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Microchip Technology MCP98243T-BE/MC
- Part No.:
- MCP98243T-BE/MC
- Manufacturer:
- Microchip Technology
- Category:
- Thermal Management
- Package:
- 8-VFDFN Exposed Pad
- Datasheet:
-
MCP98243T-BE/MC.pdf
- Description:
- IC TEMP SENSOR 2WIRE 3V 8-DFN
- Quantity:
- Payment:
- Shipping:
Inventory:8,320
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Product details
Overview
MCP98243T-BE/MC from Microchip Technology is a JEDEC JC42.4-TSE2002B3-compliant digital temperature sensor with integrated 2 Kbit serial EEPROM for Serial Presence Detect (SPD) in DRAM modules. It delivers ±0.2°C typical accuracy from +75°C to +95°C, operates from 2.7V to 5.5V, consumes 200 µA typical active current, and interfaces via I²C/SMBus up to 400 kHz - deployed in server DIMM thermal monitoring and SPD data storage.
For engineers reviewing the MCP98243T-BE/MC datasheet, MCP98243T-BE/MC pinout, MCP98243T-BE/MC application, or MCP98243T-BE/MC equivalent, key selection criteria include its dual-function architecture (precision sensing + write-protected EEPROM), JEDEC SPD compliance, 8-pin DFN/TSSOP package options, and configurable event output polarity for DIMM thermal alerting and system-level interrupt handling.
Technical Context
The MCP98243T-BE/MC integrates a band-gap temperature sensor and ΔΣ ADC with user-programmable registers for upper/lower/critical trip thresholds, hysteresis, shutdown mode, and event output configuration (comparator or interrupt). Its EEPROM block is organized as 256 × 8-bit, with permanent (PWP) and software-reversible (SWP) write protection on lower 128 bytes (0x00–0x7F).
It implements a standard 2-wire I²C interface compliant with SMBus v2.0, supporting up to eight devices on one bus. The Event pin is open-drain with programmable polarity; SDA/SCL inputs feature 0.05×VDD hysteresis and 50 ns spike suppression; I²C timeout is fixed at 25–35 ms for sensor operation only.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temp Accuracy (Grade B) | ±0.2°C typ. / ±1°C max. over +75°C to +95°C - meets JEDEC TSE2002B3 requirement for DIMM thermal validation |
| EEPROM Size & Protection | 2 Kbit (256 × 8), lower 128 bytes PWP/SWP enabled via A0 high-voltage input - secures vendor SPD data against accidental overwrite |
| I²C Bus Speed | Up to 400 kHz - enables fast register access and EEPROM reads/writes without bus contention in dense memory subsystems |
| Supply Range | VDD = 2.7V to 5.5V (sensor), 1.8V to 5.5V (EEPROM) - supports DDR3/DDR4 VDDQ and legacy 3.3V DIMM power rails |
| Event Output | Open-drain, polarity-selectable, de-asserts in shutdown - allows direct connection to host GPIO or interrupt controller with flexible pull-up/pull-down biasing |
| Thermal Response | 0.7 s (DFN-8) to 1.4 s (TSSOP-8) to 63% of final temp - enables rapid thermal tracking during memory module power transients |
| Shutdown Current | 1–3 µA - reduces system standby power when DIMM thermal monitoring is temporarily suspended |
Pinout & Package
Available in 8-pin DFN-8 (2×3 mm), TDFN-8, UDFN-8, and TSSOP-8 packages, all featuring an exposed thermal pad (EP) internally connected to GND for enhanced PCB heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0 | Slave address LSB + EEPROM write protect enable | Configures I²C address bit 0; applying 7–12 V enables SWP/PWP - critical for secure SPD programming |
| A1, A2 | Slave address bits | Set device address (0011xxxA0) to support up to 8 sensors on same bus - avoids I²C address collision in multi-DIMM systems |
| GND | System ground reference | Reference for analog sensor, digital logic, and EP thermal path - must be low-impedance connection to minimize noise coupling |
| SDA | Bidirectional I²C data line | Open-drain, requires external pull-up; supports ACK/NAK and repeated start - handles both sensor register and EEPROM byte transfers |
| SCL | I²C clock input | Master-generated clock; timing-critical for tSU:DI (100 ns min @ 400 kHz) - dictates minimum microcontroller I²C peripheral speed |
| Event | Programmable temperature alert output | Open-drain, active-high/low selectable; asserts when TA exceeds TUPPER/TLOWER - triggers host thermal throttling or logging |
| VDD | Power supply input | Supplies sensor core and EEPROM logic; POR threshold at 2.2 V - ensures reliable initialization across voltage droop scenarios |
| EP | Exposed thermal pad | Internally tied to GND; improves θJA by up to 52.5°C/W (TDFN) - essential for maintaining junction temp <150°C under sustained load |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC JC42.4-TSE2002B3 Compliance | Fully certified for memory module thermal sensing - eliminates need for external qualification in DDR3/DDR4 DIMM designs |
| Integrated 2 Kbit EEPROM | 256-byte SPD data storage with hardware-enforced write protection - satisfies JEDEC SPD specification for DRAM vendor ID, timing, and thermal parameters |
| User-Programmable Trip Registers | TUPPER, TLOWER, TCRIT with hysteresis control - enables precise thermal management policies (e.g., throttle at 85°C, shut down at 105°C) |
| Configurable Event Output Polarity | Active-low comparator or active-high interrupt mode - matches host SoC GPIO interrupt polarity without level-shifting circuitry |
| Low-Power Shutdown Mode | 1–3 µA quiescent current with retained register state - extends battery life in portable memory test equipment and embedded diagnostics tools |
Applications
| Server DIMM Thermal Monitoring | DDR4 Memory Module SPD Storage |
|---|---|
Use Scenario: Real-time temperature tracking of DDR4 RDIMMs in 1U rack servers during sustained memory bandwidth workloads. IC Role / Device Role / Timing Role: Primary JEDEC-compliant thermal sensor feeding ambient die temperature to BMC via I²C; updates every 65–125 ms. Use Value: Enables dynamic memory frequency scaling before thermal throttling occurs, preserving bandwidth while avoiding system crashes. | Use Scenario: Storing JEDEC-defined SPD data (vendor ID, CAS latency, refresh rate, thermal limits) in DDR4 UDIMMs shipped to OEMs. IC Role / Device Role / Timing Role: Dual-role IC: temperature sensor during operation; nonvolatile SPD data repository during boot and manufacturing programming. Use Value: Eliminates separate EEPROM chip, reducing BOM count and PCB area while ensuring SPD integrity via PWP/SWP protection. |
| Laptop SO-DIMM Health Diagnostics | Industrial Memory Subsystem Validation |
Use Scenario: Embedded thermal logging in laptop memory subsystems to correlate memory errors with ambient temperature excursions. IC Role / Device Role / Timing Role: Secondary sensor providing high-accuracy temperature history (±0.2°C) stored in internal EEPROM for post-failure analysis. Use Value: Captures thermal profiles during intermittent memory faults, enabling root-cause analysis without external dataloggers. | Use Scenario: Validating thermal performance of custom memory modules in industrial controllers operating from -40°C to +85°C. IC Role / Device Role / Timing Role: Reference-grade temperature monitor with extended range (-40°C to +125°C) and 2.7–5.5V supply flexibility. Use Value: Confirms memory module thermal behavior across full industrial temperature range, satisfying IEC 61000-6-2 immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar temperature-sensing-with-SPD applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT30TS74-MA8-Y | ±0.5°C max accuracy over -20°C to +125°C; no integrated EEPROM; I²C up to 1 MHz | Requires external EEPROM for SPD; better accuracy at extremes but lacks JEDEC SPD compliance | Select when higher-speed I²C or wider accuracy spec is prioritized over SPD integration |
| MCP9808-E/MS | ±0.25°C max accuracy; no EEPROM; 2.7–5.5V; 200 µA typical current; TDFN-8 package | Same sensor core architecture but no SPD functionality - used where thermal monitoring is standalone | Select when SPD data storage is handled elsewhere (e.g., dedicated SPD EEPROM or flash-based firmware) |
Compared with AT30TS74-MA8-Y and MCP9808-E/MS, the MCP98243T-BE/MC uniquely combines JEDEC SPD-compliant EEPROM with Grade B thermal accuracy in a single 8-pin package - eliminating inter-chip timing skew, reducing layout complexity, and guaranteeing SPD data co-location with the sensor that validates it.
Availability
MCP98243T-BE/MC is available at Aetrix Electronics and suitable for server DIMM thermal monitoring, DDR4 memory module SPD storage, and industrial memory subsystem validation requiring stable component supply and long-term lifecycle support.
Supply support for MCP98243T-BE/MC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, headquartered in Chandler, Arizona, with global design and manufacturing operations.
The MCP98243T-BE/MC belongs to Microchip's JEDEC-compliant memory module thermal sensor family, engineered specifically for integration into DDR3/DDR4 DIMMs where simultaneous precision temperature measurement and SPD data storage are required.
FAQ
What is the primary function of the MCP98243T-BE/MC in a DDR4 memory module?
The MCP98243T-BE/MC serves a dual role: it measures ambient temperature with ±0.2°C typical accuracy per JEDEC JC42.4-TSE2002B3, and stores SPD data in its integrated 2 Kbit EEPROM. This eliminates the need for separate temperature and SPD ICs on DDR4 UDIMMs and RDIMMs, reducing BOM cost and PCB footprint while ensuring thermal and identity data co-location.
How does the EEPROM write protection work on the MCP98243T-BE/MC?
The MCP98243T-BE/MC supports Permanent Write Protect (PWP) and Software Reversible Write Protect (SWP) on addresses 0x00–0x7F. Protection is enabled by applying 7–12 V to the A0 pin (VHV), which activates internal high-voltage circuitry. Lower 128 bytes become write-locked, while upper 128 bytes (0x80–0xFF) remain freely writable - ideal for securing vendor SPD fields.
What I²C bus speed does the MCP98243T-BE/MC support, and why does it matter for DIMM applications?
The MCP98243T-BE/MC supports I²C up to 400 kHz (Fast Mode), significantly faster than the 100 kHz limit of the MCP98242. This enables quicker SPD reads during system boot and faster temperature register polling during thermal management - critical for high-bandwidth DDR4 systems where bus latency directly impacts memory initialization time and thermal response agility.
Can the MCP98243T-BE/MC operate across the full industrial temperature range?
Yes, the MCP98243T-BE/MC operates from -40°C to +125°C, with specified accuracy of ±1°C maximum over -20°C to +125°C. Its thermal response time (0.7 s in DFN-8) and low shutdown current (1–3 µA) make it suitable for industrial memory subsystems exposed to wide ambient swings, including outdoor telecom base stations and factory automation controllers.
What package options are available for the MCP98243T-BE/MC, and how do they affect thermal performance?
The MCP98243T-BE/MC is offered in DFN-8 (2×3 mm), TDFN-8, UDFN-8, and TSSOP-8 packages, all with an exposed thermal pad (EP) tied to GND. Thermal resistance varies: UDFN-8 achieves θJA = 41°C/W, TDFN-8 is 52.5°C/W, DFN-8 is 68°C/W, and TSSOP-8 is 139°C/W. Selecting UDFN-8 or TDFN-8 maximizes heat dissipation in space-constrained DIMM layouts.
MCP98243T-BE/MC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-VFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Temp Monitoring System (Sensor), DIMM DDR Memory
- Sensor Type:
- Internal
- Sensing Temperature:
- -40°C ~ 125°C
- Accuracy:
- ±3°C(Max)
- Topology:
- ADC (Sigma Delta), Register Bank
- Output Type:
- I2C/SMBus
- Output Alarm:
- Yes
- Output Fan:
- No
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DFN (2x3)
MCP98243T-BE/MC FAQ
1.How can I place an order for MCP98243T-BE/MC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP98243T-BE/MC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP98243T-BE/MC reliable?
The price and inventory of MCP98243T-BE/MC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP98243T-BE/MC is usually 5 days.
3.What payment methods are accepted for MCP98243T-BE/MC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP98243T-BE/MC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP98243T-BE/MC?
MCP98243T-BE/MC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP98243T-BE/MC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP98243T-BE/MC?
For technical support, including MCP98243T-BE/MC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP98243T-BE/MC requirements.
6.How does Aetrix verify that MCP98243T-BE/MC is sourced from the original manufacturer or authorized distributors?
All MCP98243T-BE/MC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP98243T-BE/MC meets industry standards.
7.What is the process for return or replacement of MCP98243T-BE/MC?
All MCP98243T-BE/MC units undergo pre-shipment inspection (PSI). If there is an issue with MCP98243T-BE/MC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP98243T-BE/MC part is unused and in its original packaging.
Return procedure for MCP98243T-BE/MC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCP98243T-BE/MC Tags
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EMC2101-ACZL-TR
Microchip Technology
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MCP9844T-BE/MNY
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EMC2101-R-ACZL-TR
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MAX6604AATA+T
Analog Devices Inc./Maxim Integrated
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ADT7475ARQZ-REEL
onsemi
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MAX6684ESA+T
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MAX6639AEE+
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