NXP Semiconductors MCIMX7D2DVK12SC

Overview

MCIMX7D2DVK12SC from NXP Semiconductors is a dual-core applications processor integrating two Arm Cortex-A7 cores (1.2 GHz) and one Arm Cortex-M4 core, fabricated in 28 nm LP process, housed in a 12 × 12 mm, 0.4 mm pitch BGA package with 324 pins. It supports DDR3L/LPDDR3-1066 memory, dual Gigabit Ethernet with IEEE 1588 AVB, and operates across 0 to +85°C junction temperature.

For engineers reviewing the MCIMX7D2DVK12SC datasheet, MCIMX7D2DVK12SC pinout, MCIMX7D2DVK12SC application, or MCIMX7D2DVK12SC equivalent, key selection criteria include its 1.2 GHz Cortex-A7 speed grade, absence of EPDC and CAN interfaces, single 12-bit ADC, consumer qualification tier, and 12×12 mm BGA footprint-critical for portable HMI, smart appliance, and industrial edge gateway designs requiring balanced performance and low-power operation.

Technical Context

The MCIMX7D2DVK12SC implements heterogeneous multicore architecture: dual Cortex-A7 cores (1.2 GHz, TrustZone-enabled, 32 KB L1 I/D cache each, shared 512 KB L2 cache) run Linux/Android, while the Cortex-M4 core (with FPU, MPU, 64 KB TCM) handles real-time tasks. Its memory subsystem includes boot ROM (96 KB), OCRAM (256 KB), and secure RAM (32 KB), interfacing via 32-bit DDR3L/LPDDR3-1066 controller.

Peripherals are partitioned across domains: dual AVB-capable Ethernet MACs, three eCSPI, four I²C, seven UARTs, two 12-bit ADCs (only ADC1 enabled in 12×12 package), PCIe 2.1 x1, MIPI-CSI/DSI, LCDIF, and hardware accelerators including PXP (pixel processing) and CAAM (cryptographic acceleration with 32 KB secure RAM). Power management integrates on-die LDOs and dynamic voltage/frequency scaling.

Key Specifications

Pinout & Package

MCIMX7D2DVK12SC is supplied in a plastic 12 × 12 mm BGA package with 0.4 mm pitch and 324 solder balls. Pin assignments follow the i.MX 7Dual 12×12 mm package layout defined in Section 6.1 of IMX7DCEC Rev. 7.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX7D2DVK12SC, MCIMX7D5EVK10SD adds EPDC/CAN and industrial qualification at lower frequency, while i.MX 8M Nano offers greater CPU/GPU capability in larger package-making MCIMX7D2DVK12SC optimal for cost-sensitive, low-power dual-core applications without display or CAN requirements.

Availability

MCIMX7D2DVK12SC is available at Aetrix Electronics and suitable for smart home gateways, industrial HMI panels, portable medical monitors, and smart appliance control units requiring stable component supply, long-lifecycle support, and validated reference designs.

Supply support for MCIMX7D2DVK12SC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, IoT, and mobile applications.

The i.MX 7Dual family, including MCIMX7D2DVK12SC, was engineered for ultra-low-power, high-integration applications in connected portable devices-balancing Linux-capable performance with real-time responsiveness and hardware security for trusted edge computing.

FAQ

What is the maximum operating frequency of the Cortex-A7 cores in the MCIMX7D2DVK12SC?

The MCIMX7D2DVK12SC features two Arm Cortex-A7 cores rated for operation at up to 1.2 GHz. This speed grade is confirmed in Table 1 of the IMX7DCEC Rev. 7 datasheet and requires VDD_ARM = 0.95 V ±3% and junction temperature maintained between 0°C and +85°C. The MCIMX7D2DVK12SC does not support 1.2 GHz operation outside this thermal and voltage envelope.

Does the MCIMX7D2DVK12SC include an Electronic Paper Display Controller (EPDC)?

No, the MCIMX7D2DVK12SC explicitly excludes the EPDC module, as indicated in Table 1's "Options" column: "No EPDC, No CAN". This distinguishes it from variants like MCIMX7D7DVK10SD. EPDC functionality is physically absent in this part number and cannot be enabled via software or configuration.

How many ADC channels are available on the MCIMX7D2DVK12SC, and what is their resolution?

The MCIMX7D2DVK12SC includes one functional 12-bit analog-to-digital converter (ADC1). ADC2 is not available in the 12×12 mm package per the i.MX 7Dual modules list (Table 2) and datasheet Section 6.1. Effective number of bits (ENOB) typically ranges from 9 to 10 bits depending on PCB layout and power supply noise conditions.

What package type and pin count does the MCIMX7D2DVK12SC use?

The MCIMX7D2DVK12SC uses a 12 × 12 mm plastic BGA package with 0.4 mm ball pitch and 324 solder balls. This matches the "12x12 mm 0.4 mm pitch BGA" designation in Table 1 of the IMX7DCEC Rev. 7 datasheet and is distinct from the 19×19 mm variant used in MCIMX7D2DVM12SD.

Is CAN interface supported on the MCIMX7D2DVK12SC?

No, the MCIMX7D2DVK12SC does not support CAN communication. As specified in Table 1's "Options", this variant is labeled "No EPDC, No CAN". While the i.MX 7Dual silicon includes FlexCAN IP blocks, they are disabled and unconnected in this specific part number's mask configuration.