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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Thermal Management

Microchip Technology MCP98242T-BE/MCBAC

Name: MCP98242T-BE/MCBAC
Brand: Microchip Technology
SKU: MCP98242T-BE/MCBAC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MCP98242T-BE/MCBAC

Manufacturer:: Microchip Technology

Category:: Thermal Management

Package:: 8-VFDFN Exposed Pad

Datasheet:: MCP98242T-BE/MCBAC.pdf

Description:: IC TEMP SENSOR 2WIRE 3V 8-DFN

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Product details

Overview

MCP98242T-BE/MCBAC from Microchip Technology is a JEDEC JC42.4-compliant digital temperature sensor with integrated 256-byte serial EEPROM for SPD applications, operating from 3.0V to 3.6V, delivering ±0.5°C typical accuracy from +75°C to +95°C, 200 µA typical operating current, and I²C/SMBus-compatible 2-wire interface - used in DDR3/DDR4 DIMM thermal monitoring.

For engineers reviewing the MCP98242T-BE/MCBAC datasheet, MCP98242T-BE/MCBAC pinout, MCP98242T-BE/MCBAC application, or MCP98242T-BE/MCBAC equivalent, key selection criteria include SPD EEPROM write-protection architecture, ±0.5°C accuracy window, event output polarity configurability, shutdown current ≤3 µA, and TSSOP-8 package compatibility with JEDEC memory module layouts.

Technical Context

The MCP98242T-BE/MCBAC integrates a band-gap temperature sensor and delta-sigma ADC with user-programmable registers for boundary trip configuration (TUPPER/TLOWER/TCRIT), hysteresis control (0°C/1.5°C/3°C/6°C), and event output mode selection (comparator/interrupt/critical-only). Its EEPROM implements permanent and reversible software write-protection split across lower 128 bytes (00h–7Fh) and upper 128 bytes (80h–FFh).

It supports up to eight devices on a single I²C/SMBus bus using 7-bit slave addressing (0011,A2,A1,A0), features 40 ms serial interface timeout for sensor-only operations, and maintains JEDEC JC42.4 compliance for mobile platform memory thermal sensing - including mandatory event output, resolution select (0.0625°C to 0.5°C), and temperature range coverage from −40°C to +125°C.

Key Specifications

Parameter	Value and Actual Design Meaning
Temperature Accuracy	±0.5°C (typ.) from +75°C to +95°C - meets JEDEC JC42.4 active-range requirement for DIMM thermal validation
Supply Voltage Range	3.0V to 3.6V - matches DDR3/DDR4 SPD power rail; POR threshold at 2.3V (sensor) / 1.6V (EEPROM)
Operating Current	200 µA (typ.) - enables low-power thermal monitoring without impacting memory module standby budget
Shutdown Current	≤3 µA (max.) - preserves system-level power integrity during DIMM idle states
EEPROM Capacity	256 bytes (256×8) - fully satisfies JEDEC SPD byte allocation for vendor ID, module type, timing, and thermal data
I²C/SMBus Speed	10–100 kHz - compatible with standard SMBus host controllers in server/desktop memory controllers
Event Output	Open-drain, configurable polarity - supports both thermostat-style comparator and microprocessor interrupt signaling

Pinout & Package

Package: 8-pin TSSOP (3.0 mm × 4.4 mm, 0.65 mm pitch), RoHS-compliant, with exposed thermal pad internally connected to GND.

Pin/Terminal	Circuit Role	Design Meaning
A0	Slave Address LSB	Configures bit-0 of 7-bit I²C address (0011,A2,A1,A0); tied high/low to enable multi-device DIMM slot addressing
A1	Slave Address MSB-1	Configures bit-1 of 7-bit I²C address; allows up to 8 unique MCP98242T-BE/MCBAC instances per bus
A2	Slave Address MSB-2	Configures bit-2 of 7-bit I²C address; required for SPD EEPROM write-protect voltage injection (8–12 V on A0)
GND	Ground Reference	System ground return; electrically bonded to exposed thermal pad (EP) - must be connected to PCB ground plane
SDA	Bidirectional Data Line	I²C/SMBus data line; requires external pull-up to VDD; supports ACK/NAK and repeated start protocols
SCLK	Serial Clock Input	Master-generated clock; defines timing for all register reads/writes and EEPROM access
Event	Open-Drain Alert Output	Asserts when TA exceeds TUPPER/TLOWER/TCRIT; polarity and function (comp/int/crit) programmable via CONFIG register
VDD	Power Supply	3.0–3.6V supply input; powers both sensor and EEPROM; internal POR circuit ensures reliable initialization

Key Features

Feature	Design Value
JEDEC JC42.4 Compliance	Fully implements mandatory thermal sensor requirements for DDR3/DDR4 DIMMs - including event output, resolution select, and accuracy windows
SPD EEPROM Architecture	256-byte EEPROM with dual-zone write protection: permanent/software-reversible lock for lower 128 bytes (vendor data), unrestricted upper 128 bytes (user data)
Configurable Event Output	Three functional modes (boundary comparator, interrupt, critical-only) and polarity (active-high/low) - eliminates need for external logic in host systems
Programmable Temperature Resolution	Four selectable resolutions (0.0625°C to 0.5°C) - balances measurement precision against conversion time (65–125 ms) and power consumption
Thermal Hysteresis Control	Four hysteresis settings (0°C/1.5°C/3°C/6°C) - prevents output oscillation near trip thresholds in thermally noisy DIMM environments

Applications

DDR3/DDR4 DIMM Thermal Monitoring	Laptop Memory Module SPD
Use Scenario: Real-time temperature tracking of DDR3/DDR4 memory modules during high-bandwidth operation to prevent thermal throttling or data corruption. IC Role / Device Role / Timing Role: JEDEC JC42.4-compliant thermal sensor and SPD EEPROM storage - provides ambient temperature data and stores vendor/module-specific SPD parameters. Use Value: Enables host BIOS/firmware to dynamically adjust memory timing or initiate thermal mitigation based on validated ±0.5°C accuracy within the critical +75°C to +95°C range.	Use Scenario: Integration into laptop SO-DIMM modules where space-constrained TSSOP-8 footprint and low shutdown current (<3 µA) preserve battery life during sleep states. IC Role / Device Role / Timing Role: Dual-function device acting as both temperature monitor and SPD EEPROM - replaces discrete sensor + EEPROM solution in memory subsystems. Use Value: Reduces BOM count and PCB area while maintaining JEDEC compliance and supporting software write-protection for immutable vendor data (e.g., part number, revision, timing tables).
Server Memory Subsystem Health	Industrial Embedded Memory Modules
Use Scenario: Deployment in multi-channel server memory risers where eight MCP98242T-BE/MCBAC devices share one SMBus for centralized thermal telemetry and fault logging. IC Role / Device Role / Timing Role: Slave device on shared I²C/SMBus with configurable 7-bit address (A2/A1/A0) - delivers temperature and SPD status to BMC or memory controller. Use Value: Supports scalable thermal management across 16+ DIMMs per server node using standardized SMBus polling and event-driven alerting without bus contention.	Use Scenario: Use in ruggedized industrial memory modules operating from −40°C to +125°C ambient, requiring guaranteed accuracy over full industrial temperature range. IC Role / Device Role / Timing Role: High-reliability thermal sensor with ±2°C/±3°C accuracy from −20°C to +125°C and robust EEPROM endurance (1M write cycles at 5V). Use Value: Ensures long-term SPD data integrity and thermal visibility in extended-life deployments where rework or field updates are impractical.

DDR3/DDR4 DIMM Thermal Monitoring

Laptop Memory Module SPD

Use Scenario: Real-time temperature tracking of DDR3/DDR4 memory modules during high-bandwidth operation to prevent thermal throttling or data corruption.

IC Role / Device Role / Timing Role: JEDEC JC42.4-compliant thermal sensor and SPD EEPROM storage - provides ambient temperature data and stores vendor/module-specific SPD parameters.

Use Value: Enables host BIOS/firmware to dynamically adjust memory timing or initiate thermal mitigation based on validated ±0.5°C accuracy within the critical +75°C to +95°C range.

Use Scenario: Integration into laptop SO-DIMM modules where space-constrained TSSOP-8 footprint and low shutdown current (<3 µA) preserve battery life during sleep states.

IC Role / Device Role / Timing Role: Dual-function device acting as both temperature monitor and SPD EEPROM - replaces discrete sensor + EEPROM solution in memory subsystems.

Use Value: Reduces BOM count and PCB area while maintaining JEDEC compliance and supporting software write-protection for immutable vendor data (e.g., part number, revision, timing tables).

Server Memory Subsystem Health

Industrial Embedded Memory Modules

Use Scenario: Deployment in multi-channel server memory risers where eight MCP98242T-BE/MCBAC devices share one SMBus for centralized thermal telemetry and fault logging.

IC Role / Device Role / Timing Role: Slave device on shared I²C/SMBus with configurable 7-bit address (A2/A1/A0) - delivers temperature and SPD status to BMC or memory controller.

Use Value: Supports scalable thermal management across 16+ DIMMs per server node using standardized SMBus polling and event-driven alerting without bus contention.

Use Scenario: Use in ruggedized industrial memory modules operating from −40°C to +125°C ambient, requiring guaranteed accuracy over full industrial temperature range.

IC Role / Device Role / Timing Role: High-reliability thermal sensor with ±2°C/±3°C accuracy from −20°C to +125°C and robust EEPROM endurance (1M write cycles at 5V).

Use Value: Ensures long-term SPD data integrity and thermal visibility in extended-life deployments where rework or field updates are impractical.

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature sensor + SPD EEPROM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
AT30TS74-MA8Y	±0.5°C accuracy only from −10°C to +65°C; no TCRIT register; 128-byte EEPROM	Limited to consumer-grade memory modules without critical-temperature monitoring requirements	Select when JEDEC JC42.4 critical trip and full −40°C to +125°C support are not required
LM75BIMM/NOPB	Standalone temperature sensor only; no integrated EEPROM; ±2°C accuracy over 0°C to +125°C	Requires external EEPROM for SPD functionality - increases BOM, layout complexity, and I²C address conflicts	Choose only if SPD EEPROM is implemented separately and JEDEC JC42.4 compliance is not mandated

Compared with AT30TS74-MA8Y and LM75BIMM/NOPB, the MCP98242T-BE/MCBAC uniquely combines JEDEC JC42.4 compliance, 256-byte SPD EEPROM with dual-zone write protection, and ±0.5°C accuracy in the DIMM-critical +75°C to +95°C window - making it the only drop-in solution for DDR3/DDR4 memory thermal validation without design compromise.

Availability

MCP98242T-BE/MCBAC is available at Aetrix Electronics and suitable for DDR3/DDR4 DIMM manufacturing, laptop memory module assembly, and server memory subsystem qualification requiring stable component supply and JEDEC-compliant thermal validation.

Supply support for MCP98242T-BE/MCBAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, with core expertise in embedded control and thermal management ICs.

The MCP98242 product line was designed specifically for JEDEC JC42.4-compliant memory module thermal sensing and Serial Presence Detect (SPD) data storage - targeting DDR3/DDR4 DIMM, SO-DIMM, and RDIMM applications in computing and server platforms.

FAQ

What is the primary application domain for the MCP98242T-BE/MCBAC?

The MCP98242T-BE/MCBAC is engineered for JEDEC JC42.4-compliant thermal monitoring and Serial Presence Detect (SPD) data storage in DDR3 and DDR4 memory modules. It is deployed in DIMMs, SO-DIMMs, and RDIMMs across laptops, servers, and desktop systems - where its ±0.5°C accuracy from +75°C to +95°C, 256-byte EEPROM, and I²C/SMBus interface meet strict memory subsystem requirements. The MCP98242T-BE/MCBAC directly supports SPD byte allocation and thermal event signaling mandated by JEDEC standards.

Does the MCP98242T-BE/MCBAC support write-protection of SPD data, and how is it implemented?

Yes, the MCP98242T-BE/MCBAC implements dual-mode EEPROM write-protection: the lower 128 bytes (addresses 00h–7Fh) support both permanent write-protection (PWP) and software-reversible write-protection (SWP), while the upper 128 bytes (80h–FFh) remain unprotected for general-purpose use. PWP is activated by applying 8–12 V to the A0 pin, locking vendor-critical SPD fields (e.g., manufacturer ID, module type). SWP is controlled via internal registers and can be toggled in-system. This architecture ensures SPD data integrity without sacrificing field-upgrade flexibility - a key requirement for the MCP98242T-BE/MCBAC in memory module production.

What are the supported temperature resolution settings for the MCP98242T-BE/MCBAC, and how do they affect conversion time?

The MCP98242T-BE/MCBAC supports four programmable temperature resolutions: 0.0625°C, 0.125°C, 0.25°C (power-up default), and 0.5°C. Conversion time scales inversely with resolution - ranging from 65 ms (0.5°C) to 125 ms (0.0625°C) - enabling trade-offs between measurement precision and system responsiveness. All resolutions operate across the full −40°C to +125°C range, and the selected value is stored in the Resolution register (pointer 0x08). This flexibility allows the MCP98242T-BE/MCBAC to optimize thermal monitoring latency in real-time memory subsystems without hardware changes.

How does the Event output of the MCP98242T-BE/MCBAC function, and what configuration options are available?

The MCP98242T-BE/MCBAC Event pin is an open-drain output that asserts when ambient temperature crosses user-defined boundaries (TUPPER, TLOWER, or TCRIT). Its behavior is fully configurable via the Configuration register: users select between comparator mode (active-high/low boundary alert), interrupt mode (pulse on crossing), or critical-only mode (TCRIT-triggered). Polarity, hysteresis (0°C/1.5°C/3°C/6°C), and lock status for trip registers are also software-controlled. This eliminates external logic and enables direct connection to host processor GPIO or interrupt controllers - a defining capability of the MCP98242T-BE/MCBAC in intelligent memory thermal management.

Is the MCP98242T-BE/MCBAC pin-compatible with other Microchip temperature sensors such as the MCP9808?

No, the MCP98242T-BE/MCBAC is not pin-compatible with the MCP9808. While both use 8-pin TSSOP packages, the MCP98242T-BE/MCBAC dedicates pins A0–A2 for I²C addressing and EEPROM write-protect voltage injection, whereas the MCP9808 uses those pins for alert output configuration and resolution selection. Additionally, the MCP98242T-BE/MCBAC includes dedicated SPD EEPROM functionality and JEDEC JC42.4-specific registers absent in the MCP9808. Board-level replacement requires schematic and layout revision - the MCP98242T-BE/MCBAC serves a distinct memory-module-specific role that the MCP9808 does not fulfill.

MCP98242T-BE/MCBAC Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 8-VFDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Function:: Temp Monitoring System (Sensor), DIMM DDR Memory

Sensor Type:: Internal

Sensing Temperature:: -40°C ~ 125°C

Accuracy:: ±3°C(Max)

Topology:: ADC (Sigma Delta), Register Bank

Output Type:: I2C/SMBus

Output Alarm:: Yes

Output Fan:: Yes

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-DFN (2x3)

MCP98242T-BE/MCBAC FAQ

1.How can I place an order for MCP98242T-BE/MCBAC through Aetrix?

Please submit a Request for Quotation (RFQ) for MCP98242T-BE/MCBAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCP98242T-BE/MCBAC reliable?

The price and inventory of MCP98242T-BE/MCBAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP98242T-BE/MCBAC is usually 5 days.

3.What payment methods are accepted for MCP98242T-BE/MCBAC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP98242T-BE/MCBAC transactions.

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4.How is shipping managed for MCP98242T-BE/MCBAC?

MCP98242T-BE/MCBAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCP98242T-BE/MCBAC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCP98242T-BE/MCBAC?

For technical support, including MCP98242T-BE/MCBAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP98242T-BE/MCBAC requirements.

6.How does Aetrix verify that MCP98242T-BE/MCBAC is sourced from the original manufacturer or authorized distributors?

All MCP98242T-BE/MCBAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP98242T-BE/MCBAC meets industry standards.

7.What is the process for return or replacement of MCP98242T-BE/MCBAC?

All MCP98242T-BE/MCBAC units undergo pre-shipment inspection (PSI). If there is an issue with MCP98242T-BE/MCBAC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCP98242T-BE/MCBAC part is unused and in its original packaging.

Return procedure for MCP98242T-BE/MCBAC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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