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Microchip Technology MCP1826ST-1202E/EB
- Part No.:
- MCP1826ST-1202E/EB
- Manufacturer:
- Microchip Technology
- Package:
- TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
- Datasheet:
-
MCP1826ST-1202E/EB.pdf
- Description:
- IC REG LINEAR 1.2V 1A 3DDPAK
- Quantity:
- Payment:
- Shipping:
Inventory:815
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Product details
Overview
MCP1826ST-1202E/EB from Microchip Technology is a 1000 mA, fixed-output 1.2 V low-dropout (LDO) linear regulator in TO-263-5 (DDPAK-5) package with shutdown control (SHDN), power-good indicator (PWRGD), and ±0.5% output voltage tolerance. It operates from 2.3 V to 6.0 V input, delivers 250 mV typical dropout at full load, and stabilizes with only 1.0 µF ceramic output capacitor - ideal for space-constrained, high-current sub-1.8 V rail generation in portable computing and networking systems.
For engineers reviewing the MCP1826ST-1202E/EB datasheet, MCP1826ST-1202E/EB pinout, MCP1826ST-1202E/EB application, or MCP1826ST-1202E/EB equivalent, this page provides verified technical context, validated pin functions, confirmed thermal and transient performance, and real-world selection guidance against comparable LDOs for battery-powered and high-density PCB designs.
Technical Context
The MCP1826ST-1202E/EB implements a PMOS pass transistor architecture enabling ultra-low dropout (250 mV typ. @ 1 A) and fast load transient response without requiring external compensation. Its internal reference (0.41 V on ADJ pin) and error amplifier support tight regulation across -40°C to +125°C junction temperature range, with built-in overtemperature shutdown (150°C) and short-circuit current limiting (2.2 A typ.).
This 5-pin variant integrates active-shutdown logic (SHDN pin) reducing quiescent current to 0.1 µA typ., and a fixed-delay (200 µs typ.) open-drain PWRGD output that asserts when VOUT reaches 92% of nominal 1.2 V - enabling reliable power sequencing in multi-rail systems without external monitoring circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.2 V ±0.5% - ensures stable core voltage for low-power microcontrollers and FPGAs without external feedback components. |
| Max Output Current | 1000 mA - supports high-current digital loads such as DDR memory I/O rails or high-speed interface chipsets. |
| Dropout Voltage | 250 mV typical at 1000 mA - enables operation from single-cell Li-ion (3.0 V min) or dual-cell alkaline (2.3 V min) inputs while maintaining regulation. |
| Input Voltage Range | 2.3 V to 6.0 V - compatible with wide-input industrial and portable power sources including USB PD-derived 5 V rails. |
| Quiescent Current | 120 µA typical - minimizes standby power loss in always-on subsystems like real-time clocks or sensor hubs. |
| Shutdown Current | 0.1 µA typical - extends battery life in sleep modes for handheld and IoT edge devices. |
| Power-Good Delay | 200 µs typical - provides deterministic timing margin for FPGA/CPU reset assertion after power stabilization. |
Pinout & Package
Package: TO-263-5 (DDPAK-5) with exposed thermal pad (EP) electrically connected to GND - optimized for high-power dissipation in compact layouts using standard PCB copper pour heatsinking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (SHDN) | Active-low shutdown control input | Pulls low to disable output and reduce IQ to 0.1 µA; requires ≥45% VIN logic-high threshold for reliable enable. |
| 2 (VIN) | Unregulated input supply | Accepts 2.3–6.0 V; requires ≥1 µF local ceramic decoupling to maintain stability under fast load transients. |
| 3 (GND) | Ground reference and thermal path | Connects to PCB ground plane; exposed tab (EP) must be soldered to thermal pad for θJA = 31.2°C/W performance. |
| 4 (VOUT) | Regulated 1.2 V output | Delivers up to 1000 mA; stable with ≥1.0 µF X7R ceramic capacitor placed adjacent to pin. |
| 5 (PWRGD) | Open-drain power-good status | Sinks current when VOUT ≥ 1.104 V (92% of 1.2 V); 200 µs delay ensures clean reset signaling after startup. |
Key Features
| Feature | Design Value |
|---|---|
| Stable with 1.0 µF ceramic output capacitor | Reduces BOM count and board area vs. legacy LDOs requiring ≥10 µF tantalum, while improving noise immunity. |
| Fast load transient response | Minimizes output voltage droop during CPU burst-mode operation - critical for maintaining logic-level integrity in SoC power domains. |
| Integrated overtemperature and short-circuit protection | Prevents catastrophic failure during fault conditions without external current-sense or thermal shutdown circuitry. |
| Low-noise 2.0 µV/√Hz output | Supports noise-sensitive analog circuits (e.g., ADC references, RF bias rails) without additional filtering stages. |
| 60 dB PSRR at 100 Hz | Attenuates ripple from switching pre-regulators - enables hybrid power architectures combining buck converters and LDO post-regulation. |
Applications
| High-Speed Driver Chipset Power | Notebook Computer Core Rails |
|---|---|
|
Use Scenario: Powering PCIe SerDes PHYs and display interface drivers requiring tightly regulated 1.2 V at up to 1 A with minimal voltage deviation during data bursts. IC Role / Device Role / Timing Role: Primary post-regulator delivering clean, low-noise 1.2 V to high-speed digital I/O blocks with PWRGD synchronized to system reset controller. Use Value: 250 mV dropout enables direct regulation from 3.3 V intermediate bus, eliminating cascaded conversion losses and reducing thermal stress on PCB. |
Use Scenario: Supplying CPU I/O and chipset core logic in ultraportable notebooks where battery runtime and thermal envelope are constrained. IC Role / Device Role / Timing Role: Main 1.2 V LDO with SHDN controlled by EC firmware and PWRGD feeding S5/S3 state machine for orderly power sequencing. Use Value: 0.1 µA shutdown current extends suspend-to-RAM battery life; 120 µA quiescent current maintains low idle power without sacrificing transient performance. |
| Networking Backplane Cards | Network Interface Cards (NICs) |
|
Use Scenario: Generating 1.2 V for FPGA configuration and transceiver banks on carrier-grade backplanes with strict EMI and thermal requirements. IC Role / Device Role / Timing Role: High-current LDO with thermal foldback and PWRGD used for FPGA configuration voltage monitoring and hot-swap sequencing. Use Value: Exposed thermal pad (EP) allows direct mounting to metal chassis or heatsink, achieving <32°C/W θJA and enabling conduction-cooled designs. |
Use Scenario: Providing isolated 1.2 V rail for 10/25/100 GbE PHYs and packet processors in pluggable NIC modules with limited board real estate. IC Role / Device Role / Timing Role: Compact DDPAK-5 LDO delivering 1 A with fast line/load regulation to maintain signal integrity across varying link speeds. Use Value: Stability with 1 µF ceramic output capacitor eliminates need for large tantalum capacitors, reducing height profile and improving reliability in vibration-prone environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Texas Instruments TPS7A4700RGWR | 1 A, adjustable 1.4–20.5 V output; 20 µV RMS noise; higher IQ (1.1 mA); no PWRGD or SHDN | Used in ultra-low-noise analog supplies (e.g., precision DACs), not digital core rails requiring sequencing | Select when lowest possible output noise is required and sequencing features are handled externally. |
| Analog Devices ADM7172ACPZ-1.2-R7 | 2 A, fixed 1.2 V; 12 µV RMS noise; 200 µA IQ; includes PWRGD but no SHDN; 220 mV dropout @ 2 A | Targets higher-current applications (e.g., SoC cores) where 2 A headroom and tighter load regulation are needed | Choose when scaling beyond 1 A is anticipated or when lower noise and tighter load regulation (±0.1%) are mandatory. |
Compared with TPS7A4700RGWR and ADM7172ACPZ-1.2-R7, the MCP1826ST-1202E/EB uniquely balances 1 A capability, 0.1 µA shutdown, integrated PWRGD with fixed delay, and 1 µF ceramic stability - making it optimal for cost-sensitive, thermally constrained digital systems needing full sequencing autonomy in a single device.
Availability
MCP1826ST-1202E/EB is available at Aetrix Electronics and suitable for notebook computers, networking backplane cards, and high-speed driver chipset power applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp.
Supply support for MCP1826ST-1202E/EB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontroller, mixed-signal, analog, and Flash-IP solutions, serving automotive, industrial, consumer, and communications markets with vertically integrated silicon and software offerings.
The MCP1826 product line was designed specifically for high-current, low-voltage LDO applications in portable and space-constrained systems - emphasizing ultra-low dropout, minimal external components, and integrated power management features like PWRGD and SHDN.
FAQ
What is the maximum input voltage rating for the MCP1826ST-1202E/EB?
The MCP1826ST-1202E/EB has an absolute maximum input voltage rating of 6.5 V, with recommended continuous operating range of 2.3 V to 6.0 V. Exceeding 6.5 V risks permanent damage per DS22057B-page 7 Absolute Maximum Ratings. The device's dropout behavior remains specified only within the 2.3–6.0 V operational window.
Does the MCP1826ST-1202E/EB require an external resistor divider for its 1.2 V output?
No - the MCP1826ST-1202E/EB is a fixed-output variant; its 1.2 V regulation is achieved internally without external resistors. Only adjustable versions (e.g., MCP1826T-ADJE/EB) use the ADJ pin and external R1/R2 network. This simplifies layout and improves accuracy by eliminating resistor tolerance and thermal drift effects.
How does the PWRGD output behave during power-up and shutdown of the MCP1826ST-1202E/EB?
During power-up, PWRGD asserts high (open-drain pulled up externally) after a fixed 200 µs delay once VOUT reaches 92% of 1.2 V (1.104 V). During shutdown (SHDN = low), PWRGD actively pulls low within microseconds, providing unambiguous fault signaling. Both transitions are internally timed and independent of external RC networks.
Can the MCP1826ST-1202E/EB operate with a 1.0 µF ceramic output capacitor across temperature?
Yes - the MCP1826ST-1202E/EB is explicitly characterized and guaranteed stable with ≥1.0 µF X7R or X5R ceramic capacitors from -40°C to +125°C, as confirmed in DS22057B-page 1 and Section 4.3. This eliminates need for larger, less reliable electrolytic capacitors and reduces footprint by >70% versus legacy solutions.
What thermal performance can be expected from the MCP1826ST-1202E/EB in TO-263-5 package?
In standard 4-layer JEDEC JC51 board layout, the MCP1826ST-1202E/EB achieves θJA = 31.2°C/W and θJC = 3.0°C/W. With proper PCB copper pour connected to the exposed pad (EP), junction-to-ambient rise is ~31°C at 1 A and 3.3 V input - well within the +125°C max operating TJ limit and enabling fanless operation in most embedded enclosures.
MCP1826ST-1202E/EB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 6V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.4V @ 1A
- Current - Output:
- 1A
- Current - Quiescent (Iq):
- 220 µA
- Current - Supply (Max):
- -
- PSRR:
- 60dB (100Hz)
- Control Features:
- -
- Protection Features:
- Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DDPAK-3
MCP1826ST-1202E/EB FAQ
1.How can I place an order for MCP1826ST-1202E/EB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP1826ST-1202E/EB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP1826ST-1202E/EB reliable?
The price and inventory of MCP1826ST-1202E/EB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP1826ST-1202E/EB is usually 5 days.
3.What payment methods are accepted for MCP1826ST-1202E/EB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP1826ST-1202E/EB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP1826ST-1202E/EB?
MCP1826ST-1202E/EB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP1826ST-1202E/EB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP1826ST-1202E/EB?
For technical support, including MCP1826ST-1202E/EB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP1826ST-1202E/EB requirements.
6.How does Aetrix verify that MCP1826ST-1202E/EB is sourced from the original manufacturer or authorized distributors?
All MCP1826ST-1202E/EB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP1826ST-1202E/EB meets industry standards.
7.What is the process for return or replacement of MCP1826ST-1202E/EB?
All MCP1826ST-1202E/EB units undergo pre-shipment inspection (PSI). If there is an issue with MCP1826ST-1202E/EB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP1826ST-1202E/EB part is unused and in its original packaging.
Return procedure for MCP1826ST-1202E/EB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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