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Microchip Technology MCP1710T-25I/LZ
- Part No.:
- MCP1710T-25I/LZ
- Manufacturer:
- Microchip Technology
- Package:
- 8-VFDFN Exposed Pad
- Datasheet:
-
MCP1710T-25I/LZ.pdf
- Description:
- IC REG LINEAR 2.5V 200MA 8VDFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,908
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Product details
Overview
MCP1710T-25I/LZ from Microchip Technology is a 2.5V fixed-output, ultra-low-quiescent-current (20 nA typical) LDO linear regulator in an 8-lead 2×2 mm VDFN package. It delivers up to 200 mA output current for VR ≤ 3.5V, features 450 mV max dropout at 200 mA, operates from 2.5V–5.5V input, and includes active-low shutdown with 0.1 nA typical shutdown current. It is designed for energy harvesting and long-life battery-powered systems requiring stable low-voltage bias.
For engineers reviewing the MCP1710T-25I/LZ datasheet, MCP1710T-25I/LZ pinout, MCP1710T-25I/LZ application, or MCP1710T-25I/LZ equivalent, key selection criteria include quiescent current vs. load, dropout behavior at 200 mA, thermal performance in 2×2 VDFN, stability with 1.0 µF ceramic output capacitor, and SHDN timing (30 ms turn-on delay).
Technical Context
The MCP1710T-25I/LZ implements a CMOS-based LDO architecture with proprietary voltage reference and sensing to maintain ultra-low quiescent current across its full operating range. Its feedback loop is internally configured for fixed 2.5V output, eliminating external resistor networks.
It integrates overcurrent protection with 250 mA typical current limit (for VR ≤ 3.5V), active-low shutdown with voltage-threshold logic (70% VIN high, 30% VIN low), and is specified for operation from –40°C to +85°C junction temperature. Thermal resistance is 73.1°C/W (θJA) on JEDEC FR4 board with thermal vias.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 2.5V ±2% (guaranteed over –40°C to +85°C, supports precision analog and low-voltage MCU core rails) |
| Quiescent Current | 20 nA typical (enables multi-year battery life in sleep-mode IoT sensors and energy-harvesting nodes) |
| Shutdown Current | 0.1 nA typical (reduces standby power to negligible levels during deep-sleep or storage modes) |
| Max Output Current | 200 mA (for VR ≤ 3.5V; sufficient for powering BLE SoCs, RF transceivers, or small microcontrollers) |
| Dropout Voltage | 450 mV max at 200 mA (allows operation down to VIN = 2.95V while maintaining 2.5V output) |
| Input Voltage Range | 2.5V to 5.5V (compatible with single Li-ion, two alkaline, or regulated 3.3V/5V system rails) |
| Stability | Guaranteed with ≥1.0 µF ceramic output capacitor (reduces BOM count and PCB area vs. larger electrolytic solutions) |
Pinout & Package
Package: 8-lead 2×2 mm Very Thin Dual Flat No-lead (VDFN) with exposed thermal pad (EP), RoHS-compliant, moisture-sensitive level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 GND | Ground reference | Low-impedance return path for output current and internal circuitry; must connect to quiet ground plane or output capacitor return |
| 2 VOUT | Regulated output | Delivers stable 2.5V; requires ≥1.0 µF ceramic capacitor placed adjacent to pin for stability |
| 3, 4, 5 NC | No-connect | Internally unconnected; may be left floating or tied to GND per layout best practice |
| 6 FB | Feedback input | Internally connected to output divider; not accessible - fixed 2.5V configuration only |
| 7 VIN | Input supply | Accepts 2.5V–5.5V; recommended 2.2 µF ceramic input capacitor placed near pin to suppress noise and support dynamic load steps |
| 8 SHDN | Active-low enable | Pull low (≤30% VIN) to disable output; pull high (≥70% VIN) to enable with 30 ms typical turn-on delay |
| 9 EP | Exposed thermal pad | Electrically and thermally connected to GND; must be soldered to PCB copper pour for thermal performance (θJA = 73.1°C/W) |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low quiescent current | 20 nA typical enables >10-year battery life in 10 µA average-load applications (e.g., wireless sensor nodes) |
| Sub-nanoampere shutdown | 0.1 nA typical allows indefinite storage without measurable battery drain |
| Low-dropout operation | 450 mV max at 200 mA extends usable battery voltage range by ~150 mV vs. legacy LDOs |
| Ceramic-capacitor stability | Stable with 1.0 µF X7R/X5R ceramic output cap - eliminates ESR requirements and simplifies filtering |
| Integrated overcurrent protection | 250 mA typical current limit prevents damage during short-circuit or overload without external components |
Applications
| Energy Harvesting Node | Smart Card Power Management |
|---|---|
Use Scenario: Indoor light or thermal energy harvester powers a low-power MCU and BLE radio intermittently. IC Role / Device Role / Timing Role: Primary 2.5V bias regulator supplying MCU core and RF transceiver during active bursts. Use Value: 20 nA quiescent current minimizes leakage loss between harvest events; 200 mA peak supports radio transmit current surges. |
Use Scenario: Contactless smart card with embedded secure element and NFC interface operating from field-induced power. IC Role / Device Role / Timing Role: Ultra-low-power LDO generating clean 2.5V rail for cryptographic IC and memory during transaction windows. Use Value: Sub-1 µA total supply current preserves limited induced energy; fast 30 ms SHDN wake-up aligns with NFC polling intervals. |
| Portable Medical Sensor | Industrial Wireless Transmitter |
Use Scenario: Battery-powered wearable ECG sensor transmitting data every 5 minutes via sub-GHz radio. IC Role / Device Role / Timing Role: Main power regulator for analog front-end, ADC, and microcontroller during measurement and transmission phases. Use Value: 450 mV dropout enables operation until battery reaches 2.95V; 1.0 µF ceramic stability reduces size in compact flex PCB design. |
Use Scenario: Remote industrial pressure transmitter powered by AA batteries, reporting via LoRaWAN every hour. IC Role / Device Role / Timing Role: System-level LDO delivering regulated 2.5V to MCU, sensor, and RF module during brief active periods. Use Value: 0.1 nA shutdown current ensures <0.1 µAh/year standby loss; VDFN thermal pad sustains reliability in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B252MR-G | 2.5V fixed, 200 mA, 1 µA quiescent current (100× higher than MCP1710T-25I/LZ), SOT-25 package | Higher IQ limits use in multi-year battery applications; smaller footprint but no exposed thermal pad | Select when cost sensitivity outweighs ultra-low-IQ requirement and thermal dissipation is not critical |
| Ricoh RP114K251D-TR-F | 2.5V fixed, 150 mA, 250 nA quiescent current, DFN1006-4 package | Lower output current and higher IQ reduce suitability for 200 mA burst loads; smaller 1.0×1.0 mm footprint | Choose for space-constrained designs where 150 mA peak suffices and 250 nA IQ meets system budget |
Compared with XC6210B252MR-G and RP114K251D-TR-F, the MCP1710T-25I/LZ uniquely combines 200 mA capability with 20 nA IQ and thermal-pad-enhanced power handling-making it optimal for long-life, high-burst, thermally constrained applications where alternatives trade off current, efficiency, or thermal performance.
Availability
MCP1710T-25I/LZ is available at Aetrix Electronics and suitable for energy harvesting systems, portable medical devices, and smart card readers requiring stable component supply with guaranteed long-term availability and traceable sourcing.
Supply support for MCP1710T-25I/LZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a leading provider of microcontrollers, analog, and Flash-IP solutions, serving automotive, industrial, consumer, and communications markets with vertically integrated silicon and software.
The MCP1710 product line delivers ultra-low-power LDO regulators targeting battery- and energy-harvesting–powered edge devices where multi-year operational life and minimal standby drain are primary design constraints.
FAQ
What is the maximum input voltage rating for the MCP1710T-25I/LZ?
The MCP1710T-25I/LZ has an absolute maximum input voltage rating of 6.0V. Its operational input range is specified from 2.5V to 5.5V. Exceeding 6.0V risks permanent damage, and operation above 5.5V violates AC/DC specifications - always ensure VIN remains within 2.5V–5.5V for reliable regulation and compliance with the MCP1710T-25I/LZ datasheet limits.
Does the MCP1710T-25I/LZ require an external feedback resistor network?
No, the MCP1710T-25I/LZ does not require external feedback resistors. It is a fixed-output 2.5V LDO with internal resistor divider connected to the FB pin. The FB pin (Pin 6) is not user-accessible for adjustment - the output voltage is factory-trimmed and permanently set to 2.5V ±2%, making the MCP1710T-25I/LZ a drop-in solution for 2.5V rail generation without external components.
How does the SHDN pin behave electrically on the MCP1710T-25I/LZ?
The SHDN pin on the MCP1710T-25I/LZ is an active-low digital control input with voltage-threshold logic: a logic low (≤30% of VIN) disables the output and places the device in 0.1 nA shutdown mode; a logic high (≥70% of VIN) enables regulation with a 30 ms typical turn-on delay before VOUT reaches 95% of 2.5V. No external pull-up is required if driven actively, but a 1 MΩ pull-up to VIN is recommended in floating scenarios.
Can the MCP1710T-25I/LZ operate stably with a 1.0 µF output capacitor?
Yes, the MCP1710T-25I/LZ is explicitly characterized and guaranteed stable with a minimum 1.0 µF ceramic output capacitor (X7R or X5R dielectric). While 2.2 µF is recommended for optimal transient response and PSRR, the 1.0 µF value satisfies all stability requirements per DS20005158D - enabling compact, low-cost designs without compromising reliability of the MCP1710T-25I/LZ output regulation.
What thermal considerations apply to the exposed pad (EP) on the MCP1710T-25I/LZ?
On the MCP1710T-25I/LZ, the exposed thermal pad (Pin 9) is electrically and thermally connected to GND. It must be soldered to a PCB copper pour with thermal vias to achieve the specified θJA of 73.1°C/W. Leaving the EP unconnected degrades thermal performance significantly - potentially raising junction temperature beyond +85°C under 200 mA load - so proper EP grounding and thermal relief are mandatory for reliable MCP1710T-25I/LZ operation.
MCP1710T-25I/LZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-VFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.5V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.45V @ 200mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 20 nA
- Current - Supply (Max):
- -
- PSRR:
- 22dB (100Hz)
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VDFN (2x2)
MCP1710T-25I/LZ FAQ
1.How can I place an order for MCP1710T-25I/LZ through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP1710T-25I/LZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP1710T-25I/LZ reliable?
The price and inventory of MCP1710T-25I/LZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP1710T-25I/LZ is usually 5 days.
3.What payment methods are accepted for MCP1710T-25I/LZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP1710T-25I/LZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP1710T-25I/LZ?
MCP1710T-25I/LZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP1710T-25I/LZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP1710T-25I/LZ?
For technical support, including MCP1710T-25I/LZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP1710T-25I/LZ requirements.
6.How does Aetrix verify that MCP1710T-25I/LZ is sourced from the original manufacturer or authorized distributors?
All MCP1710T-25I/LZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP1710T-25I/LZ meets industry standards.
7.What is the process for return or replacement of MCP1710T-25I/LZ?
All MCP1710T-25I/LZ units undergo pre-shipment inspection (PSI). If there is an issue with MCP1710T-25I/LZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP1710T-25I/LZ part is unused and in its original packaging.
Return procedure for MCP1710T-25I/LZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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