NXP Semiconductors MCIMX6Z0DVM09ABR
- Part No.:
- MCIMX6Z0DVM09ABR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 289-LFBGA
- Datasheet:
-
MCIMX6Z0DVM09ABR.pdf
- Description:
- I.MX6ULZ, 289MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6Z0DVM09ABR from NXP Semiconductors is a single-core Arm Cortex-A7 application processor operating at 900 MHz, designed for ultra-low-cost connected devices. It integrates 128 KB L2 cache, on-chip power management (LDOs), and supports DDR3/DDR3L/LPDDR2, eMMC 4.5, NAND with 40-bit BCH ECC, and dual USB 2.0 OTG with integrated PHY - deployed in telematics and IoT gateways.
For engineers reviewing the MCIMX6Z0DVM09ABR datasheet, MCIMX6Z0DVM09ABR pinout, MCIMX6Z0DVM09ABR application, or MCIMX6Z0DVM09ABR equivalent, key selection criteria include commercial-grade thermal range (0–95°C), MAPBGA-289 package compatibility, TrustZone-enabled secure boot (A-HABv4), and peripheral mix including 4 UARTs, 3 SAI, ESAI, and quad SPI.
Technical Context
The MCIMX6Z0DVM09ABR implements a single Arm Cortex-A7 core with TrustZone, 32 KB L1 instruction and data caches, and 128 KB unified L2 cache. Its memory subsystem includes boot ROM (96 KB), OCRAM (128 KB), and interfaces to LPDDR2-800, DDR3-800, and NAND flash with hardware-accelerated 40-bit BCH ECC.
It features integrated power management with DVFS support, three watchdog timers (including TZ WDOG), ASRC for audio sample rate conversion, and security modules including SNVS, CSU, and A-HABv4 with AES-128, SHA-256, and 2048-bit RSA acceleration - all operating within 0–95°C junction temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single Arm Cortex-A7 with TrustZone, NEON MPE, and VFPv3 floating-point unit |
| Max Operating Frequency | 900 MHz - enables real-time Linux execution and multimedia processing in low-power edge nodes |
| L1 Cache | 32 KB instruction + 32 KB data - reduces instruction fetch latency and improves deterministic response |
| L2 Cache | 128 KB unified - buffers memory bandwidth for DDR/NAND accesses and accelerates multi-threaded workloads |
| Memory Interfaces | LPDDR2-800 / DDR3-800 / DDR3L-800 / eMMC 4.5 / NAND with 40-bit BCH - supports cost-optimized BOMs using commodity memory |
| USB Interface | Dual high-speed USB 2.0 OTG with integrated PHY - eliminates need for external transceivers in host/peripheral configurations |
| Security Features | A-HABv4, SNVS with SRTC, CSU, TZASC, and RNG - enables certified secure boot and runtime isolation for industrial firmware |
Pinout & Package
MCIMX6Z0DVM09ABR is housed in a 14 × 14 mm MAPBGA package with 0.8 mm pitch and 289 I/O balls. Pin assignments follow NXP's i.MX 6ULZ reference design layout, supporting DDR3 termination, eMMC signal integrity, and USB differential routing per IMX6ULZRM.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| XTALI / XTALO | 24 MHz crystal oscillator input/output | Primary system clock source; required for USB timing compliance and PLL reference - must be driven by 24 MHz ±50 ppm crystal or oscillator |
| RTC_XTALI / RTC_XTALO | 32.768 kHz RTC oscillator interface | Enables autonomous secure real-time clock operation in SNVS domain; supports crystal or external clock input below 100 kHz |
| NVCC_DRAM / DRAM_VREF | DDR I/O supply and reference voltage | NVCC_DRAM powers DDR pads; DRAM_VREF must be set to exactly half NVCC_DRAM via precision resistor divider for signal integrity |
| USB_OTG1_DP / USB_OTG1_DM | USB 2.0 differential pair (OTG port 1) | Full-speed/high-speed capable; requires 90 Ω differential impedance and on-die termination enabled in CCM |
| SD1_DATA0–SD1_DATA3 | eMMC/SDIO data bus (uSDHC1) | Supports 4-bit SDR/DDR modes up to 52 MHz; shared with GPIO and requires proper pad configuration in IOMUXC |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating and clock gating across CPU, NEON, and peripherals - reduces active power by >40% during audio playback or sensor polling |
| ASRC Hardware Accelerator | Concurrent 10-channel asynchronous sample rate conversion - offloads CPU for multi-source audio mixing in voice-controlled gateways |
| Quad SPI Interface | Memory-mapped read access to serial NOR flash - enables XIP execution of bootloader and firmware without external RAM initialization |
| Secure Non-Volatile Storage (SNVS) | Dedicated tamper-resistant domain with voltage/temperature/frequency monitors - protects cryptographic keys and secure RTC against physical attacks |
| Enhanced SAI (ESAI) | Full-duplex TDM-capable audio interface with independent TX/RX clocks - supports multi-microphone arrays and codec interoperability in smart appliances |
Applications
| Telematics Unit | IoT Gateway |
|---|---|
Use Scenario: In-vehicle infotainment and vehicle diagnostics reporting over cellular/Wi-Fi. IC Role / Device Role / Timing Role: Main application processor executing Linux-based telematics stack with CAN FD gateway logic and OTA update engine. Use Value: Integrated USB OTG and eMMC 4.5 enable direct firmware updates via USB stick; 900 MHz core sustains concurrent GPS parsing, BLE bridging, and UI rendering. |
Use Scenario: Edge node aggregating Zigbee/Z-Wave sensor data and forwarding to cloud via Ethernet or Wi-Fi. IC Role / Device Role / Timing Role: Central protocol translator and secure data concentrator with TLS offload and encrypted local storage. Use Value: A-HABv4 and SNVS ensure signed firmware validation and key protection; quad SPI allows fast boot from secure serial NOR. |
| Access Control Panel | Portable Medical Monitor |
Use Scenario: Touchscreen-based door controller with RFID/NFC reader, biometric sensor, and relay driver. IC Role / Device Role / Timing Role: Real-time control hub managing touch input (TSC), secure credential verification (CSU), and peripheral actuation. Use Value: TrustZone isolates biometric processing from OS; 4 UARTs support simultaneous RS485 lock network, NFC UART, and debug console. |
Use Scenario: Battery-powered vital sign monitor with ECG, SpO₂, and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Low-power health data processor running RTOS with ASRC for acoustic noise cancellation and MQS for audible alerts. Use Value: Dynamic voltage/frequency scaling extends battery life; 128 KB OCRAM enables fast wake-from-sleep ECG waveform buffering without DDR refresh. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Y2DVM09AB | Same i.MX 6ULZ family, but with 128 KB OCRAM (vs. 128 KB) and identical 900 MHz core - differs only in fuse options and minor silicon revision (B vs. A). | Identical peripheral set and thermal grade; validated for same PCB layout and software BSP. | Select when requiring latest production mask set or specific eFUSE configuration for secure boot policy enforcement. |
| MCIMX6U5DVM09AB | i.MX 6ULL variant with dual USB OTG, same 900 MHz speed, but lacks ASRC, ESAI, and SNVS RTC - uses identical MAPBGA-289 package. | Suitable for non-audio, non-secure applications where TrustZone and secure RTC are not required. | Choose for cost-sensitive designs omitting audio acceleration and cryptographic timekeeping - no PCB change needed. |
Compared with MCIMX6Z0DVM09ABR, MCIMX6Y2DVM09AB offers identical functionality with updated silicon revision, while MCIMX6U5DVM09AB trades ASRC, ESAI, and SNVS for lower gate count - making it viable only where those features are unused.
Availability
MCIMX6Z0DVM09ABR is available at Aetrix Electronics and suitable for telematics units, IoT gateways, access control panels, and portable medical monitors requiring stable component supply, long-term lifecycle support, and commercial-temperature-grade reliability.
Supply support for MCIMX6Z0DVM09ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The i.MX 6ULZ product line delivers ultra-low-cost, high-efficiency Arm-based application processors targeting resource-constrained connected devices - emphasizing integration, security, and power efficiency for edge intelligence.
FAQ
What is the maximum supported DDR3 speed for MCIMX6Z0DVM09ABR?
MCIMX6Z0DVM09ABR supports DDR3-800 (400 MHz clock, 800 MT/s data rate) with 16-bit bus width. This is confirmed in Section 4.10 "Multi-Mode DDR Controller (MMDC)" of the IMX6ULZCEC datasheet, which specifies tCK = 2.5 ns minimum and full compliance with JEDEC DDR3L-1066/800 standards under commercial temperature conditions.
Does MCIMX6Z0DVM09ABR include hardware encryption acceleration?
Yes, MCIMX6Z0DVM09ABR includes A-HABv4 with dedicated hardware engines for AES-128 encryption, SHA-1, and SHA-256 hashing, plus 2048-bit RSA key acceleration. These are documented in Section 1.2 "Features" and Section 6 "Security functions" of the IMX6ULZCEC datasheet, enabling secure boot and runtime cryptographic operations without CPU overhead.
Can MCIMX6Z0DVM09ABR operate without an external 24 MHz crystal?
Yes - MCIMX6Z0DVM09ABR can accept an external 24 MHz clock directly on XTALI while leaving XTALO unconnected, as specified in Table 3 "Special signal considerations". However, USB functionality requires strict jitter and tolerance compliance; NXP BSP assumes 24 MHz crystal unless explicitly reconfigured for oscillator input.
What is the function of the TZ WDOG module in MCIMX6Z0DVM09ABR?
The TZ WDOG (TrustZone Watchdog) in MCIMX6Z0DVM09ABR prevents TrustZone starvation by forcing a switch to secure mode if normal-world software fails to service it. As described in Table 2 and Section 3.1 of IMX6ULZCEC, it asserts a TZ-mapped interrupt on timeout and cannot be disabled or programmed from normal mode - ensuring guaranteed secure-mode entry for critical firmware updates.
How many independent audio interfaces does MCIMX6Z0DVM09ABR support?
MCIMX6Z0DVM09ABR supports three SAI modules (SAI1–SAI3), one ESAI, one SPDIF transceiver, and ASRC hardware accelerator. Per Section 1.2 and Table 2 of IMX6ULZCEC, this enables concurrent I2S/AC97/TDM audio streams - for example, SAI1 for microphone array input, ESAI for codec output, and ASRC for sample rate conversion between sources.
MCIMX6Z0DVM09ABR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 289-LFBGA
- Series:
- i.MX6ULZ
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 900MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3, DDR3L
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- Keypad
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 289-MAPBGA (14x14)
- Additional Interfaces:
- eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
MCIMX6Z0DVM09ABR FAQ
1.How can I place an order for MCIMX6Z0DVM09ABR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Z0DVM09ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Z0DVM09ABR reliable?
The price and inventory of MCIMX6Z0DVM09ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Z0DVM09ABR is usually 5 days.
3.What payment methods are accepted for MCIMX6Z0DVM09ABR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Z0DVM09ABR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Z0DVM09ABR?
MCIMX6Z0DVM09ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Z0DVM09ABR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Z0DVM09ABR?
For technical support, including MCIMX6Z0DVM09ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Z0DVM09ABR requirements.
6.How does Aetrix verify that MCIMX6Z0DVM09ABR is sourced from the original manufacturer or authorized distributors?
All MCIMX6Z0DVM09ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Z0DVM09ABR meets industry standards.
7.What is the process for return or replacement of MCIMX6Z0DVM09ABR?
All MCIMX6Z0DVM09ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Z0DVM09ABR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Z0DVM09ABR part is unused and in its original packaging.
Return procedure for MCIMX6Z0DVM09ABR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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