NXP Semiconductors MCIMX7S3DVK08SC
- Part No.:
- MCIMX7S3DVK08SC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 488-TFBGA
- Datasheet:
-
MCIMX7S3DVK08SC.pdf
- Description:
- IC MPU I.MX7S 800MHZ 488FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX7S3DVK08SC from NXP Semiconductors is a consumer-grade i.MX 7Solo applications processor featuring an ARM Cortex-A7 core running at 800 MHz, integrated ARM Cortex-M4 real-time core, 512 KB L2 cache, and a 12×12 mm 0.4 mm pitch BGA package. It supports DDR3/DDR3L/LPDDR2/LPDDR3-1066 memory, Gigabit Ethernet with AVB, and one 12-bit ADC - deployed in smart appliances, eReaders, and portable HMI systems.
For engineers reviewing the MCIMX7S3DVK08SC datasheet, MCIMX7S3DVK08SC pinout, MCIMX7S3DVK08SC application, or MCIMX7S3DVK08SC equivalent, key selection criteria include its consumer qualification grade (0–95°C), absence of CAN interfaces, single ADC channel, and 12×12 mm BGA footprint - critical for cost-sensitive, low-power connected device designs.
Technical Context
The MCIMX7S3DVK08SC implements heterogeneous multicore architecture: the Cortex-A7 handles Linux-based application layers while the Cortex-M4 executes deterministic real-time tasks such as sensor preprocessing or secure boot verification. Its memory subsystem includes 256 KB OCRAM, 32 KB secure RAM, and external DRAM support up to 2 GB via 32-bit DDR interface.
Power management is hardware-assisted via integrated PMU, multiple LDOs, and SNVS-controlled tamper detection. Security is enforced through TrustZone, CAAM (with NIST-certified PRNG and 32 KB secure RAM), A-HABv4 boot with SHA-256 and 2048-bit RSA, and CSU-enforced security policy configuration via eFuses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A7 @ 800 MHz + Cortex-M4 - enables concurrent Linux and RTOS execution on separate cores |
| L2 Cache | 512 KB unified - reduces external memory bandwidth demand for mixed workloads |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2/LPDDR3-1066 - supports up to 2 GB DRAM with low-latency access |
| ADC | 1 × 12-bit (ENOB ~9–10 bits) - sufficient for basic sensor monitoring in consumer HMIs |
| Ethernet | 1 × 10/100/1000 Mbps with IEEE 1588 AVB - enables time-synchronized audio/video streaming |
| Package | 12×12 mm, 0.4 mm pitch BGA (196-pin) - compact footprint for space-constrained portable designs |
| Temperature Range | 0 to +95°C (Consumer grade) - suitable for indoor, non-industrial environments |
| Tamper Pins | 4 dedicated tamper detection inputs - supports physical intrusion monitoring in secure consumer devices |
Pinout & Package
MCIMX7S3DVK08SC uses a 12×12 mm plastic BGA package with 0.4 mm pitch and 196 I/O balls. Pin assignments follow the i.MX 7Solo 12×12 mm mechanical layout defined in Section 6.1 of IMX7SCEC Rev. 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply | 1.05–1.3 V input for Cortex-A7/M4 cores; requires tight regulation and local decoupling |
| VDD_SOC | SoC logic power | 1.2–1.3 V supply for DDR controller, L2 cache, and interconnect fabric |
| ENET1_RXD0–3 | Gigabit Ethernet receive data | Differential pair routing required; impedance control critical for signal integrity at 125 MHz |
| SDRAM_DQ0–31 | DDR data bus | 32-bit bidirectional interface; matched trace lengths essential for timing closure at 533 MHz |
| BOOT_MODE0–1 | Boot configuration inputs | Pulled high/low at reset to select boot source (eMMC, QSPI, SD, etc.) |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous dual-core architecture | Enables Linux + FreeRTOS coexistence without hypervisor overhead or resource contention |
| CAAM cryptographic accelerator | Offloads AES/SHA/RSA operations, reducing CPU load and enabling secure OTA updates |
| TrustZone-enabled memory isolation | Hardware-enforced separation between secure (M4/CAAM/SNVS) and non-secure (A7/Linux) domains |
| Integrated PMU with dynamic voltage scaling | Supports multiple low-power states (WAIT, STOP, SUSPEND) with sub-10 µA retention current |
| 12×12 mm BGA footprint | Reduces PCB area by ~45% vs. 19×19 mm variant - lowers system cost and thermal density |
| A-HABv4 secure boot | Validates firmware signature using eFuse-stored SRKs before code execution - prevents unauthorized firmware loading |
Applications
| Smart Appliance Control Panel | eReader Display System |
|---|---|
Use Scenario: Touch-enabled kitchen appliance UI with Wi-Fi connectivity and battery-backed clock. IC Role / Device Role / Timing Role: Main applications processor managing GUI rendering, wireless stack, and real-time clock via SNVS. Use Value: Single-chip integration eliminates external MCU + display controller, reducing BOM count and power consumption by 30% vs. discrete solutions. | Use Scenario: Low-power eInk display driver with page-turn acceleration and local PDF parsing. IC Role / Device Role / Timing Role: Host processor executing embedded Linux, driving parallel RGB interface to eInk controller, and managing SD card storage. Use Value: PXP pixel pipeline accelerates grayscale dithering and rotation - cuts display update latency by 65% versus software-only rendering. |
| Portable Medical Monitor | Home Energy Gateway |
Use Scenario: Battery-powered vital sign logger with analog sensor front-end and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Dual-core coordination: Cortex-M4 samples ADC and manages BLE link; Cortex-A7 runs health analytics and local web server. Use Value: Dedicated M4 core ensures deterministic 10 kHz ADC sampling regardless of A7 OS scheduling delays. | Use Scenario: Zigbee/Wi-Fi gateway aggregating smart meter data and exposing REST API to cloud services. IC Role / Device Role / Timing Role: Network processor handling concurrent TCP/IP stacks, TLS encryption, and time-synchronized logging via IEEE 1588 AVB Ethernet. Use Value: Hardware-accelerated CAAM reduces TLS handshake latency by 4×, enabling sub-200 ms response for cloud command acknowledgments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX7S3EVK08SC | Industrial temperature grade (–20 to +105°C), same 12×12 mm BGA and feature set | Required for outdoor or extended-temperature deployments; higher reliability screening | Select when operating environment exceeds 95°C or long-term field deployment demands industrial qualification |
| MCIMX7S5EVK08SC | Adds dual CAN FD controllers and 2× ADC channels; otherwise identical package and speed | Suitable for industrial automation nodes requiring fieldbus connectivity and redundant sensing | Choose only if CAN interface or second ADC is mandatory - adds no benefit for pure consumer HMI use cases |
Compared with MCIMX7S3DVK08SC, the MCIMX7S3EVK08SC offers extended thermal range without design change, while MCIMX7S5EVK08SC introduces CAN and extra ADC at same footprint - neither is pin-compatible drop-in replacements, but both share identical software stack and layout compatibility within the 12×12 mm family.
Availability
MCIMX7S3DVK08SC is available at Aetrix Electronics and suitable for smart appliances, eReaders, and portable medical monitors requiring stable component supply across multi-year production cycles.
Supply support for MCIMX7S3DVK08SC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of embedded systems expertise.
The i.MX 7Solo product line targets cost-sensitive, battery-aware connected devices requiring Linux-capable processing plus real-time responsiveness - optimized for HMI, portable health, and smart home edge nodes.
FAQ
What is the maximum DDR memory capacity supported by MCIMX7S3DVK08SC?
MCIMX7S3DVK08SC supports up to 2 GB of external DDR3/DDR3L/LPDDR2/LPDDR3 memory via its 32-bit interface. This capacity is determined by the DDRC controller's address space and is validated for operation at 1066 MT/s. The SoC does not integrate DDR PHY termination resistors, so external matching must be implemented per JEDEC specifications for reliable high-speed signaling.
Does MCIMX7S3DVK08SC include hardware support for secure boot?
Yes, MCIMX7S3DVK08SC implements A-HABv4 (Advanced High-Assurance Boot) with SHA-256 hashing, 2048-bit RSA signature verification, SRK revocation, and TrustZone initialization. Secure boot validation occurs in ROM before any user code executes, using eFuse-programmed keys stored in OCOTP. This prevents unauthorized firmware from loading even if flash memory is physically compromised.
Can MCIMX7S3DVK08SC drive a MIPI DSI display?
Yes, MCIMX7S3DVK08SC integrates a two-lane MIPI DSI interface capable of up to 1.5 Gbps per lane, supporting common HD and WVGA panels. The DSI PHY is fully integrated, requiring only external AC-coupling capacitors and proper impedance-controlled routing. No external level shifter or bridge IC is needed, simplifying display subsystem design.
What is the function of the four tamper pins on MCIMX7S3DVK08SC?
The four dedicated tamper pins on MCIMX7S3DVK08SC connect to external intrusion sensors (e.g., case-open switches or conductive mesh) and feed directly into the SNVS module. When triggered, they initiate immediate secure state erasure, disable debug interfaces, and log tamper events to secure non-volatile storage - meeting requirements for payment terminals and health data devices under IEC 62443 and HIPAA.
Is MCIMX7S3DVK08SC pin-compatible with other i.MX 7Solo variants in the 12×12 mm package?
Yes, all i.MX 7Solo parts in the 12×12 mm BGA package - including MCIMX7S3DVK08SC, MCIMX7S3EVK08SC, and MCIMX7S5EVK08SC - share identical pinout and ball mapping. Function differences (e.g., CAN presence or ADC count) are enabled/disabled via internal fuses and software configuration, not pin assignment - enabling single PCB design across consumer and industrial SKUs.
MCIMX7S3DVK08SC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 488-TFBGA
- Series:
- i.MX7S
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7, ARM® Cortex®-M4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- LPDDR2, LPDDR3, DDR3, DDR3L
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- Keypad, LCD, MIPI
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 488-TFBGA (12x12)
- Additional Interfaces:
- AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
MCIMX7S3DVK08SC FAQ
1.How can I place an order for MCIMX7S3DVK08SC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX7S3DVK08SC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX7S3DVK08SC reliable?
The price and inventory of MCIMX7S3DVK08SC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX7S3DVK08SC is usually 5 days.
3.What payment methods are accepted for MCIMX7S3DVK08SC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX7S3DVK08SC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX7S3DVK08SC?
MCIMX7S3DVK08SC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX7S3DVK08SC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX7S3DVK08SC?
For technical support, including MCIMX7S3DVK08SC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX7S3DVK08SC requirements.
6.How does Aetrix verify that MCIMX7S3DVK08SC is sourced from the original manufacturer or authorized distributors?
All MCIMX7S3DVK08SC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX7S3DVK08SC meets industry standards.
7.What is the process for return or replacement of MCIMX7S3DVK08SC?
All MCIMX7S3DVK08SC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX7S3DVK08SC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX7S3DVK08SC part is unused and in its original packaging.
Return procedure for MCIMX7S3DVK08SC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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