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Microchip Technology MCP2003B-E/SN
- Part No.:
- MCP2003B-E/SN
- Manufacturer:
- Microchip Technology
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
MCP2003B-E/SN.pdf
- Description:
- IC TRANSCEIVER HALF 1/1 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:20,758
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Product details
Overview
MCP2003B-E/SN from Microchip Technology is a LIN 2.2-compliant transceiver IC designed for automotive and industrial serial bus communication. It provides bidirectional, half-duplex physical layer interface between a microcontroller (e.g., PIC® EUSART) and the LIN bus, supports up to 20 Kbaud, operates from 5.5V–30.0V supply, features ±35V/±85V direct-capacitor-coupling robustness per SAE J2962-1, and delivers <15 µA power-down current.
For engineers reviewing the MCP2003B-E/SN datasheet, MCP2003B-E/SN pinout, MCP2003B-E/SN application, or MCP2003B-E/SN equivalent, this page delivers verified electrical specs, thermal shutdown behavior, LIN bus timing compliance, wake-up mode transitions, and validated alternative transceivers for automotive node design.
Technical Context
The MCP2003B-E/SN implements a slope-controlled LIN driver with internal 30 kΩ pull-up enabled only in Operation mode, automatic thermal shutdown at +180°C, and recessive-state detection via RXD monitoring (>2.5V required when LBUS recessive). Its receiver includes hysteresis (0.175×VBB) and supports bus short-to-ground recovery.
It operates across three key modes: Ready (receiver active, transmitter off), Operation (full TX/RX/VREN enabled), and Power-Down (5–15 µA quiescent, wakeable via WAKE falling edge or LBUS rising edge). Fault handling includes TXD dominant timeout (~25 ms), bus contention detection (RX=high/TX=low), and VBB undervoltage lockout (VBBUV_FALL = 3.8–4.4 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Baud Rate | Up to 20 Kbaud - meets LIN 2.2, SAE J2602, and ISO 17987 timing requirements for master/slave nodes. |
| Supply Voltage | 5.5V–30.0V continuous - supports wide automotive battery range including cold-crank and load-dump conditions. |
| Power-Down Current | 6–20 µA - enables ultra-low-power sleep in body control modules and sensor nodes requiring long-term battery operation. |
| ESD Immunity (LBUS) | >25 kV per SAE J2962-1 - eliminates need for external TVS diode in many LIN slave applications. |
| Bus Voltage Range | −18V to +50V continuous, −27V to +60V transient - withstands ISO 7637-2 load dump and reverse-battery stress. |
| Thermal Shutdown | +180°C trigger, +160°C recovery - protects against sustained bus short-circuit or ambient overtemperature. |
| Operating Temperature | −40°C to +125°C (Extended E grade) - qualified for under-hood and chassis-mounted automotive locations. |
Pinout & Package
Package: 8-lead SOIC (150 mil), Pb-free, RoHS-compliant. Exposed pad (EP) not electrically connected; recommended for thermal relief only.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RXD | Open-drain receive data output | Follows LBUS state (dominant/recessive); must be pulled up externally (>2.5V) during operation to avoid TOFF mode. |
| CS | Chip select input (TTL) | Internally pulled down; high level enables transmitter; used for local wake-up or mode control. |
| WAKE | Wake-up input (HV tolerant) | Falling edge wakes device from Power-Down; internal 800 kΩ pull-up to VBB ensures default high state. |
| TXD | Transmit data input (TTL) | Drives LBUS dominant (low) or recessive (high); includes 25 ms dominant timeout for bus fault protection. |
| VSS | Ground reference | Primary return path; floating VSS increases leakage (IBBNOGND ≤ ±1 mA) but does not disable function. |
| LBUS | Bi-directional LIN bus terminal | Current-limited open-collector output; slope-controlled edges reduce EMI; supports ±35V/±85V capacitor coupling. |
| VBB | Battery positive supply | 5.5–30 V input; includes undervoltage lockout (VBBUV_RISE = 5.5–6.0 V) and 60 V load-dump tolerance. |
| VREN | Voltage regulator enable output | Open-drain output pulled high to VBB in all modes except Power-Down; drives external LDO enable pin. |
Key Features
| Feature | Design Value |
|---|---|
| LIN Specification Compliance | Full support for LIN Bus Spec Rev 2.2, SAE J2602, ISO 17987, and legacy LIN 1.3/2.0/2.1 - ensures interoperability in multi-vendor networks. |
| Direct Capacitor Coupling Robustness | Passes SAE J2962-1 tests at ±35V and ±85V on LBUS without TVS - reduces BOM count and PCB area in slave nodes. |
| High EMI/RF Immunity | Meets stringent OEM EMC requirements - validated for operation in noisy engine bay and chassis environments. |
| Automatic Thermal Protection | Self-recovering shutdown at +180°C with +160°C hysteresis - prevents latch-up during sustained bus shorts or high ambient. |
| Low-Power Wake-Up Architecture | 5 µA Power-Down current with dual wake sources (WAKE pin or LBUS activity) - extends battery life in always-on modules. |
Applications
| Body Control Module (BCM) | Seat Position Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, interior lighting, and mirror adjustment using distributed LIN slaves. IC Role / Device Role / Timing Role: Physical layer transceiver enabling reliable 20 Kbaud communication between BCM MCU and peripheral actuators/sensors. Use Value: Integrated 30 kΩ slave termination resistor and ±85V capacitor-coupling robustness eliminate external components and improve system-level ESD resilience. |
Use Scenario: Real-time feedback of seat track position, recline angle, and heater status to vehicle infotainment or ADAS systems. IC Role / Device Role / Timing Role: LIN bus interface for analog sensor signal conditioning ICs or low-power MCUs in space-constrained seat assemblies. Use Value: 6–15 µA Power-Down current and remote wake capability via LBUS allow seamless integration into battery-powered seat modules. |
| Roof Module (Sunroof/Climate) | Steering Column Switch Interface |
Use Scenario: Coordination of sunroof motor, ambient light sensor, and HVAC fan speed via LIN sub-network linked to main CAN gateway. IC Role / Device Role / Timing Role: LIN transceiver providing galvanically isolated, slope-controlled bus drive and high-noise immunity in high-EMI roof cavity. Use Value: 75 °C/W θJA (SOIC) and thermal shutdown ensure safe operation near heat-generating motors and electronics. |
Use Scenario: Aggregation of turn-signal, wiper, cruise, and horn switch inputs into a single LIN message stream sent to body domain controller. IC Role / Device Role / Timing Role: Robust LIN interface for microcontrollers in vibration-prone steering column environments with frequent ground noise. Use Value: Loss-of-ground protection and >25 kV LBUS ESD immunity prevent spurious resets or bus lockup during mechanical wear or moisture ingress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCAN1042VDQ1 | Higher VBB max (40 V), integrated 120 Ω termination, no VREN output, AEC-Q100 Grade 1 (−40°C to +125°C) | Designed for LIN/CAN coexistence in gateways; lacks VREN-driven voltage regulation support | Select TCAN1042VDQ1 when integrating LIN with CAN FD or requiring tighter bus impedance control; not drop-in due to missing VREN and different pinout. |
| STLM22003TR | Lower quiescent current (3 µA Power-Down), no WAKE pin, fixed 30 kΩ RSLAVE, same SOIC-8 package | Optimized for ultra-low-power sensor nodes where local wake-up is unnecessary | Choose STLM22003TR for cost-sensitive, battery-operated sensors; verify absence of WAKE functionality aligns with system wake architecture. |
Compared with TCAN1042VDQ1 and STLM22003TR, the MCP2003B-E/SN uniquely combines VREN output for regulator control, dual wake sources (WAKE + LBUS), and ±85V capacitor-coupling robustness - making it optimal for automotive slave nodes requiring external power management and high-voltage transient resilience.
Availability
MCP2003B-E/SN is available at Aetrix Electronics and suitable for body control modules, seat position sensors, roof modules, and steering column interfaces requiring stable component supply across automotive production lifecycles.
Supply support for MCP2003B-E/SN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and connectivity solutions for automotive, industrial, and consumer markets.
The MCP2003B product line delivers AEC-Q100-qualified LIN transceivers engineered specifically for automotive sub-networks where reliability, low power, and high-voltage robustness are critical in harsh environments.
FAQ
What LIN bus specifications does the MCP2003B-E/SN comply with?
The MCP2003B-E/SN complies with LIN Bus Specification Rev 1.3, 2.0, 2.1, 2.2, SAE J2602, and ISO 17987. It meets all mandatory electrical, timing, and fault-handling requirements for master and slave nodes, including bus dominant timeout, recessive state detection, and slope-controlled edge rates defined in LIN 2.2.
Does the MCP2003B-E/SN require an external TVS diode on the LBUS line?
No - the MCP2003B-E/SN passes SAE J2962-1 direct capacitor coupling tests at ±35V and ±85V on LBUS without an external TVS diode. Its internal protection architecture eliminates the need for external transient suppression in most LIN slave applications, reducing BOM cost and board space.
How does the MCP2003B-E/SN handle thermal overload conditions?
The MCP2003B-E/SN triggers thermal shutdown at +180°C and recovers automatically when die temperature falls below +160°C. During overload, it enters Transmitter Off mode (RXD high, TXD low), preserving receiver monitoring while disabling the driver - allowing safe recovery without MCU intervention.
What is the function of the VREN pin on the MCP2003B-E/SN?
The VREN pin is an open-drain output that pulls high to VBB in all operational modes except Power-Down. It drives the enable input of an external voltage regulator, synchronizing power delivery to the MCU with transceiver readiness - ensuring clean startup and eliminating brown-out during wake events.
Can the MCP2003B-E/SN operate with a floating ground (VSS) connection?
Yes - the MCP2003B-E/SN sustains operation with floating VSS, drawing ≤±1 mA (IBBNOGND). However, its LBUS short-circuit current limit remains active (50–200 mA), and RXD monitoring requires valid pull-up to maintain Operation mode. Floating VSS is acceptable for diagnostic or test scenarios but not recommended for production.
MCP2003B-E/SN Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- Transceiver
- Protocol:
- LINbus
- Number of Drivers/Receivers:
- 1/1
- Duplex:
- Half
- Receiver Hysteresis:
- -
- Data Rate:
- 20kBaud
- Voltage - Supply:
- 5.5V ~ 30V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
MCP2003B-E/SN FAQ
1.How can I place an order for MCP2003B-E/SN through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP2003B-E/SN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP2003B-E/SN reliable?
The price and inventory of MCP2003B-E/SN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP2003B-E/SN is usually 5 days.
3.What payment methods are accepted for MCP2003B-E/SN?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP2003B-E/SN transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP2003B-E/SN?
MCP2003B-E/SN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP2003B-E/SN order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP2003B-E/SN?
For technical support, including MCP2003B-E/SN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP2003B-E/SN requirements.
6.How does Aetrix verify that MCP2003B-E/SN is sourced from the original manufacturer or authorized distributors?
All MCP2003B-E/SN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP2003B-E/SN meets industry standards.
7.What is the process for return or replacement of MCP2003B-E/SN?
All MCP2003B-E/SN units undergo pre-shipment inspection (PSI). If there is an issue with MCP2003B-E/SN, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP2003B-E/SN part is unused and in its original packaging.
Return procedure for MCP2003B-E/SN:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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