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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Thermal Management

Microchip Technology MCP98242T-CE/MUY

Name: MCP98242T-CE/MUY
Brand: Microchip Technology
SKU: MCP98242T-CE/MUY
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MCP98242T-CE/MUY

Manufacturer:: Microchip Technology

Category:: Thermal Management

Package:: 8-UFDFN Exposed Pad

Datasheet:: MCP98242T-CE/MUY.pdf

Description:: IC TEMP SENSOR 2WIRE 8-UDFN

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Product details

Overview

MCP98242T-CE/MUY from Microchip Technology is a JEDEC JC42.4-compliant digital temperature sensor with integrated 256-byte serial EEPROM for SPD applications, operating from 3.0V to 3.6V, delivering ±0.5°C typical accuracy from +75°C to +95°C, 200 µA typical operating current, and I²C/SMBus-compatible 2-wire interface - deployed in DDR3/DDR4 DIMM modules for real-time thermal monitoring and vendor data storage.

For engineers reviewing the MCP98242T-CE/MUY datasheet, MCP98242T-CE/MUY pinout, MCP98242T-CE/MUY application, or MCP98242T-CE/MUY equivalent, key selection criteria include SPD EEPROM write-protection architecture, ±0.5°C temperature accuracy over memory operating range, open-drain Event output configurability (comparator/interrupt/critical), shutdown current ≤3 µA, and TSSOP-8 package compatibility with JEDEC MO-153 footprint.

Technical Context

The MCP98242T-CE/MUY integrates a band-gap temperature sensor and delta-sigma ADC with user-programmable registers for boundary-triggered event generation, supporting four resolution modes (0.0625°C to 0.5°C/bit) and configurable hysteresis (0°C to 6.0°C). Its dual-function architecture separates temperature sensing (read-only TA register) from SPD EEPROM (256×8-bit, lower 128 bytes permanently or reversibly write-protected).

It implements JEDEC JC42.4 Mobile Platform Memory Module Thermal Sensor requirements, including programmable TUPPER/TLOWER/TCRIT trip points, active-high/active-low Event polarity selection, and SMBus timeout (40 ms typical) - all accessible via standard I²C protocol with 7-bit slave address (0011xxx) and dedicated A0–A2 address pins.

Key Specifications

Parameter	Value and Actual Design Meaning
Temp Accuracy (typ./max)	±0.5°C / ±1.0°C from +75°C to +95°C - meets JEDEC JC42.4 active-range specification for DIMM thermal management
Operating Voltage	3.0V to 3.6V - matches DDR3/DDR4 SPD bus voltage, avoids level-shifting in memory subsystems
Shutdown Current	≤3 µA - enables low-power thermal monitoring during system standby without compromising SPD data integrity
EEPROM Size & Protection	256 bytes; lower 128 bytes (00h–7Fh) software-reversible or permanent write-protect - secures vendor ID, module timing, and SPD configuration
I²C/SMBus Interface	10–100 kHz clock; open-drain SDA/SCL; up to 8 devices per bus - supports multi-DIMM thermal polling in servers and workstations
Event Output	Open-drain, configurable as comparator (thermostat), interrupt, or critical alert - directly interfaces with host BMC or CPU thermal control logic
Conversion Time	65–125 ms - balances measurement latency and power consumption for periodic DIMM temperature sampling

Pinout & Package

Package: 8-pin TSSOP (MO-153, 3.0 mm × 4.4 mm), lead-free, RoHS-compliant, with exposed thermal pad internally connected to GND.

Pin/Terminal	Circuit Role	Design Meaning
A0	Slave Address LSB	Configures bit-0 of 7-bit I²C address (0011xxx); tied high/low to select among 8 possible device addresses on shared bus
A1	Slave Address MSB-1	Configures bit-1 of 7-bit I²C address; enables concurrent operation of multiple MCP98242T-CE/MUY on same DIMM or system bus
A2	Slave Address MSB-2	Configures bit-2 of 7-bit I²C address; required for SPD EEPROM access arbitration in multi-module systems
GND	System Ground Reference	Common return path for temperature sensor, EEPROM, and Event output; must connect to PCB ground plane
SDA	Bidirectional Data Line	I²C/SMBus data line; requires external pull-up to VDD; supports read/write of temperature registers and SPD EEPROM
SCLK	Clock Input	Master-generated clock; defines timing for all serial transfers; tolerant of SMBus timeout (40 ms typical)
Event	Open-Drain Alert Output	Asserts when TA exceeds TUPPER/TLOWER/TCRIT; polarity and function (comparator/interrupt/critical) set via CONFIG register
VDD	Power Supply	3.0–3.6V supply; powers both sensor and EEPROM; POR threshold at 2.3V (sensor) / 1.6V (EEPROM)

Key Features

Feature	Design Value
JEDEC JC42.4 Compliance	Fully satisfies mobile platform memory thermal sensor requirements, including accuracy, resolution, and register map - ensures interoperability with industry-standard SPD readers
SPD EEPROM Architecture	256-byte EEPROM with dual-zone protection: lower 128 bytes (00h–7Fh) support permanent or reversible software write-protection - preserves critical DRAM vendor data across reboots and field updates
User-Programmable Trip Limits	TUPPER, TLOWER, and TCRIT registers enable precise thermal event boundaries; hysteresis (0–6°C) prevents output chatter near thresholds - essential for stable DIMM throttling decisions
Configurable Event Output	Single pin supports three operational modes: active-high/low comparator (thermostat), microprocessor interrupt, or critical alert - eliminates need for external logic in thermal control paths
Multi-Resolution Temperature Conversion	Four selectable resolutions (0.0625°C to 0.5°C/bit) via RESOLUTION register - allows trade-off between precision and conversion time (65–125 ms) based on system thermal dynamics

Applications

DIMM Thermal Monitoring	Server Memory Subsystem
Use Scenario: Real-time temperature tracking of DDR3/DDR4 memory modules during high-load compute operations in desktops and laptops. IC Role / Device Role / Timing Role: Primary JEDEC-compliant thermal sensor providing ambient die temperature to memory controller or BIOS firmware via I²C. Use Value: Enables dynamic memory frequency scaling and thermal throttling using ±0.5°C accuracy within +75°C to +95°C - the critical operating range for DDR modules under load.	Use Scenario: Concurrent thermal supervision of 8+ DIMMs in dual-socket server platforms with centralized BMC management. IC Role / Device Role / Timing Role: Slave device on shared SMBus segment, identified by unique A2:A0 address; delivers temperature and SPD data on demand. Use Value: Supports hot-plug detection and predictive failure analysis using persistent EEPROM-stored calibration data and vendor-specific thermal profiles.
Laptop Memory Management	Industrial Embedded Memory Modules
Use Scenario: Compact thermal feedback for space-constrained SO-DIMM slots in ultrabooks and thin-and-light notebooks. IC Role / Device Role / Timing Role: Integrated SPD + sensor solution replacing discrete components; reduces BOM count and PCB area in memory module design. Use Value: Achieves <3 µA shutdown current to extend battery life during sleep states while retaining valid last-read temperature and SPD contents.	Use Scenario: Ruggedized memory modules used in industrial PCs, medical imaging systems, and telecom baseband units requiring extended temperature operation. IC Role / Device Role / Timing Role: High-reliability thermal monitor rated for -40°C to +125°C ambient; EEPROM retains SPD data through thermal cycling and power loss. Use Value: Guarantees ±2°C accuracy across full -20°C to +125°C range - sufficient for fan control and derating algorithms in harsh environments.

DIMM Thermal Monitoring

Server Memory Subsystem

Use Scenario: Real-time temperature tracking of DDR3/DDR4 memory modules during high-load compute operations in desktops and laptops.

IC Role / Device Role / Timing Role: Primary JEDEC-compliant thermal sensor providing ambient die temperature to memory controller or BIOS firmware via I²C.

Use Value: Enables dynamic memory frequency scaling and thermal throttling using ±0.5°C accuracy within +75°C to +95°C - the critical operating range for DDR modules under load.

Use Scenario: Concurrent thermal supervision of 8+ DIMMs in dual-socket server platforms with centralized BMC management.

IC Role / Device Role / Timing Role: Slave device on shared SMBus segment, identified by unique A2:A0 address; delivers temperature and SPD data on demand.

Use Value: Supports hot-plug detection and predictive failure analysis using persistent EEPROM-stored calibration data and vendor-specific thermal profiles.

Laptop Memory Management

Industrial Embedded Memory Modules

Use Scenario: Compact thermal feedback for space-constrained SO-DIMM slots in ultrabooks and thin-and-light notebooks.

IC Role / Device Role / Timing Role: Integrated SPD + sensor solution replacing discrete components; reduces BOM count and PCB area in memory module design.

Use Value: Achieves <3 µA shutdown current to extend battery life during sleep states while retaining valid last-read temperature and SPD contents.

Use Scenario: Ruggedized memory modules used in industrial PCs, medical imaging systems, and telecom baseband units requiring extended temperature operation.

IC Role / Device Role / Timing Role: High-reliability thermal monitor rated for -40°C to +125°C ambient; EEPROM retains SPD data through thermal cycling and power loss.

Use Value: Guarantees ±2°C accuracy across full -20°C to +125°C range - sufficient for fan control and derating algorithms in harsh environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature sensor + SPD EEPROM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
AT30TS74-MA8-Y	±0.5°C accuracy only at +25°C; no TCRIT register; 128-byte EEPROM; no software write-protection for lower block	Limited to basic DIMM presence detect; lacks JEDEC JC42.4 compliance and critical temperature alert capability	Select when SPD storage is primary requirement and advanced thermal event handling is unnecessary
LM75BIMM/NOPB	Standalone temperature sensor only (no EEPROM); ±2°C accuracy; 8-pin VSSOP; no SPD support or write-protection features	Requires external EEPROM for SPD; increases component count and layout complexity on memory modules	Select only if memory module design already includes separate SPD EEPROM and needs minimal thermal monitoring

Compared with AT30TS74-MA8-Y and LM75BIMM/NOPB, the MCP98242T-CE/MUY uniquely integrates JEDEC-compliant thermal sensing with SPD EEPROM and configurable event outputs in a single TSSOP-8 package - eliminating inter-component timing skew, reducing board area, and enabling unified firmware access to both temperature and memory identity data.

Availability

MCP98242T-CE/MUY is available at Aetrix Electronics and suitable for DIMM thermal monitoring, server memory subsystems, laptop memory management, and industrial embedded memory modules requiring stable component supply and long-term lifecycle support.

Supply support for MCP98242T-CE/MUY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, serving automotive, industrial, consumer, and communications markets with high-reliability silicon and development tools.

The MCP98242 product line was designed specifically for JEDEC-compliant DDR memory thermal monitoring and Serial Presence Detect (SPD) data storage - targeting memory module manufacturers needing integrated, standards-aligned sensor+EEPROM functionality in compact packages.

FAQ

What is the primary application of the MCP98242T-CE/MUY?

The MCP98242T-CE/MUY is primarily used as a JEDEC JC42.4-compliant temperature sensor and SPD EEPROM for DDR3/DDR4 memory modules. It provides accurate thermal monitoring (±0.5°C typical from +75°C to +95°C) and stores vendor-specific SPD data in its 256-byte EEPROM - enabling memory controllers to perform thermal-aware frequency scaling and ensure module compatibility. The MCP98242T-CE/MUY integrates both functions into a single TSSOP-8 package to reduce BOM cost and PCB footprint.

Does the MCP98242T-CE/MUY support I²C and SMBus protocols?

Yes, the MCP98242T-CE/MUY supports both I²C and SMBus protocols through its 2-wire serial interface (SDA/SCLK), compliant with standard-mode I²C (10–100 kHz) and SMBus timing specifications. It implements SMBus timeout (40 ms typical), acknowledges standard START/STOP conditions, and uses a 7-bit slave address (0011xxx) configurable via A0–A2 pins. The MCP98242T-CE/MUY operates within the 3.0V–3.6V range required for reliable I²C/SMBus signaling on DDR memory buses.

How is the EEPROM protected in the MCP98242T-CE/MUY?

The MCP98242T-CE/MUY EEPROM is protected via dual-layer software write-protection: the lower 128 bytes (addresses 00h–7Fh) support either permanent write-protection (PWP) or software-reversible write-protection (SWP) activated by applying 8–12V to the A0 pin, while the upper 128 bytes (80h–FFh) remain unprotected for general-purpose data. This architecture safeguards critical SPD fields like manufacturer ID and timing parameters while allowing runtime updates to non-critical fields - a feature confirmed in the DS21996D datasheet for the MCP98242T-CE/MUY.

What are the temperature accuracy specifications for the MCP98242T-CE/MUY across its operating range?

The MCP98242T-CE/MUY specifies ±0.5°C typical / ±1.0°C maximum accuracy from +75°C to +95°C, ±1.0°C typical / ±2.0°C maximum from +40°C to +125°C, and ±2.0°C typical / ±3.0°C maximum from -20°C to +125°C. At -40°C, accuracy is -2°C typical. These values are measured at VDD = 3.0–3.6V and reflect the device's compliance with JEDEC JC42.4 for memory module thermal sensors. The MCP98242T-CE/MUY maintains this performance without external calibration.

Can the Event output of the MCP98242T-CE/MUY be configured for different functions?

Yes, the Event output of the MCP98242T-CE/MUY is fully configurable via the CONFIG register: it can operate as an active-high or active-low comparator output (for thermostat use), a temperature event interrupt (for microprocessor polling), or a critical temperature alert. Configuration bits control polarity, event source (TUPPER/TLOWER window or TCRIT only), and latch behavior. This flexibility allows the MCP98242T-CE/MUY to interface directly with BMCs, CPUs, or discrete logic without external signal conditioning.

MCP98242T-CE/MUY Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 8-UFDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Function:: Temp Monitoring System (Sensor), DIMM DDR Memory

Sensor Type:: Internal

Sensing Temperature:: -40°C ~ 125°C

Accuracy:: ±3°C(Max)

Topology:: ADC (Sigma Delta), Register Bank

Output Type:: I2C/SMBus

Output Alarm:: Yes

Output Fan:: Yes

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-UDFN (2x3)

MCP98242T-CE/MUY FAQ

1.How can I place an order for MCP98242T-CE/MUY through Aetrix?

Please submit a Request for Quotation (RFQ) for MCP98242T-CE/MUY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCP98242T-CE/MUY reliable?

The price and inventory of MCP98242T-CE/MUY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP98242T-CE/MUY is usually 5 days.

3.What payment methods are accepted for MCP98242T-CE/MUY?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP98242T-CE/MUY transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCP98242T-CE/MUY?

MCP98242T-CE/MUY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCP98242T-CE/MUY order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCP98242T-CE/MUY?

For technical support, including MCP98242T-CE/MUY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP98242T-CE/MUY requirements.

6.How does Aetrix verify that MCP98242T-CE/MUY is sourced from the original manufacturer or authorized distributors?

All MCP98242T-CE/MUY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP98242T-CE/MUY meets industry standards.

7.What is the process for return or replacement of MCP98242T-CE/MUY?

All MCP98242T-CE/MUY units undergo pre-shipment inspection (PSI). If there is an issue with MCP98242T-CE/MUY, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCP98242T-CE/MUY part is unused and in its original packaging.

Return procedure for MCP98242T-CE/MUY:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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