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Microchip Technology MCP1825S-1802E/EB
- Part No.:
- MCP1825S-1802E/EB
- Manufacturer:
- Microchip Technology
- Package:
- TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
- Datasheet:
-
MCP1825S-1802E/EB.pdf
- Description:
- IC REG LINEAR 1.8V 500MA 3DDPAK
- Quantity:
- Payment:
- Shipping:
Inventory:412
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Product details
Overview
MCP1825S-1802E/EB from Microchip Technology is a 500 mA, fixed-output 1.8 V low-dropout (LDO) linear regulator in TO-263-3 (DDPAK-3) package, featuring 210 mV typical dropout at full load, ±0.5% output voltage tolerance, and stable operation with only 1.0 µF ceramic output capacitance. It delivers high-current, low-noise power for core logic rails in portable computing and networking backplane applications.
For engineers reviewing the MCP1825S-1802E/EB datasheet, MCP1825S-1802E/EB pinout, MCP1825S-1802E/EB application, or MCP1825S-1802E/EB equivalent, key selection criteria include dropout performance at 500 mA, quiescent current under light load, thermal resistance in DDPAK-3, compatibility with 1 µF ceramic output caps, and absence of enable or power-good pins in this 3-pin variant.
Technical Context
The MCP1825S-1802E/EB implements a PMOS pass transistor architecture enabling ultra-low dropout and fast transient response. Its internal reference and error amplifier maintain regulation across –40°C to +125°C junction temperature, with no minimum load requirement and inherent short-circuit current limiting (1.2 A typical).
Unlike the 5-pin MCP1825, this 3-pin variant omits SHDN and PWRGD functionality-simplifying layout but removing system-level power sequencing control. It relies solely on VIN, GND, and VOUT terminals, with ground-sense via the exposed tab (EP), ensuring robust thermal performance in high-power-density PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.8 V ±0.5% - ensures stable core supply for 1.8 V I/O and logic interfaces without external feedback components. |
| Max Output Current | 500 mA - supports high-current digital loads such as DDR memory termination or FPGA I/O banks. |
| Dropout Voltage | 210 mV typical at 500 mA - enables operation from 2.1 V input (e.g., single Li-ion cell or 2.5 V rail derated), minimizing power loss. |
| Quiescent Current | 120 µA typical - preserves battery life in always-on subsystems without shutdown capability. |
| Stability Capacitor | 1.0 µF ceramic (X7R/X5R) - reduces BOM count and board area versus electrolytic alternatives; ESR < 1 Ω not required. |
| Operating Temp Range | –40°C to +125°C junction - qualified for industrial and extended-temperature embedded systems. |
| Thermal Resistance (θJA) | 31.4°C/W (DDPAK-3, 4-layer board) - enables >3 W power dissipation before reaching 150°C junction limit at 25°C ambient. |
Pinout & Package
Package: TO-263-3 (DDPAK-3) with exposed thermal pad (EP) electrically connected to GND - requires soldered thermal pad for optimal heat transfer and electrical grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VIN) | Input voltage supply | Accepts 2.1 V to 6.0 V unregulated input; must be decoupled locally with ≥1 µF ceramic capacitor. |
| 2 (GND) | Ground reference and thermal path | Connects to PCB ground plane and exposed pad (EP); carries only quiescent current (120 µA), not load current. |
| 3 (VOUT) | Regulated 1.8 V output | Delivers up to 500 mA; requires ≥1.0 µF ceramic output capacitor placed adjacent to pin for stability. |
| Exposed Pad (EP) | Thermal and electrical ground | Must be soldered to large copper pour for thermal management; electrically tied to GND pin internally. |
Key Features
| Feature | Design Value |
|---|---|
| PMOS pass element | Enables 210 mV dropout at 500 mA and eliminates reverse-current flow without external diode. |
| Ceramic-capacitor stability | Guaranteed stable with 1.0 µF X7R/X5R ceramic output cap - reduces cost, size, and aging drift vs. tantalum/electrolytic. |
| Overtemperature protection | Shuts down output at 150°C junction (10°C hysteresis) - prevents thermal runaway during sustained overload or poor heatsinking. |
| Short-circuit current limit | Clamps output to 1.2 A typical during hard shorts - protects device and upstream supply while allowing safe recovery. |
| Low-noise regulation | 2.0 µV/√Hz output noise density at 1 kHz - suitable for noise-sensitive analog circuitry powered from same rail. |
Applications
| High-Speed Driver Chipset Power | Notebook Computer Core Logic Rail |
|---|---|
Use Scenario: Powers PCIe SerDes or SATA PHY driver ICs requiring clean, regulated 1.8 V at up to 500 mA peak current. IC Role / Device Role / Timing Role: Primary LDO supplying I/O voltage for high-speed serial interface chipsets. Use Value: Low dropout and fast transient response prevent signal integrity degradation during burst data transfers. | Use Scenario: Supplies 1.8 V core voltage to embedded controller (EC) or southbridge I/O buffers in ultraportable notebooks. IC Role / Device Role / Timing Role: Fixed-output LDO delivering stable rail for low-voltage logic interfaces with minimal footprint. Use Value: 120 µA quiescent current extends battery runtime in standby/suspend states without shutdown control. |
| Networking Backplane Card | 2.5 V to 1.XV Regulator |
Use Scenario: Provides 1.8 V auxiliary power to FPGA configuration I/O banks on telecom backplane cards operating from 3.3 V or 5 V mid-rails. IC Role / Device Role / Timing Role: Point-of-load regulator converting higher backplane voltages to sub-2 V logic levels. Use Value: TO-263-3 package enables high-current delivery in space-constrained card-edge layouts with direct thermal coupling to chassis. | Use Scenario: Replaces legacy 2.5 V supplies with lower-voltage 1.8 V rails for next-generation ASICs and microcontrollers. IC Role / Device Role / Timing Role: Step-down LDO enabling voltage scaling to reduce dynamic power consumption in digital SoCs. Use Value: 210 mV dropout allows efficient conversion from 2.5 V input (e.g., existing 2.5 V rail), minimizing wasted power as heat. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP1700-1802E/TO | 300 mA max output, SOT-23-5 package, 6 µA quiescent current, no thermal pad | Lower current capacity and no exposed pad limit use in high-power-density or thermally constrained designs | Select when ultra-low IQ dominates over output current and thermal performance. |
| TLS850F18TAV50 | Automotive-grade AEC-Q100, 500 mA, integrated watchdog and reset, 3.3 V/5 V input range only | Includes safety features (reset, window watchdog) and automotive qualification not present in MCP1825S-1802E/EB | Select for automotive body electronics requiring functional safety compliance. |
Compared with MCP1700-1802E/TO, MCP1825S-1802E/EB delivers 67% higher output current and superior thermal handling via DDPAK-3; compared with TLS850F18TAV50, it offers broader input range (2.1–6.0 V) and lower system cost where automotive qualification is unnecessary.
Availability
MCP1825S-1802E/EB is available at Aetrix Electronics and suitable for high-reliability industrial control, networking infrastructure, and portable computing applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for MCP1825S-1802E/EB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontroller, mixed-signal, analog, and Flash-IP solutions, serving industrial, automotive, consumer, and communications markets with vertically integrated silicon and development tools.
The MCP1825/MCP1825S product line was designed specifically for high-current, low-voltage LDO applications in space- and power-constrained portable and embedded systems, emphasizing ceramic-capacitor compatibility and thermal efficiency in surface-mount packages.
FAQ
What is the maximum input voltage rating for MCP1825S-1802E/EB?
The absolute maximum input voltage for MCP1825S-1802E/EB is 6.5 V, but the recommended operating range is 2.1 V to 6.0 V per the datasheet. Exceeding 6.0 V may compromise reliability or trigger overvoltage stress conditions not covered by specification limits. Always maintain VIN ≤ VOUT + VDROPOUT(MAX) (i.e., ≤ 2.01 V minimum at 500 mA) for proper regulation. MCP1825S-1802E/EB must never be operated above 6.5 V on the VIN pin.
Does MCP1825S-1802E/EB include a shutdown (SHDN) pin?
No, MCP1825S-1802E/EB is a 3-pin fixed-output variant and does not include a shutdown pin. Unlike the 5-pin MCP1825, it lacks SHDN and PWRGD functionality. Power control must be implemented externally (e.g., via input rail switching). This simplifies PCB layout but removes programmable enable/disable capability. MCP1825S-1802E/EB remains active whenever VIN is within specification and sufficient to sustain regulation.
Can MCP1825S-1802E/EB operate with a 1 µF output capacitor?
Yes, MCP1825S-1802E/EB is explicitly characterized and guaranteed stable with a minimum 1.0 µF ceramic (X7R/X5R) output capacitor - no ESR requirements apply. Larger values (up to 22 µF) improve PSRR and load transient response. Aluminum-electrolytic capacitors are acceptable if ESR ≤ 1 Ω, but ceramic is preferred for size, reliability, and low-temperature performance. MCP1825S-1802E/EB does not require additional compensation networks.
What is the thermal resistance (θJA) of MCP1825S-1802E/EB in its TO-263-3 package?
MCP1825S-1802E/EB in TO-263-3 (DDPAK-3) has a typical junction-to-ambient thermal resistance (θJA) of 31.4°C/W on a 4-layer JEDEC-standard board. This value assumes full soldering of the exposed thermal pad (EP) to an internal or bottom-side ground plane. Without proper thermal pad connection, θJA degrades significantly. MCP1825S-1802E/EB's θJC is 3.0°C/W, confirming efficient die-to-pad conduction when mounted correctly.
Is MCP1825S-1802E/EB compatible with lead-free reflow processes?
Yes, MCP1825S-1802E/EB is RoHS-compliant and qualified for standard lead-free reflow profiles (J-STD-020D, peak 260°C). The TO-263-3 package uses matte tin plating and withstands three reflow cycles. Ensure PCB land pattern follows Microchip's recommended footprint for DDPAK-3, including thermal pad stencil design (≥70% paste coverage) to prevent voiding and ensure mechanical reliability. MCP1825S-1802E/EB meets JEDEC moisture sensitivity level MSL-3.
MCP1825S-1802E/EB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
- Packaging:
- Tube
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 6V
- Voltage - Output (Min/Fixed):
- 1.8V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.35V @ 500mA
- Current - Output:
- 500mA
- Current - Quiescent (Iq):
- 220 µA
- Current - Supply (Max):
- -
- PSRR:
- 60dB (100Hz)
- Control Features:
- -
- Protection Features:
- Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DDPAK-3
MCP1825S-1802E/EB FAQ
1.How can I place an order for MCP1825S-1802E/EB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP1825S-1802E/EB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP1825S-1802E/EB reliable?
The price and inventory of MCP1825S-1802E/EB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP1825S-1802E/EB is usually 5 days.
3.What payment methods are accepted for MCP1825S-1802E/EB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP1825S-1802E/EB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP1825S-1802E/EB?
MCP1825S-1802E/EB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP1825S-1802E/EB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP1825S-1802E/EB?
For technical support, including MCP1825S-1802E/EB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP1825S-1802E/EB requirements.
6.How does Aetrix verify that MCP1825S-1802E/EB is sourced from the original manufacturer or authorized distributors?
All MCP1825S-1802E/EB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP1825S-1802E/EB meets industry standards.
7.What is the process for return or replacement of MCP1825S-1802E/EB?
All MCP1825S-1802E/EB units undergo pre-shipment inspection (PSI). If there is an issue with MCP1825S-1802E/EB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP1825S-1802E/EB part is unused and in its original packaging.
Return procedure for MCP1825S-1802E/EB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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