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NXP Semiconductors MCXA156VPJ

Part No.:
MCXA156VPJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-BGA
Datasheet:
AetrixMCXA156VPJ.pdf
Description:
IC MCU
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:260

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Product details

Overview

MCXA156VPJ from NXP Semiconductors is a 96 MHz Arm Cortex-M33 microcontroller with 1024 KB Flash, 128 KB SRAM (including 8 KB with ECC), and 82 GPIOs in a 112-pin VFBGA package. It integrates FlexCAN FD, USB Full-Speed with on-chip PHY, dual 16-bit ADCs (up to 3.2 Msps), and advanced motor control peripherals including two FlexPWM modules-designed for industrial motion control and BLDC/PMSM drives.

For engineers reviewing the MCXA156VPJ datasheet, MCXA156VPJ pinout, MCXA156VPJ application, or MCXA156VPJ equivalent, key selection considerations include its 96 MHz real-time performance, -40 °C to 125 °C operating range, ultra-low Deep Power Down current (412 nA), and support for CAN FD and I3C in compact VFBGA112 packaging.

Technical Context

The MCXA156VPJ implements an Arm Cortex-M33 core without TrustZone or MPU, operating at 96 MHz with FPU and DSP extensions. Its memory subsystem includes single-bank Flash with ECC, 4 KB cache engine, and configurable SRAM partitions-including 8 KB with ECC and full retention down to Deep Power Down mode.

Power management features include integrated LDOs (core and IO), multiple low-power modes (Deep Sleep: 32.26 μA, Power Down: 8.2 μA), and hardware watchdogs. Clocking relies on FRO192M/FRO12M/FRO16K oscillators plus external crystal support up to 50 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M33 @ 96 MHz, no TrustZone/MPU, with FPU and DSP extensions
Flash / SRAM1024 KB Flash with ECC; 128 KB SRAM (8 KB with ECC); all RAM retained in Deep Power Down
Operating Temp-40 °C to 125 °C - qualified for industrial and automotive under-hood environments
Low-Power Current412 nA Deep Power Down; 8.2 μA Power Down; 32.26 μA Deep Sleep - enables battery-powered longevity
Analog Peripherals2× 16-bit ADC (3.2 Msps), 1× 12-bit DAC, 2× low-power comparators (1 functional in Deep Power Down)
ConnectivityFlexCAN FD, USB FS with on-chip PHY, 5× LPUART, 4× LPI2C, 2× LPSPI, 1× I3C
Motor Control2× FlexPWM (12 complementary PWM outputs), 2× eQDC, 2× AOI modules - supports sensorless BLDC and field-oriented PMSM control

Pinout & Package

VFBGA112 package (7 mm × 7 mm × 0.86 mm, 0.5 mm pitch) with 82 GPIOs, including 8 high-drive (20 mA) pins, 21 pins rated for 50 MHz operation, and 2 dedicated 5V-tolerant inputs (P3_27, P3_28).

Pin/TerminalCircuit RoleDesign Meaning
VDD / VSSCore power supply and groundSupports 1.71–3.6 V operation; LDO_CORE delivers regulated 1.0–1.1 V core voltage
VDD_P3Port 3 IO supplyConfigurable for 1.2 V (±0.09 V) or 1.71–3.6 V - enables mixed-voltage interface design
VDD_ANAAnalog domain supplyMust match VDD ±0.1 V; powers ADC, DAC, comparators, and OpAmp
RESET_BActive-low reset inputHigh-drive strength; internal pullup; supports external reset assertion and brownout recovery
USB0_DP / USB0_DMUSB Full-Speed differential pairOn-chip FS PHY eliminates need for external transceiver; requires 3.0–3.6 V VDD_USB
CAN0_TX / CAN0_RXFlexCAN FD transmit/receiveSupports CAN FD up to 5 Mbps; integrated termination and filtering reduce BOM count

Key Features

FeatureDesign Value
Ultra-low Deep Power Down412 nA current draw with wake timer disabled and reset enabled - extends shelf life of energy-harvested devices
Dual 16-bit ADC with Temp Sensor3.2 Msps sampling rate per ADC; integrated temperature sensor per channel enables self-calibration in motor thermal monitoring
FlexCAN FD + USB FS IntegrationSingle-chip support for both industrial fieldbus (CAN FD) and host connectivity (USB FS) - reduces system-level component count
Configurable SRAM ECC8 KB SRAM with one-bit correction/two-bit detection - protects critical control data in safety-critical motion applications
Peripheral Input MultiplexingINPUTMUX allows dynamic routing of up to 128 signals to 32 peripheral inputs - simplifies PCB layout and firmware flexibility

Applications

Industrial Motor DriveSmart Energy Metering

Use Scenario: Closed-loop control of BLDC and PMSM motors in HVAC compressors and industrial pumps.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms via 96 MHz Cortex-M33, synchronized PWM generation using dual FlexPWM, and current sensing via dual 16-bit ADCs.

Use Value: Enables <1 μs interrupt latency and deterministic timing for torque ripple reduction, supported by 82 GPIOs for gate driver interfacing and fault signaling.

Use Scenario: High-accuracy polyphase energy metering with tamper detection and secure firmware updates.

IC Role / Device Role / Timing Role: Precision analog acquisition (dual ADCs), cryptographic operations (ROM-based bootloader), and secure communication (FlexCAN FD for HAN, USB FS for field calibration).

Use Value: Meets IEC 62053-21 Class 0.5S accuracy requirements while maintaining -40 °C to 125 °C operation and 412 nA Deep Power Down for battery backup.

Factory Automation HMIRobotic Appliance Control

Use Scenario: Touch-enabled human-machine interface panel with local logic, display driving, and PLC communication.

IC Role / Device Role / Timing Role: Graphics acceleration via FlexIO, serial interface bridging (LPUART/LPI2C/I3C), and real-time response to button/touch events using 19 Deep Power Down wake-up pins.

Use Value: Consolidates display controller, communication hub, and safety monitor functions - reducing bill-of-materials and board space in compact enclosures.

Use Scenario: Autonomous vacuum cleaner navigation and motor coordination with obstacle avoidance and battery management.

IC Role / Device Role / Timing Role: Simultaneous quadrature decoding (2× eQDC), PWM-driven brushless motors (2× FlexPWM), and Li-ion battery voltage/current monitoring (ADC + DAC + LPCMP).

Use Value: Achieves sub-millisecond motor commutation timing and 12-bit DAC-controlled reference voltages for precise current loop regulation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCXA155VPJSame VFBGA112 package, 96 MHz core, but 512 KB Flash and 96 KB SRAMSuitable for less complex motor control or connectivity-only edge nodes where full 1 MB Flash is unnecessarySelect when firmware size is ≤512 KB and cost optimization is prioritized over future-proofing
MCXA156VLLLQFP100 package (14 mm × 14 mm), same 96 MHz/1024 KB/128 KB specs, 81 GPIOsBetter suited for prototyping, manual assembly, or designs requiring higher pin accessibility and thermal dissipationChoose when board-level debug access, reworkability, or heatsinking capability outweighs footprint constraints

Compared with MCXA155VPJ, the MCXA156VPJ provides double Flash/SRAM capacity for complex firmware and data logging; compared with MCXA156VLL, it offers identical functionality in a 30% smaller footprint but requires fine-pitch BGA assembly and has one fewer GPIO.

Availability

MCXA156VPJ is available at Aetrix Electronics and suitable for industrial motor drives, smart energy metering, and robotic appliance control requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MCXA156VPJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The MCX series targets cost-sensitive, high-reliability industrial and smart home applications, delivering scalable Arm Cortex-M33 performance with integrated analog, motor control, and low-power features - specifically engineered for motion control, energy management, and intelligent edge devices.

FAQ

What is the maximum operating frequency and core configuration of the MCXA156VPJ?

The MCXA156VPJ operates at a maximum CPU frequency of 96 MHz using an Arm Cortex-M33 core with FPU and DSP extensions. It does not include TrustZone security or an MPU. The core runs at 1.1 V nominal supply and achieves 396 CoreMark (4.12 CoreMark/MHz), validated across the full -40 °C to 125 °C temperature range.

Does the MCXA156VPJ support CAN FD, and what are its physical layer requirements?

Yes, the MCXA156VPJ includes one FlexCAN module supporting CAN FD up to 5 Mbps. It requires external CAN transceiver and termination resistors; the MCU provides TX/RX signal lines only. No on-chip CAN PHY is integrated - unlike its USB FS interface, which includes a full on-chip PHY.

What low-power modes are available on the MCXA156VPJ, and what is the lowest achievable current draw?

The MCXA156VPJ supports four low-power modes: Deep Sleep (32.26 μA), Power Down (8.2 μA), and Deep Power Down (412 nA). In Deep Power Down mode, all SRAM is powered off, wake timer is disabled, and only the reset pin remains active - enabling multi-year battery operation in maintenance-free sensor nodes.

How many ADC channels does the MCXA156VPJ support, and what is their resolution and speed?

The MCXA156VPJ integrates two independent 16-bit SAR ADCs. Each supports up to 32 input channels (dependent on package pinout), with maximum sampling rates of 3.2 Msps in 16-bit mode and 4 Msps in 12-bit mode. Each ADC includes an integrated temperature sensor for on-die thermal monitoring.

Is the MCXA156VPJ pin-compatible with other members of the MCX A1xx family, such as the MCXA154VPJ or MCXA155VPJ?

No, the MCXA156VPJ is not pin-compatible with MCXA154VPJ or MCXA155VPJ despite sharing the same VFBGA112 package. Pin assignments differ across variants due to varying peripheral enablement (e.g., second FlexPWM, additional ADC channels, I3C), requiring PCB redesign for substitution. Always verify pin mapping using the official MCXAP100M96FS6RM reference manual.

MCXA156VPJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-BGA
Series:
MCX A
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
96MHz
Connectivity:
FlexIO, I2C, SPI, UART/USART, USB
Peripherals:
DMA, LVD/HVD, POR, PWM, WDT
Number of I/O:
82
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
-
Data Converters:
D/A 1x12b
Oscillator Type:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCXA156VPJ FAQ

1.How can I place an order for MCXA156VPJ through Aetrix?

Please submit a Request for Quotation (RFQ) for MCXA156VPJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCXA156VPJ reliable?

The price and inventory of MCXA156VPJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCXA156VPJ is usually 5 days.

3.What payment methods are accepted for MCXA156VPJ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCXA156VPJ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCXA156VPJ?

MCXA156VPJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCXA156VPJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCXA156VPJ?

For technical support, including MCXA156VPJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCXA156VPJ requirements.

6.How does Aetrix verify that MCXA156VPJ is sourced from the original manufacturer or authorized distributors?

All MCXA156VPJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCXA156VPJ meets industry standards.

7.What is the process for return or replacement of MCXA156VPJ?

All MCXA156VPJ units undergo pre-shipment inspection (PSI). If there is an issue with MCXA156VPJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCXA156VPJ part is unused and in its original packaging.

Return procedure for MCXA156VPJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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