NXP Semiconductors MCIMX7D3EVK10SD

Overview

MCIMX7D3EVK10SD from NXP Semiconductors is an industrial-grade dual-core applications processor featuring two Arm Cortex-A7 cores (1 GHz) and one Arm Cortex-M4 core, integrated DDR3L/LPDDR3 memory controller, dual Gigabit Ethernet with IEEE 1588 AVB support, and a 12-bit ADC-designed for rugged HMI, point-of-sale terminals, and portable medical devices operating from –20°C to +105°C.

For engineers reviewing the MCIMX7D3EVK10SD datasheet, MCIMX7D3EVK10SD pinout, MCIMX7D3EVK10SD application, or MCIMX7D3EVK10SD equivalent, key selection considerations include industrial temperature qualification, absence of EPDC and CAN interfaces, 12×12 mm 0.4 mm pitch BGA packaging, dual-core asymmetric OS partitioning (Linux on A7, FreeRTOS on M4), and hardware-accelerated security via CAAM and TrustZone.

Technical Context

The MCIMX7D3EVK10SD implements a heterogeneous multicore architecture: dual Cortex-A7 cores share a 512 KB L2 cache and run Linux/Android, while the Cortex-M4 core (with 64 KB TCM, FPU, MPU) handles real-time tasks independently. Its power management unit integrates multiple LDOs and supports deep-sleep states with software state retention.

It delivers interface flexibility through three uSDHC ports (including HS400), dual MIPI-CSI/DSI, parallel LCDIF, PCIe 2.1 x1, four I²C (400 kbps), seven UARTs (up to 4 Mbps), and two FlexCAN controllers-though MCIMX7D3EVK10SD excludes CAN and EPDC per ordering table specification.

Key Specifications

Pinout & Package

MCIMX7D3EVK10SD is housed in a plastic BGA package measuring 12 mm × 12 mm with 0.4 mm ball pitch and 289 I/O balls. Pin assignments follow the i.MX 7Dual 12×12 mm mechanical and signal layout defined in Section 6.1 of IMX7DCEC Rev. 7.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX7D3EVK10SD, MCIMX7D5EVM10SD offers expanded analog acquisition and physical security at the cost of PCB area and layout complexity, while MCIMX7D3DVK10SD trades industrial reliability for lower procurement cost and simplified thermal design in benign environments.

Availability

MCIMX7D3EVK10SD is available at Aetrix Electronics and suitable for industrial HMI terminals, point-of-sale systems, and portable medical monitors requiring stable component supply across multi-year production cycles.

Supply support for MCIMX7D3EVK10SD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 7Dual family-including MCIMX7D3EVK10SD-is engineered for low-power, high-reliability applications demanding real-time responsiveness, hardware-enforced security, and heterogeneous computing in resource-constrained edge devices.

FAQ

What is the maximum operating frequency of the Cortex-A7 cores in the MCIMX7D3EVK10SD?

The MCIMX7D3EVK10SD features two Arm Cortex-A7 cores rated for operation at 1 GHz. This speed grade is confirmed in Table 1 of the IMX7DCEC datasheet (Rev. 7, 09/2023) under the "Speed Grade" column for this specific part number. The 1.2 GHz variant is assigned to different orderable SKUs (e.g., MCIMX7D2DVK12SD) and is not supported by MCIMX7D3EVK10SD.

Does the MCIMX7D3EVK10SD include CAN or EPDC peripherals?

No, the MCIMX7D3EVK10SD explicitly excludes both Controller Area Network (CAN) and Electronic Paper Display Controller (EPDC) modules. This is specified in Table 1 of the IMX7DCEC datasheet, which lists "No EPDC, No CAN" under the "Options" row for MCIMX7D3EVK10SD. These functions are present in higher-tier variants like MCIMX7D7DVK10SD but are disabled or omitted in this industrial-grade configuration.

What package type and ball count does the MCIMX7D3EVK10SD use?

The MCIMX7D3EVK10SD uses a 12 mm × 12 mm plastic BGA package with 0.4 mm ball pitch and 289 I/O balls. This is documented in Section 6.1 ("12 x 12 mm package information") of the IMX7DCEC datasheet and confirmed in Table 1 under the "Package" column for this part number.

How many ADC channels does the MCIMX7D3EVK10SD support, and what is their resolution?

The MCIMX7D3EVK10SD integrates one 12-bit successive approximation register (SAR) ADC module (ADC1) with eight single-ended input channels. As stated in Table 1 and Section 6.1 of the IMX7DCEC datasheet, the 12×12 mm package variant supports only ADC1-not ADC2-which is reserved for the larger 19×19 mm package variants.

What security features are implemented in the MCIMX7D3EVK10SD?

The MCIMX7D3EVK10SD includes hardware-enforced security features: Cryptographic Acceleration and Assurance Module (CAAM) with AES/SHA/RSA engines and 32 KB secure RAM; Secure Non-Volatile Storage (SNVS) with tamper detection; High Assurance Boot (HABv4) supporting SHA-256 and 2048-bit RSA keys; Arm TrustZone for memory and interrupt isolation; and Central Security Unit (CSU) policy enforcement-all detailed in the i.MX 7Dual Security Reference Manual and confirmed in Sections 1.2 and 7 of IMX7DCEC.