My Inquiry
My Account
Microchip Technology MCP98242T-BE/MC
- Part No.:
- MCP98242T-BE/MC
- Manufacturer:
- Microchip Technology
- Category:
- Thermal Management
- Package:
- 8-VFDFN Exposed Pad
- Datasheet:
-
MCP98242T-BE/MC.pdf
- Description:
- IC MEMORY MOD TEMP SENSOR 8-DFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,608
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCP98242T-BE/MC from Microchip Technology is a JEDEC JC42.4-compliant digital temperature sensor with integrated 256-byte I²C/SMBus EEPROM for Serial Presence Detect (SPD) in memory modules. It delivers ±0.5°C typical accuracy from +75°C to +95°C, operates from 3.0V to 3.6V, draws 200 µA typical active current and 3 µA max shutdown current, and supports user-programmable temperature event boundaries with open-drain Event output - deployed in DDR DIMM thermal monitoring.
For engineers reviewing the MCP98242T-BE/MC datasheet, MCP98242T-BE/MC pinout, MCP98242T-BE/MC application, or MCP98242T-BE/MC equivalent, key selection criteria include SPD EEPROM write-protection architecture, ±0.5°C accuracy window compliance, I²C address configurability (A2–A0), thermal response time (0.7 s DFN), and JEDEC JC42.4 mobile platform thermal sensor qualification.
Technical Context
The MCP98242T-BE/MC integrates a band-gap temperature sensor and delta-sigma ADC with programmable resolution (0.0625°C to 0.5°C), configurable hysteresis (0°C to 6.0°C), and dual-mode Event output (comparator or interrupt). Its EEPROM is partitioned into permanently/soft-write-protected lower 128 bytes (00h–7Fh) for vendor SPD data and unprotected upper 128 bytes (80h–FFh) for general storage.
It implements SMBus/Standard-mode I²C timing (10–100 kHz), includes 40 ms serial interface timeout for sensor-only operations, and features separate power-on reset thresholds for sensor (2.3 V) and EEPROM (1.6 V). Addressing uses 7-bit slave address '0011,A2,A1,A0' for temperature functions and '1010,EEPROM_A2,A1,A0' for EEPROM access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temp Accuracy (typ./max) | ±0.5°C / ±1.0°C from +75°C to +95°C - meets JEDEC JC42.4 active-range requirement for DIMM thermal sensing |
| Supply Voltage | 3.0 V to 3.6 V - optimized for 3.3 V SPD bus; exceeds JEDEC SPD voltage spec |
| Active Current | 200 µA typical - enables low-power thermal monitoring without impacting DIMM standby budget |
| Shutdown Current | ≤3 µA maximum - preserves system-level power integrity during memory idle states |
| EEPROM Size & Protection | 256 × 8 bits; lower 128 bytes permanent/software write-protect - secures SPD vendor ID and module config |
| I²C Interface Speed | 10–100 kHz - compatible with standard SMBus host controllers on motherboard platforms |
| Conversion Time | 65–125 ms - deterministic update latency for closed-loop thermal throttling decisions |
Pinout & Package
Package: 8-pin DFN (2 mm × 3 mm, exposed thermal pad), TDFN, UDFN, or TSSOP - all pin-compatible with identical pin mapping per Table 3-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A2 | Slave address LSB inputs | Set 3-bit device address (000–111); enable up to 8 MCP98242T-BE/MC devices on same I²C bus |
| GND | Ground reference | Common return for analog/digital circuits and thermal pad connection point |
| SDA | Bidirectional I²C data line | Open-drain, requires external pull-up; carries temperature readings and EEPROM data |
| SCLK | I²C clock input | Master-generated clock; defines timing for register reads/writes and EEPROM access |
| Event | Open-drain alert output | Asserts when TA exceeds TUPPER/TLOWER/TCRIT; polarity and mode software-configurable |
| VDD | Power supply input | 3.0–3.6 V only; powers both sensor and EEPROM; POR threshold 2.3 V (sensor), 1.6 V (EEPROM) |
| EP | Exposed thermal pad | Internally tied to GND; must be soldered to PCB ground plane for thermal performance and EMI control |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC JC42.4 Compliance | Validated for mobile platform memory module thermal sensing - ensures interoperability with industry-standard SPD hosts |
| Configurable Event Output | Software-selectable active-high/low comparator or microprocessor interrupt mode - adapts to host controller signal requirements |
| Dual-Zone EEPROM Protection | Lower 128 bytes support permanent (PWP) or reversible (SWP) write-protection - safeguards critical SPD identity fields |
| User-Programmable Hysteresis | 0°C, 1.5°C, 3.0°C, or 6.0°C hysteresis on TUPPER/TLOWER - eliminates thermal chatter in dynamic DIMM environments |
| Resolution Flexibility | 0.0625°C to 0.5°C selectable via register - balances precision needs against conversion time (65–125 ms) and power |
Applications
| DDR DIMM Thermal Monitoring | Laptop Memory Subsystem |
|---|---|
Use Scenario: Real-time temperature tracking of DDR3/DDR4 memory modules during high-bandwidth operation. IC Role / Device Role / Timing Role: JEDEC JC42.4-compliant thermal sensor + SPD EEPROM - provides calibrated ambient die temperature and stores vendor-specific SPD data. Use Value: Enables host BIOS to trigger thermal throttling before memory junction exceeds safe limits; prevents data corruption from overheating. | Use Scenario: Compact thermal management in space-constrained laptop memory slots with limited airflow. IC Role / Device Role / Timing Role: Low-power temperature monitor with shutdown mode (≤3 µA) - maintains thermal visibility while minimizing impact on battery life. Use Value: Reduces system-level standby current without sacrificing thermal safety margin; supports fanless design requirements. |
| Server Memory Module SPD | Industrial Embedded Memory Systems |
Use Scenario: Storing and protecting JEDEC-defined SPD parameters (vendor ID, timing, capacity) in enterprise-grade RDIMMs. IC Role / Device Role / Timing Role: Dual-function IC - temperature sensor + 256-byte EEPROM with hardware-enforced write protection on lower 128 bytes. Use Value: Guarantees SPD data integrity across field updates and reboots; prevents accidental overwrites of critical memory configuration. | Use Scenario: Reliable thermal sensing in extended-temperature industrial PCs where memory operates from –20°C to +125°C ambient. IC Role / Device Role / Timing Role: Wide-range sensor with ±2°C/±3°C accuracy from –20°C to +125°C - validated for full industrial operating envelope. Use Value: Supports continuous operation in harsh environments without calibration drift; meets IPC-9592B reliability expectations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar temperature sensor + SPD EEPROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT30TS74-MA8Y | ±0.5°C accuracy over 0°C to +70°C only; no JEDEC JC42.4 qualification; 128-byte EEPROM | Limited to commercial-temperature computing; lacks DIMM-specific event boundary registers and hysteresis control | Select only if JEDEC compliance and industrial temp range are not required |
| STTS22HTR | ±0.5°C accuracy from –20°C to +100°C; no integrated EEPROM; standalone sensor only | Requires external EEPROM for SPD; adds BOM cost and layout complexity; no unified SPD+temp solution | Choose when higher resolution (0.01°C) is needed but SPD integration is secondary |
Compared with AT30TS74-MA8Y and STTS22HTR, the MCP98242T-BE/MC uniquely combines JEDEC JC42.4 qualification, on-chip SPD EEPROM with dual-zone write protection, and programmable thermal event logic - delivering a single-component DIMM thermal and identification solution with no external components required.
Availability
MCP98242T-BE/MC is available at Aetrix Electronics and suitable for DDR memory module manufacturing, laptop thermal subsystems, and server RDIMM production requiring stable component supply, JEDEC-compliant thermal sensing, and SPD EEPROM integrity.
Supply support for MCP98242T-BE/MC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, headquartered in Chandler, Arizona, with global design and manufacturing infrastructure.
The MCP98242 product line was designed specifically for JEDEC JC42.4-compliant memory module thermal monitoring and Serial Presence Detect (SPD) data storage - targeting DDR3/DDR4 DIMM, SO-DIMM, and RDIMM applications in computing and server platforms.
FAQ
What is the operating voltage range for the MCP98242T-BE/MC?
The MCP98242T-BE/MC operates from 3.0 V to 3.6 V only. Operation outside this range violates specification: VDD < 3.0 V disables proper EEPROM functionality (POR threshold 1.6 V), and VDD > 3.6 V risks exceeding absolute maximum ratings. The device is optimized for 3.3 V SPD bus systems and does not support 1.8 V or 5 V interfaces.
How does the MCP98242T-BE/MC meet JEDEC JC42.4 requirements?
The MCP98242T-BE/MC meets JEDEC JC42.4 by delivering ±0.5°C typical accuracy from +75°C to +95°C, supporting programmable temperature event boundaries (TUPPER/TLOWER/TCRIT), providing open-drain Event output with configurable polarity and mode, and integrating 256-byte EEPROM with write-protection for SPD data - all verified per JC42.4 Mobile Platform Memory Module Thermal Sensor Component specification.
Can the MCP98242T-BE/MC be used without its EEPROM function?
Yes, the MCP98242T-BE/MC functions fully as a temperature sensor without accessing the EEPROM. The sensor core, registers, and Event output operate independently. EEPROM read/write operations draw higher current (1.1 mA typical write), so disabling EEPROM access reduces average power consumption - useful in applications needing only thermal monitoring.
What is the purpose of the Exposed Thermal Pad (EP) on the MCP98242T-BE/MC DFN package?
On the MCP98242T-BE/MC DFN package, the Exposed Thermal Pad (EP) is internally connected to GND and must be soldered to the PCB ground plane. It improves thermal dissipation (θJA = 84.5°C/W for DFN), reduces junction-to-board resistance, and enhances EMI immunity - critical for stable temperature measurement accuracy in high-density DIMM layouts.
How many MCP98242T-BE/MC devices can share one I²C bus?
Up to eight MCP98242T-BE/MC devices can share a single I²C bus using the A2, A1, and A0 address pins to configure unique 3-bit slave addresses (000–111). Each device responds to its assigned 7-bit address (0011,A2,A1,A0) for temperature functions and (1010,A2,A1,A0) for EEPROM access - enabling multi-module thermal monitoring without address conflict.
MCP98242T-BE/MC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-VFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Temp Monitoring System (Sensor), DIMM DDR Memory
- Sensor Type:
- Internal
- Sensing Temperature:
- -40°C ~ 125°C
- Accuracy:
- ±3°C(Max)
- Topology:
- ADC (Sigma Delta), Register Bank
- Output Type:
- I2C/SMBus
- Output Alarm:
- Yes
- Output Fan:
- Yes
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DFN (2x3)
MCP98242T-BE/MC FAQ
1.How can I place an order for MCP98242T-BE/MC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP98242T-BE/MC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP98242T-BE/MC reliable?
The price and inventory of MCP98242T-BE/MC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP98242T-BE/MC is usually 5 days.
3.What payment methods are accepted for MCP98242T-BE/MC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP98242T-BE/MC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP98242T-BE/MC?
MCP98242T-BE/MC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP98242T-BE/MC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP98242T-BE/MC?
For technical support, including MCP98242T-BE/MC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP98242T-BE/MC requirements.
6.How does Aetrix verify that MCP98242T-BE/MC is sourced from the original manufacturer or authorized distributors?
All MCP98242T-BE/MC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP98242T-BE/MC meets industry standards.
7.What is the process for return or replacement of MCP98242T-BE/MC?
All MCP98242T-BE/MC units undergo pre-shipment inspection (PSI). If there is an issue with MCP98242T-BE/MC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP98242T-BE/MC part is unused and in its original packaging.
Return procedure for MCP98242T-BE/MC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCP98242T-BE/MC Tags
-
EMC2101-ACZL-TR
Microchip Technology
-
MCP9844T-BE/MNY
Microchip Technology
-
EMC2101-R-ACZL-TR
Microchip Technology
-
MCP98244T-BE/MNY
Microchip Technology
-
TC670ECHTR
Microchip Technology
-
SE98ATP,547
NXP Semiconductors
-
AMC6821SDBQR
Texas Instruments
-
MAX6604AATA+T
Analog Devices Inc./Maxim Integrated
-
ADT7475ARQZ-REEL
onsemi
-
MAX6643LBBAEE+
Analog Devices Inc./Maxim Integrated
-
MAX6684ESA+T
Analog Devices Inc./Maxim Integrated
-
MAX6639AEE+
Analog Devices Inc./Maxim Integrated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
