qualification.

Supply support for MCIMX6Y2DVM09AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based application processors and edge AI acceleration.

The i.MX 6ULL family, including MCIMX6Y2DVM09AB, was designed specifically for cost-optimized, power-efficient Linux-capable edge devices - emphasizing integration of display, imaging, industrial networking (CAN/Ethernet), and hardware security in a single die.

FAQ

What is the maximum operating frequency of the MCIMX6Y2DVM09AB?

The MCIMX6Y2DVM09AB operates at a guaranteed maximum frequency of 900 MHz under commercial temperature conditions (0°C to +95°C). This frequency is achieved with proper core voltage regulation (VDD_ARM = 1.05 V typical) and thermal management; it is not overclockable beyond datasheet specifications. The MCIMX6Y2DVM09AB uses dynamic voltage and frequency scaling (DVFS) to maintain stability across process and temperature variations.

Does the MCIMX6Y2DVM09AB support DDR3L memory?

Yes, the MCIMX6Y2DVM09AB supports DDR3L-800 (1.35 V) alongside DDR3-800 (1.5 V) and LPDDR2-800. Its MMDC controller is configured via boot ROM and device tree to match the selected memory type, timing parameters, and voltage level. DDR3L compatibility enables lower system power consumption in always-on gateway and HMI applications where the MCIMX6Y2DVM09AB is commonly deployed.

How many CAN interfaces does the MCIMX6Y2DVM09AB include?

The MCIMX6Y2DVM09AB integrates two fully independent FlexCAN 2.0B modules, each supporting standard and extended message frames, bit rates up to 1 Mbps, and automatic retransmission. These are exposed as CAN1 and CAN2 in Linux kernel drivers and require external transceivers (e.g., TJA1042T) and 120 Ω termination. This dual-CAN capability is confirmed in Table 1 of the IMX6ULLCEC datasheet for the MCIMX6Y2DVM09AB part number.

Is the MCIMX6Y2DVM09AB pin-compatible with other i.MX 6ULL variants?

No - the MCIMX6Y2DVM09AB is not pin-compatible with smaller packages like the 9×9 mm MAPBGA (e.g., MCIMX6Y2DVK09AB), which has only 272 balls versus 289. Even within the 14×14 mm family, pinouts differ between variants with different feature sets (e.g., EPDC vs. LCD/CSI). The MCIMX6Y2DVM09AB's specific ball map is defined in Section 6.1 of IMX6ULLCEC Rev. 1.3 and must be used for layout.

What security features are enabled in the MCIMX6Y2DVM09AB?

The MCIMX6Y2DVM09AB includes Arm TrustZone, AES-128/SHA-256 hardware acceleration, Secure Non-Volatile Storage (SNVS) with tamper detection, and Advanced High Assurance Boot (A-HABv4). These features are active by default and support secure boot, encrypted firmware updates, and protected key storage - all documented in the i.MX 6ULL Security Reference Manual (IMX6ULLSRM) and verified for the MCIMX6Y2DVM09AB in the IMX6ULLCEC datasheet.