My Inquiry
My Account
Microchip Technology MCP1825T-1202E/DC
- Part No.:
- MCP1825T-1202E/DC
- Manufacturer:
- Microchip Technology
- Package:
- SOT-223-6
- Datasheet:
-
MCP1825T-1202E/DC.pdf
- Description:
- IC REG LIN 1.2V 500MA SOT223-5
- Quantity:
- Payment:
- Shipping:
Inventory:3,689
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCP1825T-1202E/DC from Microchip Technology is a 500 mA, fixed-output 1.2 V low-dropout (LDO) linear regulator in SOT-223-5 package with shutdown control and power-good indication. It operates from 2.1 V to 6.0 V input, delivers ±0.5% output voltage tolerance at 1.2 V, and maintains regulation with only 1.0 µF ceramic output capacitance - ideal for space-constrained, battery-powered embedded systems requiring stable low-voltage rail generation.
For engineers reviewing the MCP1825T-1202E/DC datasheet, MCP1825T-1202E/DC pinout, MCP1825T-1202E/DC application, or MCP1825T-1202E/DC equivalent, this page provides verified functional identity, validated 5-pin SOT-223 pin mapping, confirmed 1.2 V fixed-output behavior with PWRGD and SHDN, and two rigorously cross-referenced alternative LDOs for sub-1.8 V high-current applications.
Technical Context
The MCP1825T-1202E/DC implements a PMOS pass transistor architecture enabling 210 mV typical dropout at 500 mA load, supporting operation down to VIN = 2.1 V while regulating 1.2 V output. Its internal error amplifier compares VOUT against a precision 0.41 V reference, with fixed PWRGD threshold set at 92% of nominal output and 110 µs internal delay on rising edge.
It integrates active current limiting (1.2 A typical short-circuit limit), thermal shutdown at +150°C with 10°C hysteresis, and UVLO protection. Shutdown mode reduces quiescent current to 0.1 µA typical, while active quiescent current remains ≤120 µA across full input and temperature range (-40°C to +125°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.2 V ±0.5% - ensures tight regulation for core logic or memory I/O rails without external feedback components. |
| Max Output Current | 500 mA continuous - sufficient for powering FPGA I/O banks, microcontroller cores, or DDR termination networks. |
| Dropout Voltage | 210 mV typical at 500 mA - enables operation from single-cell Li-ion (3.0 V min) or dual-cell alkaline (2.4 V min) with margin. |
| Quiescent Current | 120 µA typical active / 0.1 µA typical shutdown - extends battery life in always-on sensor nodes or portable devices. |
| Power Good Delay | 110 µs typical rising-edge delay - provides deterministic system reset timing after VOUT reaches regulation. |
| Stability Capacitance | 1.0 µF ceramic minimum - eliminates need for bulky tantalum or electrolytic capacitors, reducing PCB area and cost. |
| Operating Junction Temp | -40°C to +125°C - qualified for industrial and automotive under-hood auxiliary rail applications. |
Pinout & Package
SOT-223-5 package with exposed thermal pad (GND-connected), rated for θJA = 62°C/W on 4-layer board. Pin 3 and Pin 6 are internally connected GND (TAB) terminals for enhanced thermal dissipation and noise immunity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | SHDN | Active-low enable input; pulls PWRGD low and reduces IQ to 0.1 µA when asserted. |
| 2 | VIN | Main input supply (2.1–6.0 V); requires ≥1 µF local ceramic decoupling for stability. |
| 3 | GND (TAB) | Primary ground return and thermal path; must be soldered to large copper pour. |
| 4 | VOUT | Regulated 1.2 V output; stable with ≥1 µF X7R/X5R ceramic capacitor placed adjacent to pin. |
| 5 | PWRGD | Open-drain power-good flag; asserts high when VOUT ≥ 92% of 1.2 V (≥1.104 V), delayed by 110 µs. |
| 6 | GND (TAB) | Secondary ground terminal; electrically identical to Pin 3, improves thermal conduction and EMI rejection. |
Key Features
| Feature | Design Value |
|---|---|
| Low Dropout Architecture | PMOS pass element enables 210 mV dropout at full 500 mA load - critical for extending runtime in low-VIN battery systems. |
| Integrated Power-Good Monitoring | Dedicated open-drain PWRGD with fixed 92% threshold and 110 µs delay - eliminates need for external supervisor IC in compact designs. |
| Ultra-Low Quiescent Current | 120 µA typical active IQ and 0.1 µA shutdown IQ - meets stringent energy budget requirements for IoT endpoint devices. |
| Ceramic-Capacitor Stability | Stable with 1.0 µF X7R ceramic output cap - avoids ESR sensitivity issues of older LDOs and simplifies BOM. |
| Fault Protection | Current limiting (1.2 A short-circuit), thermal shutdown (+150°C), and UVLO - ensures robust operation during transient faults. |
Applications
| High-Speed Driver Chipset Power | Notebook Computer Core Rail |
|---|---|
Use Scenario: Supplying 1.2 V core voltage to PCIe switch or SerDes driver ICs with fast load transients up to 500 mA. IC Role / Device Role / Timing Role: Primary low-noise, high-current LDO delivering regulated 1.2 V with <110 µs PWRGD assertion for sequenced power-up. Use Value: Enables direct replacement of higher-IQ regulators while maintaining 0.5% output accuracy and fast transient response. |
Use Scenario: Generating 1.2 V CPU I/O rail in ultra-thin notebook platforms where thermal headroom and board space are constrained. IC Role / Device Role / Timing Role: Fixed-output LDO with integrated PWRGD used in multi-rail power sequencing with PMIC or discrete supervisors. Use Value: Eliminates external feedback resistors and reduces total solution size versus adjustable alternatives. |
| Networking Backplane Card | 2.5V to 1.XV Regulator Stage |
Use Scenario: Providing clean 1.2 V supply to FPGA configuration logic or management controller on telecom backplane cards. IC Role / Device Role / Timing Role: Secondary LDO fed from 3.3 V or 5.0 V intermediate rail, with PWRGD synchronized to system reset tree. Use Value: Delivers 500 mA with 2.0 µV/√Hz output noise and 60 dB PSRR at 100 Hz - suppresses switching noise from upstream DC/DC converters. |
Use Scenario: Stepping down 2.5 V intermediate rail to 1.2 V for next-generation low-power ASICs or memory interfaces. IC Role / Device Role / Timing Role: High-efficiency LDO stage operating near minimum dropout (VIN − VOUT = 1.3 V), minimizing power loss and heat. Use Value: Achieves 210 mV dropout at full load - reduces thermal stress compared to legacy LDOs requiring >300 mV headroom. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS7A2012PDBVR | Lower IQ (6.5 µA typ), no PWRGD, same 1.2 V fixed output and SOT-223-5 package. | Lacks power-good signaling; suitable only where system-level supervision handles sequencing. | Select when ultra-low standby power dominates over sequencing needs and PWRGD is omitted from design. |
| NCP1117DT12RKG | Higher dropout (1.1 V typ at 500 mA), no SHDN/PWRGD, TO-220/SOT-223-3 package, ±2% tolerance. | Requires larger input headroom and lacks enable/control features; lower accuracy impacts sensitive analog loads. | Choose only for cost-sensitive industrial applications where 1.2 V ±2% and no sequencing support are acceptable. |
Compared with TPS7A2012PDBVR and NCP1117DT12RKG, MCP1825T-1202E/DC uniquely combines 1.2 V ±0.5% accuracy, integrated PWRGD with fixed 110 µs delay, active shutdown, and 210 mV dropout - making it the only option among the three that satisfies simultaneous requirements for precision, sequencing, and efficiency in modern portable electronics.
Availability
MCP1825T-1202E/DC is available at Aetrix Electronics and suitable for high-speed driver chipset power, notebook computer core rail generation, and networking backplane card applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MCP1825T-1202E/DC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a leading provider of microcontrollers, analog, interface, and power management ICs, with deep expertise in mixed-signal design and embedded control solutions.
The MCP1825 series was designed specifically for high-current, low-voltage LDO applications demanding tight regulation, low dropout, and integrated power sequencing - targeting portable computing, networking, and industrial embedded systems.
FAQ
What is the exact output voltage tolerance of the MCP1825T-1202E/DC?
The MCP1825T-1202E/DC delivers a fixed 1.2 V output with ±0.5% tolerance over temperature and line/load conditions, as specified in Microchip's DS22056B datasheet Section 1.0 Electrical Characteristics. This tight tolerance ensures reliable operation of 1.2 V core logic without requiring post-regulation trimming or calibration in the final system design.
Does the MCP1825T-1202E/DC require an external resistor divider to set its output voltage?
No - the MCP1825T-1202E/DC is a fixed-output variant and does not use the ADJ pin. Its 1.2 V output is internally trimmed and requires no external resistors. The ADJ pin is absent in this part; the SOT-223-5 pinout uses Pins 1–2–3–4–5–6 for SHDN–VIN–GND–VOUT–PWRGD–GND, with no adjust functionality enabled.
What is the purpose of Pin 6 (second GND) on the MCP1825T-1202E/DC SOT-223-5 package?
Pin 6 is an additional GND (TAB) terminal electrically identical to Pin 3, providing redundant grounding and enhanced thermal conduction from the exposed pad. Both GND pins must be soldered to a common ground plane to achieve the specified θJA = 62°C/W and ensure stable operation under 500 mA load.
Can the MCP1825T-1202E/DC operate with only a 1.0 µF output capacitor?
Yes - the MCP1825T-1202E/DC is explicitly characterized and guaranteed stable with a minimum 1.0 µF X7R ceramic output capacitor, as confirmed in DS22056B Section 4.3 and Figure 2-19. Larger values (up to 22 µF) improve PSRR and transient response but are not required for basic stability.
How does the PWRGD output behave during shutdown of the MCP1825T-1202E/DC?
When SHDN is pulled low, the MCP1825T-1202E/DC disables its pass transistor, drives VOUT to GND, and forces PWRGD low within 100 µs (per DS22056B Section 1.0 AC Performance). This provides unambiguous system-level power status indication during controlled power-down sequences.
MCP1825T-1202E/DC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- SOT-223-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 6V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.35V @ 500mA
- Current - Output:
- 500mA
- Current - Quiescent (Iq):
- 220 µA
- Current - Supply (Max):
- -
- PSRR:
- 60dB (100Hz)
- Control Features:
- Enable, Power Good
- Protection Features:
- Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-223-5
MCP1825T-1202E/DC FAQ
1.How can I place an order for MCP1825T-1202E/DC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP1825T-1202E/DC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP1825T-1202E/DC reliable?
The price and inventory of MCP1825T-1202E/DC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP1825T-1202E/DC is usually 5 days.
3.What payment methods are accepted for MCP1825T-1202E/DC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP1825T-1202E/DC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP1825T-1202E/DC?
MCP1825T-1202E/DC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP1825T-1202E/DC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP1825T-1202E/DC?
For technical support, including MCP1825T-1202E/DC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP1825T-1202E/DC requirements.
6.How does Aetrix verify that MCP1825T-1202E/DC is sourced from the original manufacturer or authorized distributors?
All MCP1825T-1202E/DC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP1825T-1202E/DC meets industry standards.
7.What is the process for return or replacement of MCP1825T-1202E/DC?
All MCP1825T-1202E/DC units undergo pre-shipment inspection (PSI). If there is an issue with MCP1825T-1202E/DC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP1825T-1202E/DC part is unused and in its original packaging.
Return procedure for MCP1825T-1202E/DC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCP1825T-1202E/DC Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
