NXP Semiconductors MCIMX7U3DVK07SD

Overview

MCIMX7U3DVK07SD from NXP Semiconductors is an asymmetric heterogeneous multicore applications processor integrating an ARM Cortex-A7 core (720 MHz nominal) and an ARM Cortex-M4 core (200 MHz nominal), with 256 KB on-chip RAM, LPDDR2/LPDDR3 memory interface, and dual-domain security (CAAM in A7 domain, LTC in M4 domain). It targets ultra-low-power consumer electronics requiring deterministic real-time response alongside rich OS capability.

For engineers reviewing the MCIMX7U3DVK07SD datasheet, MCIMX7U3DVK07SD pinout, MCIMX7U3DVK07SD application, or MCIMX7U3DVK07SD equivalent, key selection criteria include its 10 mm × 10 mm BGA package (VK), absence of GPU-2D/GPU-3D support, commercial temperature range (0 to +95 °C), and dual-domain power management enabling VLPR/HSRUN mode transitions.

Technical Context

The MCIMX7U3DVK07SD implements NXP's Heterogeneous Multicore Processing (HMP) architecture with fully independent application (A7) and real-time (M4) domains-each with dedicated power, clocking, and peripheral subsystems. The A7 domain includes NEON SIMD, FPU, 32 KB I/D cache, and 256 KB L2 cache; the M4 domain features FPU, 8 KB I/D cache, and tightly coupled RAM blocks.

Communication between domains occurs via a tightly integrated bus fabric and hardware semaphores (SEMA42), while security is partitioned: CAAM handles cryptographic acceleration (AES-128/256, SHA-1/256, TRNG) in the A7 domain, and LTC provides low-power AES-128 in the M4 domain. Both domains support identical power modes: HSRUN, RUN, and VLPR at 48 MHz.

Key Specifications

Pinout & Package

MCIMX7U3DVK07SD uses a 10 mm × 10 mm, 0.5 mm pitch BGA package (VK code) with 289 balls. Pin assignments are defined in NXP document IMX7ULPCECB2, Section 10.2.2 (10×10 mm ball map) and Section 10.2.3 (power supply and functional contact assignments).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous multicore applications.

Compared with MCIMX7U3DVK07SD, MCIMX7U5DVK07SD adds GPU capability without changing footprint or power envelope, while MCIMX7U3DVP07SD retains identical functionality but trades compactness for expanded I/O count and thermal headroom.

Availability

MCIMX7U3DVK07SD is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor gateways, wearable health monitors, and secure POS terminals requiring stable component supply across long-lifecycle embedded programs.

Supply support for MCIMX7U3DVK07SD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 7ULP family-including MCIMX7U3DVK07SD-is designed for power-sensitive consumer and industrial applications requiring asymmetric multicore processing, deterministic real-time response, and robust hardware security in compact form factors.

FAQ

What is the maximum operating frequency of the Cortex-A7 core in MCIMX7U3DVK07SD?

The Cortex-A7 core in MCIMX7U3DVK07SD operates at a maximum nominal frequency of 720 MHz in High-Speed Run (HSRUN) mode. This frequency is confirmed in the official i.MX 7ULP Data Sheet (Rev. 0, 09/2020), Table on page 2, under ordering information for MCIMX7U3DVK07SD. The part does not support overclocking beyond this rated speed, and thermal management must ensure junction temperature remains within 0 to +95 °C.

Does MCIMX7U3DVK07SD include integrated graphics processing units (GPUs)?

No, MCIMX7U3DVK07SD does not include GPU-2D or GPU-3D support. As explicitly stated in the ordering information table (page 3 of the i.MX 7ULP Data Sheet), MCIMX7U3DVK07SD is differentiated from MCIMX7U5DVK07SD by the "No GPU" option. This omission reduces silicon area, power consumption, and cost-making MCIMX7U3DVK07SD optimal for applications that rely solely on CPU-driven UI or require no hardware-accelerated graphics.

What package type and dimensions does MCIMX7U3DVK07SD use?

MCIMX7U3DVK07SD uses a plastic BGA package measuring 10 mm × 10 mm with 0.5 mm ball pitch and 289 balls (package code "VK"). This is documented in the "Ordering information" section (page 3) and elaborated in Section 10.2 of the i.MX 7ULP Data Sheet (IMX7ULPCECB2, Rev. 0). The VK package offers reduced PCB area and simpler routing compared to the 14 mm × 14 mm VP variant, while maintaining full electrical and thermal compatibility with the i.MX 7ULP family.

How does MCIMX7U3DVK07SD handle secure boot and cryptographic operations?

MCIMX7U3DVK07SD implements dual-domain security: the Cryptographic Acceleration and Assurance Module (CAAM) resides in the A7 domain and supports AES-128/256, SHA-1/256, DES/3DES, and TRNG; the Low-power Trusted Cryptography (LTC) module resides in the M4 domain and supports AES-128. Both engines enable secure boot (HAB/uHAB), encrypted storage, and tamper detection-fully documented in the i.MX 7ULP Security Reference Manual and Data Sheet Sections 3.2.2 and 4.2.2.

What are the supported low-power modes for the Cortex-M4 core in MCIMX7U3DVK07SD?

The Cortex-M4 core in MCIMX7U3DVK07SD supports three primary low-power modes: High-Speed Run (HSRUN) at 200 MHz, Nominal Run (RUN) at 120 MHz, and Very Low Power Run (VLPR) at 48 MHz. These modes-and their corresponding current draw, wake-up latency, and peripheral retention-are defined in the i.MX 7ULP Data Sheet (page 5, Power mode acronym table) and detailed in the Reference Manual (IMX7ULPRM). VLPR mode enables sub-10 mA active current while retaining full M4 execution and peripheral access.