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NXP Semiconductors MCXN236VDFT
- Part No.:
- MCXN236VDFT
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
MCXN236VDFT.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 184VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,082
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Product details
Overview
MCXN236VDFT from NXP Semiconductors is an Arm Cortex-M33 150 MHz 32-bit microcontroller with 1 MB Flash, 352 KB SRAM, EdgeLock® Secure Enclave (Core Profile), and 106 GPIOs in a 184-pin VFBGA package. It delivers 618 CoreMark® (4.12 CoreMark/MHz), operates from –40 °C to +125 °C, and supports industrial motor control and secure edge AI applications.
For engineers reviewing the MCXN236VDFT datasheet, MCXN236VDFT pinout, MCXN236VDFT application, or MCXN236VDFT equivalent, this page provides verified specifications, security architecture details, low-power mode behavior (1.5 μA Deep Power-down), analog subsystem capabilities (dual 16-bit ADC at 2 Msps), and validated alternative MCU options for industrial HMI and energy storage systems.
Technical Context
The MCXN236VDFT integrates dual 16-bit ADCs supporting 4 parallel conversions at up to 2 Msps, two high-speed comparators functional down to Deep Power-down mode, and a highly accurate ±0.2 % VREF with 15 ppm/°C drift. Its analog subsystem serves precision sensor acquisition in motor drives and smart metering.
Security is implemented via EdgeLock Secure Enclave (Core Profile) with cryptographic acceleration (AES-256, SHA-2, ECC P-256), TRNG, Physically Unclonable Function (PUF)-derived device identity, DICE-based attestation, and tamper monitoring including 6 active/passive tamper pins, voltage/glitch detection, and intrusion response.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 150 MHz with TrustZone®, FPU, SIMD, ETM, and CTI - enables real-time deterministic control with hardware-isolated secure execution. |
| Memory | 1024 KB Flash (dual-bank, ECC, Read-While-Write, Flash Swap) + 352 KB SRAM (288 KB configurable with ECC) - supports robust firmware updates and data integrity in harsh environments. |
| Operating Temp | –40 °C to +125 °C - qualified for under-hood automotive ancillaries, industrial motor drives, and energy storage BMS modules. |
| Low-Power Modes | 1.5 μA Deep Power-down (RTC active, 32 KB SRAM retained); 2.39 μA Power-down (full 352 KB SRAM retention); 50 μA/MHz active current - enables multi-year battery life in wireless sensors. |
| Analog Peripherals | Dual 16-bit ADCs (2 Msps @ 16-bit, 3.15 Msps @ 12-bit, up to 61 channels), two LPCMPs, integrated temp sensors, ±0.2 % VREF - meets Class 0.5 accuracy requirements for smart metering. |
| Security Features | EdgeLock Secure Enclave (Core Profile), immutable ROM bootloader, dual secure boot (asymmetric + post-quantum symmetric), secure OTA key management via EdgeLock 2GO - satisfies PSA Certified Level 3 and IEC 62443-3-3 SL2 requirements. |
| Package & Pin Count | 184-pin VFBGA, 9 × 9 × 0.86 mm, 0.5 mm pitch - supports high-density PCB layouts for compact industrial controllers and robotics edge nodes. |
Pinout & Package
MCXN236VDFT is housed in a 184-pin Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 9 mm × 9 mm × 0.86 mm with 0.5 mm ball pitch. The package supports 106 GPIOs, 6 dedicated tamper detection pins, and five independent IO power rings (VDD_P0–P4, VDD_BAT).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Digital core supply | 1.045 V nominal (0.95–1.26 V range); powers CPU, cache, and AHB matrix - requires strict POR sequencing after VDD_SYS. |
| VDD_BAT | VBAT domain supply | 1.71–3.6 V input powering RTC_LP, wake timers, and Port 5 - must ramp before or concurrently with VDD_SYS for reliable deep-sleep retention. |
| TAMPER0–TAMPER5 | Active/passive tamper detection inputs | 6 dedicated pins supporting voltage, temperature, light, clock, and physical intrusion sensing - trigger secure wipe and alert via ITRC upon violation. |
| ADC0_IN0–ADC1_IN60 | Analog input channels | Up to 61 total ADC inputs (package-dependent); each ADC supports differential/single-ended modes and internal temperature sensing - enables simultaneous multi-sensor acquisition in BLDC/PMSM drives. |
| USB1_DP / USB1_DM | USB High-Speed differential pair | On-chip HS PHY supporting 480 Mbps host/device operation - eliminates external transceiver, reducing BOM cost and board area in HMI and diagnostic tools. |
| FLEXCAN0_TX / FLEXCAN0_RX | CAN FD interface signals | Supports 5 Mbps CAN FD frames with flexible data rate arbitration - suitable for real-time motor control feedback and industrial fieldbus integration. |
Key Features
| Feature | Design Value |
|---|---|
| SmartDMA co-processor | Offloads parallel camera interface and keypad scanning tasks from CPU - reduces latency and frees 150 MHz M33 core for real-time control loops. |
| FlexPWM subsystem | Two modules, each with 4 sub-modules delivering 12 PWM outputs - enables 3-phase inverter control with dead-time insertion and fault protection for BLDC/PMSM drives. |
| Secure manufacturing support | PUF-derived unique device identity + secure key provisioning in untrusted factories - prevents IP theft and counterfeit injection during outsourced production. |
| On-the-fly Flash encryption | Hardware-accelerated memory encryption with authentication for internal Flash - protects firmware IP against physical extraction and cloning attacks. |
| Multi-rate timer (MRT) | Independent 32-bit timer with programmable match channels - generates precise periodic interrupts for sensor sampling, communication framing, and watchdog supervision without CPU overhead. |
Applications
| Industrial Motor Control | Smart Energy Metering |
|---|---|
Use Scenario: Real-time control of brushless DC and permanent magnet synchronous motors in factory automation and mobile robotics. IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms, managing 12 PWM outputs, quadrature decoding, and analog current/voltage sensing. Use Value: Integrated FlexPWM, QDC, dual 16-bit ADCs, and 1.5 μA Deep Power-down enable compact, thermally efficient motor drives meeting IEC 61800-5-1 safety requirements. |
Use Scenario: High-accuracy electricity consumption measurement in residential and commercial smart meters. IC Role / Device Role / Timing Role: Metrology processor acquiring voltage/current waveforms via dual synchronized ADCs, computing RMS, harmonics, and tariff logic. Use Value: ±0.2 % VREF stability, 61-channel ADC routing, and tamper-detect pins meet ANSI C12.20 Class 0.5 accuracy and ANSI C12.10 physical security mandates. |
| Edge AI Anomaly Detection | Industrial HMI |
Use Scenario: Localized predictive maintenance on PLC-connected machinery using vibration and thermal sensor fusion. IC Role / Device Role / Timing Role: Edge inference accelerator running lightweight ML models (e.g., TinyML) with secure OTA model updates via EdgeLock 2GO. Use Value: EdgeLock Secure Enclave isolates model weights and inference data; 352 KB SRAM enables on-device feature extraction without cloud dependency. |
Use Scenario: Touch-enabled operator panels in hazardous factory environments requiring long-term reliability and cybersecurity. IC Role / Device Role / Timing Role: Application processor driving displays via FlexIO, processing touch inputs, and securing communications with TLS 1.3. Use Value: 106 GPIOs support capacitive touch + display interfaces; -40 °C to +125 °C rating ensures operation in unconditioned enclosures; secure boot prevents unauthorized UI firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCXN236VKLT | Same core, memory, and security features; differs in 100-pin HLQFP package (74 GPIOs, 2 tamper pins) vs. VFBGA184 (106 GPIOs, 6 tamper pins). | Preferred for prototyping and lower-I/O designs where PCB space allows larger 14×14 mm footprint and reduced pin count suffices. | Select MCXN236VKLT when layout constraints favor LQFP or tamper detection requirements are limited to 2 pins. |
| MCXN236VPBT | Identical core, memory, and peripherals; packaged in 172-pin HDQFP (103 GPIOs, 6 tamper pins) with 16×16 mm body and 0.65 mm pitch. | Suitable for legacy HDQFP-based industrial boards requiring drop-in compatibility and higher thermal mass than VFBGA. | Choose MCXN236VPBT for existing HDQFP footprints or applications needing enhanced thermal dissipation over VFBGA. |
Compared with MCXN236VDFT, MCXN236VKLT offers fewer GPIOs and tamper pins in a larger, easier-to-assemble package, while MCXN236VPBT provides near-identical I/O count and security in a thermally robust HDQFP - both retain full software compatibility but differ in mechanical integration and layout density.
Availability
MCXN236VDFT is available at Aetrix Electronics and suitable for industrial motor control, smart metering, and edge AI anomaly detection requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MCXN236VDFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based microcontrollers and hardware security subsystems.
The MCXN23x family - including MCXN236VDFT - is designed for high-reliability industrial edge applications demanding real-time performance, functional safety, and end-to-end security from silicon to cloud.
FAQ
What is the maximum operating temperature for MCXN236VDFT?
The MCXN236VDFT is rated for continuous operation from –40 °C to +125 °C ambient temperature. This extended range is validated per JEDEC JESD22-A103 and supports deployment in engine compartments, industrial inverters, and outdoor energy storage systems without derating.
Does MCXN236VDFT support CAN FD communication?
Yes, MCXN236VDFT integrates two FlexCAN modules supporting CAN FD protocol at up to 5 Mbps data rate. Each module includes dedicated TX/RX pins, message RAM, and error counters - enabling real-time motor feedback and fieldbus interoperability in industrial networks.
How much SRAM is available on MCXN236VDFT with ECC enabled?
MCXN236VDFT provides up to 352 KB of SRAM, of which up to 288 KB can be configured with ECC (single-bit correction, double-bit detection). The remaining 64 KB is allocated across four 8 KB ECC RAM blocks retainable down to VBAT mode.
What security certifications apply to the EdgeLock Secure Enclave in MCXN236VDFT?
The EdgeLock Secure Enclave (Core Profile) in MCXN236VDFT supports PSA Certified Level 3 and aligns with IEC 62443-3-3 Security Level 2 requirements. It includes DICE-compliant device attestation, secure key derivation, and tamper-responsive key erasure - verified through NXP's Common Criteria EAL4+ evaluation.
Can MCXN236VDFT operate with a single 3.3 V supply across all domains?
No - MCXN236VDFT requires multiple supply domains: VDD_CORE (0.95–1.26 V), VDD_SYS (1.71–1.98 V), VDD (1.71–3.6 V), and VDD_BAT (1.71–3.6 V). While VDD, VDD_P0–P4, and VDD_ANA may share 3.3 V, VDD_CORE must be generated separately via integrated DCDC or external regulator per POR sequencing rules.
MCXN236VDFT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- -
- Series:
- MCX N
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 150MHz
- Connectivity:
- CAN, Ethernet, Flexcomm, I3C, SAI, SCI, USB
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 124
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 352K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 2x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCXN236VDFT FAQ
1.How can I place an order for MCXN236VDFT through Aetrix?
Please submit a Request for Quotation (RFQ) for MCXN236VDFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCXN236VDFT reliable?
The price and inventory of MCXN236VDFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCXN236VDFT is usually 5 days.
3.What payment methods are accepted for MCXN236VDFT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCXN236VDFT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCXN236VDFT?
MCXN236VDFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCXN236VDFT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCXN236VDFT?
For technical support, including MCXN236VDFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCXN236VDFT requirements.
6.How does Aetrix verify that MCXN236VDFT is sourced from the original manufacturer or authorized distributors?
All MCXN236VDFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCXN236VDFT meets industry standards.
7.What is the process for return or replacement of MCXN236VDFT?
All MCXN236VDFT units undergo pre-shipment inspection (PSI). If there is an issue with MCXN236VDFT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCXN236VDFT part is unused and in its original packaging.
Return procedure for MCXN236VDFT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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