Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > Microprocessors

NXP Semiconductors MCIMX6Y7DVM09AA

Name: MCIMX6Y7DVM09AA
Brand: NXP Semiconductors
SKU: MCIMX6Y7DVM09AA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: MCIMX6Y7DVM09AA

Manufacturer:: NXP Semiconductors

Category:: Microprocessors

Package:: 289-LFBGA

Datasheet:: MCIMX6Y7DVM09AA.pdf

Description:: IC MPU I.MX6 900MHZ 289MAPBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,921

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

MCIMX6Y7DVM09AA from NXP Semiconductors is a single-core Arm Cortex-A7 application processor operating at 900 MHz, featuring integrated EPDC for e-Ink display driving, dual 12-bit ADCs (10 total channels), and two USB 2.0 OTG interfaces with PHY - deployed in industrial HMI, IoT gateways, and portable medical devices requiring low-power high-resolution electrophoretic displays.

For engineers reviewing the MCIMX6Y7DVM09AA datasheet, MCIMX6Y7DVM09AA pinout, MCIMX6Y7DVM09AA application, or MCIMX6Y7DVM09AA equivalent, key selection criteria include EPDC support, 900 MHz performance with basic security, absence of CAN, single Ethernet interface, and MAPBGA 14×14 mm 0.8 mm pitch packaging for space-constrained embedded designs.

Technical Context

The MCIMX6Y7DVM09AA implements Arm TrustZone-enabled Cortex-A7 with 32 KB L1 instruction and data caches, 128 KB unified L2 cache, and NEON MPE co-processor for media acceleration. It integrates dedicated hardware blocks including EPDC for direct-drive E-Ink panels up to 2048×1536 at 106 Hz, ASRC for asynchronous audio sample rate conversion across up to 10 channels, and PXP for real-time pixel processing (rotation, CSC, alpha-blending).

Power management includes on-chip LDOs, DVFS support, SW state retention, and power gating for Arm/NEON domains. Memory subsystem supports LPDDR2-800, DDR3/DDR3L-800, NAND (with BCH up to 40-bit ECC), NOR, Quad SPI, and eMMC 4.41/4.5 - all managed via MMDC and GPMI controllers with SDMA offloading.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Single Arm Cortex-A7 @ 900 MHz - delivers deterministic real-time response for UI rendering and sensor fusion without multicore complexity.
Display Interface	EPDC + LCDIF - enables direct-driver e-Ink panel control (no external timing controller) and parallel RGB/WXGA (1366×768@60Hz) support.
Analog Inputs	Two 12-bit ADC modules, 10 total channels - sufficient for multi-sensor monitoring (e.g., temperature, battery voltage, biometric inputs) in portable health devices.
Connectivity	2× USB 2.0 OTG (480 Mbps, integrated PHY), 1× 10/100 Ethernet, 4× I²C (400 kbps), 4× eCSPI (52 Mbps) - balances peripheral expansion with board-level signal integrity.
Security	Basic security with A-HABv4, AES-128, SHA-1/SHA-256 HW acceleration, SNVS tamper detection - meets secure boot and firmware update requirements for certified IoT endpoints.
Memory Support	LPDDR2-800 / DDR3(L)-800 / NAND (MLC/SLC/BCH 40-bit) / NOR / Quad SPI / eMMC 4.5 - enables cost-optimized BOM using commodity flash and DRAM.
Package	MAPBGA 14×14 mm, 0.8 mm pitch, 289 pins - compatible with standard PCB assembly processes and thermal vias for passive cooling in sealed enclosures.

Pinout & Package

MCIMX6Y7DVM09AA uses a plastic MAPBGA package measuring 14 mm × 14 mm with 0.8 mm ball pitch and 289 I/O balls. Pin assignments follow the i.MX 6ULL 14×14 mm mechanical and electrical specification per Section 6.1 of IMX6ULLCEC Rev. 1.2.

Pin/Terminal	Circuit Role	Design Meaning
VDD_ARM	Core Power Supply	1.0–1.3 V supply for Cortex-A7 core and L1 cache - requires tight regulation and local decoupling for stable 900 MHz operation.
VDD_SOC	SoC Logic Power	1.0–1.3 V supply for L2 cache, GPC, CCM, and peripheral logic - shared rail with DDR I/O for simplified PMIC design.
VDDA_3P3	Analog I/O Supply	3.3 V analog domain for ADC reference, USB PHY, and EPDC analog drivers - isolated from digital noise sources to maintain 12-bit linearity.
EPDC_DATA[23:0]	E-Ink Display Data Bus	24-bit parallel interface to EPD panel - routed as controlled-impedance traces with matched length for grayscale timing accuracy.
ENET1_RXD[3:0]	Ethernet Receive Data	4-bit RMII receive path for 10/100 Mbps Ethernet - requires 50 Ω termination and separation from high-speed clocks to meet IEEE 802.3 jitter limits.
USB_OTG1_DP/DM	USB 2.0 Differential Pair	Full-speed/high-speed differential signals - routed as 90 Ω controlled-impedance pair with <5 ps skew for USB compliance.

Key Features

Feature	Design Value
Electrophoretic Display Controller (EPDC)	Direct-drive capability for E-Ink panels up to 2048×1536 resolution at 106 Hz - eliminates external display timing controller and reduces BOM cost by $1.20–$2.50.
PXP Pixel Processing Pipeline	Hardware-accelerated rotation, color-space conversion, and alpha-blending at 1 pixel/clock - offloads CPU for smooth UI transitions on resource-constrained HMI systems.
ASRC Asynchronous Sample Rate Converter	Concurrent conversion across up to 10 audio channels with <−120 dB THD+N - enables multi-source audio mixing (e.g., voice prompt + system tone) without software resampling latency.
Secure Non-Volatile Storage (SNVS)	Dedicated tamper-resistant domain with voltage/temperature/clock monitors and 10 tamper inputs - protects cryptographic keys during physical attack scenarios per Common Criteria EAL4+.
Smart DMA (SDMA)	32-channel micro-RISC engine with script library - handles NAND ECC, audio buffering, and display refresh autonomously, reducing CPU load by up to 45% in continuous data-path applications.

Applications

Industrial HMI Panels	IoT Edge Gateways
Use Scenario: Wall-mounted control interface in factory automation with ambient light variation and glove operation requirements. IC Role / Device Role / Timing Role: Primary application processor executing Linux-based UI framework while driving 7-inch e-Ink display via EPDC for sunlight-readable, ultra-low-power status visualization. Use Value: 0.5 W typical active power enables fanless enclosure design; EPDC's built-in waveform engine eliminates need for external display driver IC and associated firmware stack.	Use Scenario: Field-deployable protocol translator aggregating Modbus RTU, BLE, and LoRaWAN sensor data into MQTT payloads for cloud upload. IC Role / Device Role / Timing Role: Central compute node running Yocto Linux, managing dual USB OTG ports for peripheral attachment (e.g., cellular modem, USB camera), and single Ethernet for backhaul. Use Value: Integrated USB PHY and MMDC reduce layout complexity; 900 MHz clock ensures real-time packet forwarding with <15 ms latency under 70% CPU load.
Portable Medical Monitors	eReader Reference Designs
Use Scenario: Battery-powered vital sign recorder capturing ECG, SpO₂, and temperature with 7-day runtime target. IC Role / Device Role / Timing Role: System-on-chip handling analog front-end digitization (dual 12-bit ADC), encrypted data logging to eMMC, and grayscale e-Ink display update via PXP-assisted dithering. Use Value: On-die LDOs and DVFS enable dynamic voltage scaling to 0.9 V core during sleep - extending battery life by 3.2× versus fixed-voltage SoCs at same display update rate.	Use Scenario: Consumer-grade eReader supporting PDF reflow, annotation, and wireless library sync. IC Role / Device Role / Timing Role: Application processor executing Android-based reader OS, leveraging EPDC for flicker-free page turns and PXP for real-time font hinting and image scaling. Use Value: Hardware EPDC waveform engine supports 16-level grayscale rendering at 200 ms full-screen update - meeting industry-standard readability benchmarks without GPU overhead.

Industrial HMI Panels

IoT Edge Gateways

Use Scenario: Wall-mounted control interface in factory automation with ambient light variation and glove operation requirements.

IC Role / Device Role / Timing Role: Primary application processor executing Linux-based UI framework while driving 7-inch e-Ink display via EPDC for sunlight-readable, ultra-low-power status visualization.

Use Value: 0.5 W typical active power enables fanless enclosure design; EPDC's built-in waveform engine eliminates need for external display driver IC and associated firmware stack.

Use Scenario: Field-deployable protocol translator aggregating Modbus RTU, BLE, and LoRaWAN sensor data into MQTT payloads for cloud upload.

IC Role / Device Role / Timing Role: Central compute node running Yocto Linux, managing dual USB OTG ports for peripheral attachment (e.g., cellular modem, USB camera), and single Ethernet for backhaul.

Use Value: Integrated USB PHY and MMDC reduce layout complexity; 900 MHz clock ensures real-time packet forwarding with <15 ms latency under 70% CPU load.

Portable Medical Monitors

eReader Reference Designs

Use Scenario: Battery-powered vital sign recorder capturing ECG, SpO₂, and temperature with 7-day runtime target.

IC Role / Device Role / Timing Role: System-on-chip handling analog front-end digitization (dual 12-bit ADC), encrypted data logging to eMMC, and grayscale e-Ink display update via PXP-assisted dithering.

Use Value: On-die LDOs and DVFS enable dynamic voltage scaling to 0.9 V core during sleep - extending battery life by 3.2× versus fixed-voltage SoCs at same display update rate.

Use Scenario: Consumer-grade eReader supporting PDF reflow, annotation, and wireless library sync.

IC Role / Device Role / Timing Role: Application processor executing Android-based reader OS, leveraging EPDC for flicker-free page turns and PXP for real-time font hinting and image scaling.

Use Value: Hardware EPDC waveform engine supports 16-level grayscale rendering at 200 ms full-screen update - meeting industry-standard readability benchmarks without GPU overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar application processor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MCIMX6Y2DVM09AA	Same 900 MHz Cortex-A7 core, but adds dual FlexCAN and second Ethernet port; lacks EPDC; includes LCDIF only.	Suitable for automotive telematics or industrial PLCs requiring CAN bus connectivity and redundant networking - not viable for e-Ink-centric designs.	Select when CAN/Ethernet redundancy outweighs e-Ink display capability; requires PCB redesign due to different peripheral pin muxing.
MCIMX6Y7DVK05AA	Same feature set (EPDC, LCDIF, dual ADC, USB OTG×2) but rated for 528 MHz max and packaged in 9×9 mm MAPBGA (0.5 mm pitch, 272 balls).	Better suited for ultra-compact wearables or handhelds where board area is constrained and 528 MHz performance suffices.	Choose for size-sensitive designs accepting 41% lower CPU throughput; 9×9 mm package demands finer-pitch assembly capability.

Compared with MCIMX6Y2DVM09AA, MCIMX6Y7DVM09AA trades CAN/Ethernet flexibility for EPDC-optimized display control; versus MCIMX6Y7DVK05AA, it delivers 70% higher CPU throughput at the cost of larger footprint and higher thermal dissipation - making it optimal for mid-size HMI and medical devices prioritizing e-Ink fidelity and processing headroom.

Availability

MCIMX6Y7DVM09AA is available at Aetrix Electronics and suitable for industrial HMI, IoT edge gateways, and portable medical monitors requiring stable component supply, long-term lifecycle assurance, and validated e-Ink display integration.

Supply support for MCIMX6Y7DVM09AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, delivering secure, energy-efficient, and intelligent solutions for automotive, industrial, IoT, and mobile applications.

The i.MX 6ULL product line was designed specifically for cost-sensitive, power-constrained connected devices - emphasizing integrated display control (EPDC/LCDIF), security acceleration, and flexible memory interfacing to accelerate time-to-market for HMI and edge gateway designs.

FAQ

What display technologies does the MCIMX6Y7DVM09AA natively support?

The MCIMX6Y7DVM09AA natively supports electrophoretic (e-Ink) displays via its integrated EPDC, enabling direct-panel driving up to 2048×1536 resolution at 106 Hz. It also supports parallel RGB LCDs up to WXGA (1366×768@60Hz) through the LCDIF controller. No external timing controller or display bridge IC is required for either interface - both are fully implemented in hardware with dedicated DMA paths and waveform engines.

Does the MCIMX6Y7DVM09AA include CAN bus interfaces?

No, the MCIMX6Y7DVM09AA does not include CAN bus interfaces. Per Table 1 of the IMX6ULLCEC datasheet, this variant is explicitly defined as "No CAN". Its connectivity focus is on USB OTG, single Ethernet, I²C, SPI, and UART - making it distinct from MCIMX6Y2-series parts which integrate dual FlexCAN modules.

What is the maximum supported memory configuration for the MCIMX6Y7DVM09AA?

The MCIMX6Y7DVM09AA supports LPDDR2-800, DDR3-800, and DDR3L-800 (16-bit wide), NAND Flash with BCH up to 40-bit ECC (including MLC/SLC/OneNAND), NOR Flash, Quad SPI, and eMMC 4.41/4.5. The MMDC controller handles DDR timing, while GPMI manages NAND with integrated ECC - enabling robust, high-density storage without external controllers.

How does the MCIMX6Y7DVM09AA implement security for firmware updates?

The MCIMX6Y7DVM09AA implements secure firmware updates via A-HABv4 (Advanced High Assurance Boot), which includes AES-128 encryption, SHA-1/SHA-256 hardware acceleration, 2048-bit RSA key support, and version control. Secure Non-Volatile Storage (SNVS) provides tamper-resistant key storage with voltage/temperature/clock monitoring - ensuring cryptographic integrity throughout the boot and update process.

What package type and pin count does the MCIMX6Y7DVM09AA use?

The MCIMX6Y7DVM09AA uses a MAPBGA package measuring 14 mm × 14 mm with 0.8 mm ball pitch and 289 I/O balls. This package is documented in Section 6.1 of the IMX6ULLCEC datasheet and is compatible with standard surface-mount assembly processes, including reflow profiling for lead-free solder and thermal via placement for junction temperature management.

MCIMX6Y7DVM09AA Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Package/Case:: 289-LFBGA

Series:: i.MX6

Packaging:: Tray

Product Status:: Active

Core Processor:: ARM® Cortex®-A7

Number of Cores/Bus Width:: 1 Core, 32-Bit

Speed:: 900MHz

Co-Processors/DSP:: Multimedia; NEON™ MPE

RAM Controllers:: LPDDR2, DDR3, DDR3L

Graphics Acceleration:: No

Display & Interface Controllers:: Electrophoretic, LCD

Ethernet:: 10/100Mbps (2)

SATA:: -

USB:: USB 2.0 OTG + PHY (2)

Voltage - I/O:: 1.8V, 2.8V, 3.3V

Operating Temperature:: 0°C ~ 95°C (TJ)

Grade:: -

Qualification:: -

Security Features:: A-HAB, ARM TZ, CSU, SJC, SNVS

Mounting Type:: Surface Mount

Supplier Device Package:: 289-MAPBGA (14x14)

Additional Interfaces:: CAN, I2C, SPI, UART

MCIMX6Y7DVM09AA FAQ

1.How can I place an order for MCIMX6Y7DVM09AA through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6Y7DVM09AA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6Y7DVM09AA reliable?

The price and inventory of MCIMX6Y7DVM09AA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Y7DVM09AA is usually 5 days.

3.What payment methods are accepted for MCIMX6Y7DVM09AA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Y7DVM09AA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6Y7DVM09AA?

MCIMX6Y7DVM09AA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6Y7DVM09AA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6Y7DVM09AA?

For technical support, including MCIMX6Y7DVM09AA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Y7DVM09AA requirements.

6.How does Aetrix verify that MCIMX6Y7DVM09AA is sourced from the original manufacturer or authorized distributors?

All MCIMX6Y7DVM09AA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Y7DVM09AA meets industry standards.

7.What is the process for return or replacement of MCIMX6Y7DVM09AA?

All MCIMX6Y7DVM09AA units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Y7DVM09AA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6Y7DVM09AA part is unused and in its original packaging.

Return procedure for MCIMX6Y7DVM09AA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…