My Inquiry
My Account
Microchip Technology MCP9805T-BE/MNY
- Part No.:
- MCP9805T-BE/MNY
- Manufacturer:
- Microchip Technology
- Category:
- Thermal Management
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
MCP9805T-BE/MNY.pdf
- Description:
- IC TEMP SENSOR 2WIRE 8-TDFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,834
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCP9805T-BE/MNY from Microchip Technology is a JEDEC JC42.4-compliant digital temperature sensor IC designed for memory module thermal monitoring. It delivers ±1°C max accuracy from +75°C to +95°C, 0.25°C/LSB resolution, and operates on 3.0–3.6V supply with 200 µA typical active current. It serves as the primary thermal sensing element in DDR DIMM SPD subsystems.
For engineers reviewing the MCP9805T-BE/MNY datasheet, MCP9805T-BE/MNY pinout, MCP9805T-BE/MNY application, or MCP9805T-BE/MNY equivalent, key selection criteria include its JEDEC JC42.4 compliance, programmable event boundaries (TUPPER/TLOWER/TCRIT), open-drain Event output configurability (comparator/interrupt/critical mode), and dual-package availability (2×3 DFN-8 and TSSOP-8).
Technical Context
The MCP9805T-BE/MNY integrates a bandgap temperature sensor with a ΔΣ ADC to convert -40°C to +125°C ambient temperature into a 16-bit two's complement digital word. Its register architecture includes read-only TA (ambient temperature), configurable boundary registers (TUPPER/TLOWER/TCRIT), and a 16-bit CONFIG register controlling shutdown, hysteresis (0/1.5/3/6°C), event polarity, and output mode.
It implements a 2-wire SMBus/Standard-mode I²C interface (100 kHz max) with factory-set 7-bit slave address prefix 0b0011xxx and user-selectable A0–A2 pins, enabling up to eight devices on one bus. The Event pin functions as an open-drain output with programmable assertion logic tied to boundary crossing, critical trip, or window violation detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temp Range | -40°C to +125°C operating; -20°C to +125°C specified range per JEDEC JC42.4 |
| Accuracy | ±1°C max from +75°C to +95°C (JEDEC active range); ±2°C max from +40°C to +125°C (monitor range) |
| Resolution | 0.25°C/LSB - enables precise thermal threshold setting for memory thermal throttling |
| Supply Voltage | 3.0V to 3.6V - matches DDR memory module VDD_SPD rail; no external regulator needed |
| Interface | SMBus/Standard-mode I²C at ≤100 kHz - compatible with legacy SPD controllers and JEDEC-compliant memory controllers |
| Quiescent Current | 200 µA typical - supports low-power DIMM thermal monitoring without impacting system standby budget |
| Shutdown Current | 0.1 µA typical - enables ultra-low-power retention during memory idle states |
Pinout & Package
Package: 2×3 mm DFN-8 (exposed pad) and 8-pin TSSOP - both JEDEC MO-220 compliant and optimized for DIMM edge-mount placement near DRAM banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A2 | Slave Address Inputs | Set LSBs of 7-bit I²C address (0x18–0x1F); enable up to 8 sensors on one bus without address conflict |
| GND | Ground Reference | System ground return for analog sensor core and digital interface; requires low-impedance connection to DIMM ground plane |
| SDA | Open-Drain Serial Data | Bidirectional I²C data line; requires external pull-up to VDD_SPD (3.3V); supports multi-master arbitration |
| SCLK | Serial Clock Input | Asynchronous clock input driven by host controller; defines timing for all register reads/writes and event sampling |
| Event | Open-Drain Temperature Alert | Configurable output for thermal interrupt, comparator, or critical shutdown signal; sinks ≥3 mA at VOL ≤0.4V |
| VDD | Power Supply | 3.0–3.6V input; powers bandgap sensor, ΔΣ ADC, and I²C interface; decoupling capacitor required per JEDEC SPD spec |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC JC42.4 Compliance | Fully satisfies Mobile Platform Memory Module Thermal Sensor standard - ensures interoperability with DDR2/DDR3 memory controllers and SPD firmware |
| Programmable Event Boundaries | TUPPER/TLOWER/TCRIT registers allow runtime configuration of thermal trip points without hardware change - essential for adaptive memory thermal management |
| Configurable Event Output Mode | Supports comparator (active-high/low), interrupt, or critical-only output via CONFIG register bits - enables direct connection to PMIC reset inputs or CPU thermal interrupt lines |
| Temperature Hysteresis Control | 0°C/1.5°C/3°C/6°C selectable hysteresis prevents output chatter during slow thermal drift near thresholds - improves system stability in marginally heated modules |
| Shutdown Mode with Register Retention | Reduces current to 0.1 µA while preserving all register contents and I²C accessibility - allows rapid wake-up and eliminates reinitialization overhead |
Applications
| Dual In-line Memory Module (DIMM) | Server Memory Subsystem |
|---|---|
Use Scenario: Real-time thermal monitoring of DDR3/DDR4 memory modules during high-bandwidth operation. IC Role / Device Role / Timing Role: Primary JEDEC JC42.4-compliant temperature sensor integrated into SPD EEPROM subsystem. Use Value: Enables memory controller thermal throttling and dynamic voltage/frequency scaling based on accurate local die temperature - prevents DRAM data corruption and extends module lifetime. |
Use Scenario: Multi-zone thermal supervision across memory risers and channel buffers in 2U/4U rack servers. IC Role / Device Role / Timing Role: Distributed thermal node feeding BMC/IPMI via SMBus for centralized thermal policy enforcement. Use Value: Provides independent, calibrated temperature data per memory channel - supports predictive failure analysis and hot-swap readiness assessment. |
| Hard Disk Drive Enclosure | Industrial Embedded Controller |
Use Scenario: Ambient temperature tracking inside 3.5" HDD bays where airflow is constrained and localized heating occurs. IC Role / Device Role / Timing Role: Secondary thermal monitor co-located with drive bay controller, supplementing drive-integrated sensors. Use Value: Detects enclosure-level overheating before individual drives trigger internal thermal shutdown - enables proactive fan speed ramping and alert logging. |
Use Scenario: Compact, low-power thermal monitoring in fanless industrial PCs with DDR3 SO-DIMM slots. IC Role / Device Role / Timing Role: Standalone thermal sensor interfaced directly to ARM Cortex-A9/A53 SoC I²C bus. Use Value: Delivers validated ±1°C accuracy in memory-critical applications without requiring calibration firmware - reduces BOM count and software validation effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTS2002 | ±0.5°C max accuracy from 0°C to +65°C; 1.7–3.6V supply; no critical temperature register (TCRIT) | Lacks JEDEC JC42.4 compliance and TCRIT functionality - unsuitable for DDR memory thermal management requiring critical trip | Select only for non-JEDEC general-purpose sensing where tighter mid-range accuracy is prioritized over memory-standard features |
| LM75BIMM/NOPB | ±2°C max accuracy from -25°C to +100°C; 2.8–5.5V supply; fixed 0.5°C/LSB resolution; no hysteresis control | Does not meet JEDEC JC42.4; lacks programmable boundaries and event output flexibility - limited to basic overtemperature alerts | Use only in cost-sensitive, non-memory applications where ±2°C tolerance and simple interrupt output suffice |
Compared with STTS2002 and LM75BIMM/NOPB, the MCP9805T-BE/MNY uniquely combines JEDEC JC42.4 compliance, 0.25°C resolution, three independent programmable boundaries (TUPPER/TLOWER/TCRIT), and configurable hysteresis - making it the only qualified choice for DDR memory thermal monitoring in production DIMMs.
Availability
MCP9805T-BE/MNY is available at Aetrix Electronics and suitable for Dual In-line Memory Modules (DIMMs), server memory subsystems, and industrial embedded controllers requiring stable component supply, JEDEC-compliant thermal sensing, and long-term lifecycle support.
Supply support for MCP9805T-BE/MNY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and connectivity solutions, with deep expertise in embedded control and sensor integration.
The MCP9805 product line was specifically engineered to meet JEDEC JC42.4 requirements for mobile platform memory module thermal sensing - targeting DDR2/DDR3 DIMM manufacturers needing certified, high-accuracy, low-power temperature monitoring.
FAQ
What is the operating temperature range of the MCP9805T-BE/MNY?
The MCP9805T-BE/MNY has an operating temperature range of -40°C to +125°C and a specified temperature range of -20°C to +125°C per JEDEC JC42.4. Its accuracy is guaranteed at ±1°C max from +75°C to +95°C and ±2°C max from +40°C to +125°C. This makes MCP9805T-BE/MNY suitable for high-reliability memory thermal monitoring in demanding environments.
Does the MCP9805T-BE/MNY support I²C communication?
Yes, the MCP9805T-BE/MNY supports Standard-mode I²C and SMBus-compatible 2-wire serial communication at up to 100 kHz. It uses a 7-bit slave address with factory-set upper bits (0b0011) and user-configurable A0–A2 pins, allowing up to eight MCP9805T-BE/MNY devices on a single bus. The SDA and SCLK pins are open-drain and require external pull-up resistors.
How does the Event output function on the MCP9805T-BE/MNY?
The Event pin on the MCP9805T-BE/MNY is an open-drain output that asserts when ambient temperature crosses user-programmed boundaries (TUPPER/TLOWER/TCRIT). Its behavior is fully configurable via the CONFIG register: it can operate as an active-high/low comparator, interrupt signal, or critical-only output. The MCP9805T-BE/MNY also supports programmable hysteresis (0/1.5/3/6°C) to prevent chatter near trip points.
What package options are available for the MCP9805T-BE/MNY?
The MCP9805T-BE/MNY is offered in two JEDEC-compliant packages: 2×3 mm DFN-8 (with exposed thermal pad) and 8-pin TSSOP. Both packages support the same pinout and electrical specifications. The DFN-8 offers lower thermal resistance (θJA = 41°C/W), while the TSSOP provides easier manual assembly and optical inspection - enabling flexible selection for DIMM layout constraints.
Is the MCP9805T-BE/MNY compliant with JEDEC JC42.4?
Yes, the MCP9805T-BE/MNY is explicitly designed and tested to meet JEDEC Standard JC42.4 for Mobile Platform Memory Module Thermal Sensors. This compliance ensures interoperability with DDR2/DDR3 memory controllers, validates its ±1°C accuracy in the +75°C to +95°C active range, and confirms support for required features including programmable boundaries, critical trip, and SMBus interface timing.
MCP9805T-BE/MNY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Cut Tape (CT)
- Product Status:
- Active
- Function:
- Temp Monitoring System (Sensor)
- Sensor Type:
- Internal
- Sensing Temperature:
- -40°C ~ 125°C
- Accuracy:
- ±3°C(Max)
- Topology:
- ADC (Sigma Delta), Register Bank
- Output Type:
- I2C/SMBus
- Output Alarm:
- No
- Output Fan:
- Yes
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TDFN (2x3)
MCP9805T-BE/MNY FAQ
1.How can I place an order for MCP9805T-BE/MNY through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP9805T-BE/MNY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP9805T-BE/MNY reliable?
The price and inventory of MCP9805T-BE/MNY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP9805T-BE/MNY is usually 5 days.
3.What payment methods are accepted for MCP9805T-BE/MNY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP9805T-BE/MNY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP9805T-BE/MNY?
MCP9805T-BE/MNY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP9805T-BE/MNY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP9805T-BE/MNY?
For technical support, including MCP9805T-BE/MNY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP9805T-BE/MNY requirements.
6.How does Aetrix verify that MCP9805T-BE/MNY is sourced from the original manufacturer or authorized distributors?
All MCP9805T-BE/MNY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP9805T-BE/MNY meets industry standards.
7.What is the process for return or replacement of MCP9805T-BE/MNY?
All MCP9805T-BE/MNY units undergo pre-shipment inspection (PSI). If there is an issue with MCP9805T-BE/MNY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP9805T-BE/MNY part is unused and in its original packaging.
Return procedure for MCP9805T-BE/MNY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCP9805T-BE/MNY Tags
-
EMC2101-ACZL-TR
Microchip Technology
-
MCP9844T-BE/MNY
Microchip Technology
-
EMC2101-R-ACZL-TR
Microchip Technology
-
MCP98244T-BE/MNY
Microchip Technology
-
TC670ECHTR
Microchip Technology
-
SE98ATP,547
NXP Semiconductors
-
AMC6821SDBQR
Texas Instruments
-
MAX6604AATA+T
Analog Devices Inc./Maxim Integrated
-
ADT7475ARQZ-REEL
onsemi
-
MAX6643LBBAEE+
Analog Devices Inc./Maxim Integrated
-
MAX6684ESA+T
Analog Devices Inc./Maxim Integrated
-
MAX6639AEE+
Analog Devices Inc./Maxim Integrated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
