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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Thermal Management

Microchip Technology MCP9843T-BE/MNY

Name: MCP9843T-BE/MNY
Brand: Microchip Technology
SKU: MCP9843T-BE/MNY
Price: 2.40 USD
Availability: InStock
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Part No.:: MCP9843T-BE/MNY

Manufacturer:: Microchip Technology

Category:: Thermal Management

Package:: 8-WFDFN Exposed Pad

Datasheet:: MCP9843T-BE/MNY.pdf

Description:: IC TEMP SENSOR DGTL 8-TDFN

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Product details

Overview

MCP9843T-BE/MNY from Microchip Technology is a JEDEC JC42.4-TSE3000B3-compliant digital temperature sensor with ±0.2°C typical accuracy from +75°C to +95°C, 2-wire I²C/SMBus interface, and user-programmable event boundaries for thermal monitoring in memory modules. It operates from 2.7V to 5.5V, draws 200 µA typical supply current, and features an open-drain Event output for alert signaling in DIMM thermal management systems.

For engineers reviewing the MCP9843T-BE/MNY datasheet, MCP9843T-BE/MNY pinout, MCP9843T-BE/MNY application, or MCP9843T-BE/MNY equivalent, this page delivers verified package mapping (UDFN-8), confirmed pin functions (A0–A2, SDA, SCL, Event, VDD, GND, EP), JEDEC compliance scope, resolution options (0.0625°C to 0.5°C), and validated alternative parts for SPD-adjacent thermal sensing roles.

Technical Context

The MCP9843T-BE/MNY integrates a band-gap temperature sensor and a Delta-Sigma ADC with programmable resolution (0.0625°C to 0.5°C per LSB), enabling configurable conversion time (65–125 ms) and thermal event detection via TUPPER/TLOWER/TCRIT registers. Its I²C interface supports up to 400 kHz bus frequency and includes built-in timeout protection (25–35 ms) for robust communication.

It implements JEDEC JC42.4-TSE3000B3 specification for memory module thermal sensors, with Grade B accuracy across -20°C to +125°C, power supply rejection of ±0.3°C/V over 2.7–5.5V, and thermal response of 0.7 s (63% in oil bath) in UDFN-8 package. The Event pin supports active-high/active-low comparator or interrupt modes, configurable via CONFIG register bits.

Key Specifications

Parameter	Value and Actual Design Meaning
Temperature Accuracy	±0.2°C (typ) / ±1°C (max) from +75°C to +95°C - meets JEDEC TSE3000B3 Grade B for DIMM thermal validation
Supply Voltage Range	2.7V to 5.5V - supports wide-system rail compatibility; specified operation at 3.0–3.6V per JEDEC
Interface	I²C/SMBus (400 kHz max) - enables multi-drop configuration with up to 8 devices on one bus
Resolution Options	0.0625°C, 0.125°C, 0.25°C, or 0.5°C per LSB - selectable via Resolution register for trade-off between precision and conversion time
Event Output	Open-drain, software-configurable polarity - allows direct connection to microcontroller interrupt or thermostat logic without level-shifting
Shutdown Current	1 µA (typ) - enables ultra-low-power thermal monitoring during system sleep states
Thermal Response	0.7 s (63% step) in UDFN-8 - fast enough for real-time DIMM thermal throttling decisions

Pinout & Package

Package: 8-pin 2×3 mm UDFN with exposed thermal pad (EP), pin-compatible with DFN-8/TDFN-8/TSSOP-8 variants per Microchip DS22153C.

Pin/Terminal	Circuit Role	Design Meaning
A0	Slave address LSB + EEPROM write protect voltage input	Configures I²C address bit 0; accepts 7–12 V HV signal to enable software write protection (SWP)
A1	Slave address bit 1	Connects to VDD/GND to set I²C address bit 1; internal pull-down ensures default low state
A2	Slave address bit 2	Connects to VDD/GND to set I²C address bit 2; enables up to 8 unique addresses on same bus
GND	System ground reference	Reference for all analog/digital circuitry; internally connected to exposed thermal pad (EP)
SDA	Bidirectional I²C data line	Open-drain, requires external pull-up; supports standard-mode (100 kHz) and fast-mode (400 kHz) I²C
SCL	I²C clock input	Master-generated clock; device does not stretch SCL low time; timeout protection active (25–35 ms)
Event	Programmable thermal alert output	Open-drain output asserting when TA exceeds TUPPER/TLOWER/TCRIT; polarity and mode software-selectable
VDD	Power supply input	Accepts 2.7–5.5 V; POR threshold at 2.2 V; PSRR ±0.3°C/V over full range
EP	Exposed thermal pad	Internally tied to GND; improves thermal conduction from die to PCB; must be soldered to ground plane

Key Features

Feature	Design Value
JEDEC JC42.4-TSE3000B3 Compliance	Fully compliant with memory module thermal sensor standard - ensures interoperability with DDR3/DDR4 SPD infrastructure
User-Programmable Temperature Boundaries	TUPPER, TLOWER, and TCRIT registers allow precise thermal trip points for hysteresis-based throttling or critical shutdown
Configurable Resolution & Conversion Time	Four resolution modes (0.0625–0.5°C/LSB) let designers balance measurement granularity against 65–125 ms conversion latency
Low-Power Shutdown Mode	1 µA typical shutdown current enables persistent thermal monitoring without impacting system standby power budget
Robust I²C Interface	400 kHz max clock, 25–35 ms timeout, 50 ns spike suppression, and 0.05×VDD hysteresis ensure reliable communication in noisy server environments

Applications

Server DIMM Thermal Monitoring	Laptop Memory Module SPD Integration
Use Scenario: Real-time temperature tracking of DDR4 memory modules in 1U rack servers under sustained load. IC Role / Device Role / Timing Role: Primary JEDEC-compliant thermal sensor feeding temperature data to BMC/IPMI for dynamic memory throttling. Use Value: ±0.2°C accuracy in +75°C to +95°C range ensures precise detection of thermal excursions before DRAM timing violations occur.	Use Scenario: Embedded thermal sensing within SO-DIMM modules used in thin-and-light laptops with limited airflow. IC Role / Device Role / Timing Role: Integrated SPD-adjacent sensor providing ambient die temperature to platform firmware during boot and runtime. Use Value: UDFN-8 footprint and 0.7 s thermal response enable rapid detection of localized hotspots near memory banks.
Industrial Edge Compute Memory Health	Network Equipment Line Card Thermal Guarding
Use Scenario: Continuous thermal logging in fanless edge AI accelerators where memory junction temperature must stay below 105°C. IC Role / Device Role / Timing Role: Standalone thermal monitor interfacing directly with host SoC via I²C to trigger adaptive clock scaling. Use Value: 2.7–5.5 V operation and -40°C to +125°C extended range support unregulated industrial power rails and harsh ambient conditions.	Use Scenario: Dual-rail thermal supervision on high-density line cards where multiple DIMMs share proximity to power converters. IC Role / Device Role / Timing Role: Event-driven alert generator asserting open-drain signal to FPGA-based thermal manager upon boundary exceedance. Use Value: Configurable Event polarity and interrupt mode eliminate need for external logic, reducing BOM count and layout complexity.

Server DIMM Thermal Monitoring

Laptop Memory Module SPD Integration

Use Scenario: Real-time temperature tracking of DDR4 memory modules in 1U rack servers under sustained load.

IC Role / Device Role / Timing Role: Primary JEDEC-compliant thermal sensor feeding temperature data to BMC/IPMI for dynamic memory throttling.

Use Value: ±0.2°C accuracy in +75°C to +95°C range ensures precise detection of thermal excursions before DRAM timing violations occur.

Use Scenario: Embedded thermal sensing within SO-DIMM modules used in thin-and-light laptops with limited airflow.

IC Role / Device Role / Timing Role: Integrated SPD-adjacent sensor providing ambient die temperature to platform firmware during boot and runtime.

Use Value: UDFN-8 footprint and 0.7 s thermal response enable rapid detection of localized hotspots near memory banks.

Industrial Edge Compute Memory Health

Network Equipment Line Card Thermal Guarding

Use Scenario: Continuous thermal logging in fanless edge AI accelerators where memory junction temperature must stay below 105°C.

IC Role / Device Role / Timing Role: Standalone thermal monitor interfacing directly with host SoC via I²C to trigger adaptive clock scaling.

Use Value: 2.7–5.5 V operation and -40°C to +125°C extended range support unregulated industrial power rails and harsh ambient conditions.

Use Scenario: Dual-rail thermal supervision on high-density line cards where multiple DIMMs share proximity to power converters.

IC Role / Device Role / Timing Role: Event-driven alert generator asserting open-drain signal to FPGA-based thermal manager upon boundary exceedance.

Use Value: Configurable Event polarity and interrupt mode eliminate need for external logic, reducing BOM count and layout complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STS401-DIS-BF	±0.1°C max accuracy over 0–100°C; I²C interface; no Event pin; 1.08–3.6 V supply	Lacks programmable thermal alerts and JEDEC SPD alignment; suited for general-purpose sensing, not DIMM-specific use	Select when highest absolute accuracy is required and alert functionality is handled externally
MCP98243T-BE/MNY	Includes 2 Kbit EEPROM for SPD data storage; identical sensor core and pinout; shares same JEDEC compliance	Required where vendor ID, module timing, and SPD checksums must be stored on-module alongside temperature data	Choose only if EEPROM functionality is needed - otherwise MCP9843T-BE/MNY offers lower cost and simpler firmware

Compared with STS401-DIS-BF, MCP9843T-BE/MNY provides JEDEC-aligned event signaling and wider voltage range but trades off 0.1°C absolute accuracy; versus MCP98243T-BE/MNY, it removes EEPROM overhead to reduce power and simplify initialization while retaining full thermal sensing capability.

Availability

MCP9843T-BE/MNY is available at Aetrix Electronics and suitable for server DIMM thermal monitoring, laptop memory SPD integration, and industrial edge compute memory health applications requiring stable component supply, JEDEC compliance, and long-term lifecycle support.

Supply support for MCP9843T-BE/MNY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and connectivity solutions, headquartered in Chandler, Arizona, with global design and manufacturing operations.

The MCP9843 series belongs to Microchip's JEDEC-compliant thermal sensor product line, engineered specifically for high-accuracy, low-power temperature monitoring in DDR memory subsystems and SPD-enabled platforms.

FAQ

What is the operating temperature range of the MCP9843T-BE/MNY?

The MCP9843T-BE/MNY operates across -40°C to +125°C ambient temperature, with specified accuracy performance from -20°C to +125°C. Its thermal sensor core remains functional beyond the specified range, though accuracy degrades outside -20°C to +125°C per JEDEC TSE3000B3 Grade B limits. The UDFN-8 package's θJA of 41°C/W supports reliable operation in thermally constrained DIMM layouts.

Does the MCP9843T-BE/MNY include EEPROM memory?

No, the MCP9843T-BE/MNY does not include EEPROM memory. It is the temperature-sensing-only variant of the family. The MCP98243T-BE/MNY is the version that integrates 2 Kbit serial EEPROM for SPD data storage. The MCP9843T-BE/MNY shares identical pinout, accuracy, and JEDEC compliance but omits EEPROM circuitry to reduce cost and power consumption.

How is the I²C address configured on the MCP9843T-BE/MNY?

The MCP9843T-BE/MNY uses three hardware address pins - A0, A1, and A2 - to configure its 7-bit I²C slave address. These pins connect to VDD (logic 1) or GND (logic 0) to set bits A0–A2, while the fixed MSBs are '0011', resulting in base address 0x18. This allows up to eight MCP9843T-BE/MNY devices on a single I²C bus, each with a unique address determined by their A0–A2 strap configuration.

What is the function of the EP (exposed pad) on the MCP9843T-BE/MNY UDFN-8 package?

The EP (exposed thermal pad) on the MCP9843T-BE/MNY is internally connected to GND and serves as a primary thermal conduction path from the silicon die to the PCB. It must be soldered to a dedicated GND copper pour to achieve the specified θJA of 41°C/W. Leaving EP unconnected or floating degrades thermal performance and may cause junction temperature exceedance under sustained load.

Can the MCP9843T-BE/MNY operate from a 1.8 V supply?

No, the MCP9843T-BE/MNY is not rated for 1.8 V operation. Its specified JEDEC-compliant voltage range is 3.0 V to 3.6 V, with full functionality guaranteed from 2.7 V to 5.5 V. While the device may power up at 1.8 V, key parameters-including accuracy, I²C timing, and Event output behavior-are not characterized or guaranteed below 2.7 V. For 1.8 V systems, consider the MCP98243T-BE/MNY, which supports 1.8–5.5 V for its EEPROM block but retains the same sensor voltage constraints.

MCP9843T-BE/MNY Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 8-WFDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Function:: Temp Monitoring System (Sensor)

Sensor Type:: Internal

Sensing Temperature:: -40°C ~ 125°C

Accuracy:: ±3°C(Max)

Topology:: ADC (Sigma Delta), Register Bank

Output Type:: I2C/SMBus

Output Alarm:: Yes

Output Fan:: No

Voltage - Supply:: 2.7V ~ 5.5V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-TDFN (2x3)

MCP9843T-BE/MNY FAQ

1.How can I place an order for MCP9843T-BE/MNY through Aetrix?

Please submit a Request for Quotation (RFQ) for MCP9843T-BE/MNY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCP9843T-BE/MNY reliable?

The price and inventory of MCP9843T-BE/MNY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP9843T-BE/MNY is usually 5 days.

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MCP9843T-BE/MNY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCP9843T-BE/MNY order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCP9843T-BE/MNY?

For technical support, including MCP9843T-BE/MNY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP9843T-BE/MNY requirements.

6.How does Aetrix verify that MCP9843T-BE/MNY is sourced from the original manufacturer or authorized distributors?

All MCP9843T-BE/MNY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP9843T-BE/MNY meets industry standards.

7.What is the process for return or replacement of MCP9843T-BE/MNY?

All MCP9843T-BE/MNY units undergo pre-shipment inspection (PSI). If there is an issue with MCP9843T-BE/MNY, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCP9843T-BE/MNY part is unused and in its original packaging.

Return procedure for MCP9843T-BE/MNY:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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