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NXP Semiconductors MCXN235VNLT

Part No.:
MCXN235VNLT
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
-
Datasheet:
AetrixMCXN235VNLT.pdf
Description:
IC MCU 32BIT 512KB FLSH 100HLQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,667

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Product details

Overview

MCXN235VNLT from NXP Semiconductors is an Arm Cortex-M33 150 MHz 32-bit microcontroller with TrustZone, 512 KB Flash, 192 KB SRAM, EdgeLock Secure Enclave (Core Profile), and operation from –40 °C to +125 °C - designed for secure industrial edge control in energy storage systems and motor drives.

For engineers reviewing the MCXN235VNLT datasheet, MCXN235VNLT pinout, MCXN235VNLT application, or MCXN235VNLT equivalent, this page delivers verified specifications, package mapping, security architecture details, low-power operating modes (down to 1.5 μA), and confirmed alternative parts for industrial HMI, BLDC/PMSM control, and secure firmware update implementations.

Technical Context

The MCXN235VNLT implements a dual-bank Flash architecture supporting Read-While-Write and Flash Swap, with ECC for one-bit correction/two-bit detection. Its memory subsystem includes configurable SRAM (up to 192 KB, with optional ECC on 32 KB) and 256 KB ROM containing immutable secure boot code.

Security is enforced via EdgeLock Secure Enclave (Core Profile) delivering AES-256, SHA-2, ECC NIST P-256, TRNG, DICE-based device attestation, and Physically Unclonable Function (PUF)-derived UID. Tamper protection includes 6 active/passive tamper pins, voltage/temperature/light/clock glitch detection, and two Code Watchdogs.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M33 @ 150 MHz with TrustZone, FPU, SIMD, ETM, and CTI - enables real-time deterministic control with hardware-isolated secure/non-secure execution environments.
Flash Memory512 KB dual-bank Flash with ECC (1-bit correct/2-bit detect), Flash Swap, and Read-While-Write - supports robust over-the-air firmware updates without runtime interruption.
SRAM192 KB total SRAM, configurable with 32 KB ECC - provides fault-tolerant data retention for safety-critical variables during operation.
Operating Temperature–40 °C to +125 °C - qualified for under-hood automotive auxiliary modules and industrial motor drive control units.
Low-Power ModesDeep Power-down: 1.5 μA with RTC active and 32 KB SRAM retention; Power-down: 2.39 μA with full 192 KB SRAM retention - enables multi-year battery life in remote sensor nodes.
Analog Peripherals2× 16-bit ADCs (2 Msps at 16-bit, 3.15 Msps at 12-bit), 2× high-speed comparators, ±0.2 % VREF - supports precision current/voltage sensing in closed-loop motor control.
Security FeaturesEdgeLock Secure Enclave (Core Profile), PUF-based UID, DICE attestation, secure key store, and dual-mode secure boot (asymmetric + post-quantum symmetric) - meets IEC 62443-3-3 SL2 requirements for embedded device identity and integrity.

Pinout & Package

The MCXN235VNLT is packaged in a 100-pin HLQFP (14 × 14 × 1.4 mm, 0.5 mm pitch) with five independent IO power rings (VDD_P0–P4), AON domain on VDD_BAT, and support for 1.71 V–3.6 V IO supply. Pinout conforms to NXP's MCXN23x family layout per package drawing 98ASA02131D.

Pin/TerminalCircuit RoleDesign Meaning
VDD_COREDigital core supply1.045 V nominal (±0.115 V); powers CPU, cache, and internal logic - requires strict POR sequencing after VDD_SYS.
VDD_SYSSystem regulator input1.71–1.98 V supply for LVD/HVD, clock sources, and on-chip regulators - must ramp before VDD_CORE and VDD_Px supplies.
VDD_BATVBAT domain supply1.71–3.6 V input powering RTC_LP, wake timers, and Port 5 - enables ultra-low-power wake-up from Deep Power-down mode.
RESET_BActive-low reset inputAsynchronous, high-drive-strength pin with internal pull-up - asserts system reset on falling edge; supports external watchdog recovery.
SWD_CLK / SWD_DIODebug interface signalsTwo-pin Serial Wire Debug interface - enables secure authenticated debug access controlled by EdgeLock lifecycle management policies.
USB1_DP / USB1_DMUSB High-Speed differential pairOn-chip HS PHY supporting 480 Mbps host/device operation - requires VDD_USB = 3.0–3.6 V and VDD_CORE ≥ 1.1 V for HS mode.

Key Features

FeatureDesign Value
SmartDMA co-processorOffloads parallel camera interface and keypad scanning tasks from CPU - reduces active time and extends battery life in HMI applications.
FlexPWM subsystem2× FlexPWM modules, each with 4 sub-modules (12 total PWM outputs) - enables simultaneous 3-phase BLDC and PMSM motor control with dead-time insertion and fault protection.
Secure manufacturing supportImmutable ROM bootloader + EdgeLock 2GO pre-integration - allows zero-touch provisioning of keys and certificates in untrusted contract manufacturing environments.
Low-power crystal oscillator32 kHz crystal oscillator with <±20 ppm stability across –40 °C to +125 °C - maintains accurate RTC timekeeping without external components in harsh thermal environments.
Flexible I/O (FlexIO)Programmable serial/parallel interface supporting display drivers, camera interfaces, and custom protocols - eliminates need for external glue logic in space-constrained designs.

Applications

Industrial Motor ControlSmart Energy Metering

Use Scenario: Real-time field-oriented control (FOC) of permanent magnet synchronous motors in HVAC compressors and industrial pumps.

IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms, managing 12 PWM outputs, quadrature encoder feedback, and analog current sensing via dual 16-bit ADCs.

Use Value: 150 MHz Cortex-M33 with FPU delivers >3× faster vector math vs. legacy M0+ MCUs; 1.5 μA Deep Power-down enables maintenance-free operation in sealed enclosures.

Use Scenario: High-accuracy polyphase electricity metering with tamper detection and secure firmware updates over cellular LPWAN.

IC Role / Device Role / Timing Role: Secure metering SoC handling metrology calculations, TLS-secured OTA updates, and intrusion response via 6 tamper pins and ITRC module.

Use Value: EdgeLock Secure Enclave isolates metrology firmware from communication stack; PUF-derived UID prevents cloning; 125 °C rating supports transformer-mounted deployment.

Factory Automation HMIRobotic Appliance Control

Use Scenario: Touch-enabled operator panel with local voice command processing and CAN FD connectivity to PLCs and I/O modules.

IC Role / Device Role / Timing Role: Application processor running FreeRTOS, interfacing to capacitive touch controller via FlexIO, and managing dual CAN FD buses for deterministic motion control traffic.

Use Value: 8× Low-Power Flexcomms provide flexible UART/SPI/I²C for peripheral expansion; 106 GPIOs support multi-channel touch sensing and LED indicators without external expanders.

Use Scenario: Autonomous vacuum cleaner performing obstacle avoidance, brush motor control, and battery management using onboard sensors.

IC Role / Device Role / Timing Role: Central MCU coordinating QDC-based wheel odometry, FlexPWM-driven BLDC suction motor, and digital PDM microphone array for acoustic navigation.

Use Value: Dual 16-bit ADCs sample current/voltage for battery fuel gauging; 2× QDC modules track encoder position with <1 µs latency; 1.5 μA Deep Power-down extends standby time to >18 months.

Equivalent & Alternatives

The following parts are listed as comparable options for similar secure industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCXN236VKLT1024 KB Flash, 352 KB SRAM, identical security/peripheral set - no change in package or pinout.Supports larger firmware images (e.g., dual-application secure boot, ML inference models) and extended SRAM buffers for high-throughput data logging.Select when firmware size exceeds 512 KB or full 352 KB SRAM is required for real-time analytics buffers.
LPC55S69JBD100KArm Cortex-M33 @ 150 MHz, 640 KB Flash, 320 KB SRAM, EdgeLock SE (Lite Profile), no PUF or DICE attestation.Lacks tamper detection, secure manufacturing features, and post-quantum symmetric boot - suitable for cost-sensitive non-certified industrial gateways.Choose for lower-cost designs where full EdgeLock Core Profile certification is not mandated by end-customer security policy.

Compared with MCXN235VNLT, MCXN236VKLT offers double Flash/SRAM capacity in identical HLQFP100 packaging for seamless migration, while LPC55S69JBD100K provides comparable performance at reduced security scope - enabling trade-offs between certification rigor and BOM cost in industrial edge deployments.

Availability

MCXN235VNLT is available at Aetrix Electronics and suitable for industrial motor drives, smart metering systems, and factory automation HMIs requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MCXN235VNLT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based microcontrollers and hardware-rooted security.

The MCXN23x product line targets high-reliability industrial edge applications demanding functional safety, cryptographic agility, and ultra-low-power operation - specifically engineered for energy infrastructure, motion control, and secure human-machine interfaces.

FAQ

What is the maximum operating frequency and core architecture of the MCXN235VNLT?

The MCXN235VNLT features an Arm Cortex-M33 core operating at up to 150 MHz with TrustZone, MPU, FPU, SIMD, and ETM. It achieves 618 CoreMark® (4.12 CoreMark/MHz), confirming deterministic real-time performance suitable for motor control loops and industrial communication stacks. The core is fully supported by NXP's MCUXpresso SDK and validated in the MCXN23x Reference Manual.

Does the MCXN235VNLT support secure boot and cryptographic acceleration?

Yes, the MCXN235VNLT integrates EdgeLock Secure Enclave (Core Profile) with immutable ROM-based secure boot, dual-mode boot (asymmetric and post-quantum symmetric), AES-256, SHA-2, ECC NIST P-256, TRNG, and EdgeLock Accelerator for public-key cryptography. These capabilities are documented in the MCXN23x Security Reference Manual and enabled out-of-box with NXP's EdgeLock 2GO service integration.

What package type and pin count does the MCXN235VNLT use?

The MCXN235VNLT uses a 100-pin HLQFP package (14 × 14 × 1.4 mm, 0.5 mm pitch), as specified in ordering table footnote 3 and package drawing 98ASA02131D. This matches the MCXN235VKLT replacement part and maintains full pin compatibility within the HLQFP100 variant of the MCXN23x family.

How does the MCXN235VNLT achieve ultra-low power consumption in deep sleep modes?

The MCXN235VNLT achieves 1.5 μA in Deep Power-down mode with RTC active and 32 KB SRAM retention by gating clocks to non-essential domains, retaining only VBAT-supplied logic (RTC_LP, wake timers, Port 5), and disabling DC-DC/LDO regulators. This behavior is characterized across –40 °C to +125 °C and verified in the MCXN23x Data Sheet Section 2.5.

Which analog peripherals are integrated into the MCXN235VNLT and what are their key specs?

The MCXN235VNLT integrates two 16-bit ADCs (2 Msps at 16-bit, 3.15 Msps at 12-bit), two high-speed comparators functional down to Deep Power-down mode, and a ±0.2 % accurate VREF with 15 ppm/°C drift. Each ADC supports up to 4 parallel conversions and includes an integrated temperature sensor - all confirmed in the MCXN23x Data Sheet Sections 5.1 and 5.2.

MCXN235VNLT Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
-
Series:
MCX N
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CAN, Ethernet, Flexcomm, I3C, SAI, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 2x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCXN235VNLT FAQ

1.How can I place an order for MCXN235VNLT through Aetrix?

Please submit a Request for Quotation (RFQ) for MCXN235VNLT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCXN235VNLT reliable?

The price and inventory of MCXN235VNLT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCXN235VNLT is usually 5 days.

3.What payment methods are accepted for MCXN235VNLT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCXN235VNLT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCXN235VNLT?

MCXN235VNLT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCXN235VNLT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCXN235VNLT?

For technical support, including MCXN235VNLT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCXN235VNLT requirements.

6.How does Aetrix verify that MCXN235VNLT is sourced from the original manufacturer or authorized distributors?

All MCXN235VNLT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCXN235VNLT meets industry standards.

7.What is the process for return or replacement of MCXN235VNLT?

All MCXN235VNLT units undergo pre-shipment inspection (PSI). If there is an issue with MCXN235VNLT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCXN235VNLT part is unused and in its original packaging.

Return procedure for MCXN235VNLT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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