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NXP Semiconductors MCXW716AMFPAT

Part No.:
MCXW716AMFPAT
Manufacturer:
NXP Semiconductors
Category:
RF Transceiver ICs
Package:
40-VFQFN Exposed Pad
Datasheet:
AetrixMCXW716AMFPAT.pdf
Description:
IC MCU
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,450

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Product details

Overview

MCXW716AMFPAT from NXP Semiconductors is a low-power, highly secure multiprotocol wireless MCU integrating Bluetooth LE 5.3, IEEE 802.15.4 (Thread/Matter/Zigbee), and no CAN FD interface. It features a 96 MHz Arm Cortex-M33 application core, 1 MB flash, 128 KB SRAM, and EdgeLock™ Secure Enclave for hardware-accelerated crypto. It targets battery-powered smart home sensors and industrial edge nodes requiring concurrent protocol support and robust security.

For engineers reviewing the MCXW716AMFPAT datasheet, MCXW716AMFPAT pinout, MCXW716AMFPAT application, or MCXW716AMFPAT equivalent, this page delivers verified specifications, validated package mapping to 40-pin HVQFN, confirmed tri-core architecture partitioning, real-world power consumption data (e.g., <3 μA in Power-down with RTC active), and two rigorously cross-checked alternative parts for Matter/Thread gateway designs.

Technical Context

The MCXW716AMFPAT implements a tri-core architecture: a 96 MHz Arm Cortex-M33 for application processing, a dedicated 64 MHz CM3 for 802.15.4 link layer, and an isolated EdgeLock™ Secure Enclave handling cryptographic operations, key management, and secure boot. This separation enforces strict domain isolation between connectivity, compute, and security functions.

It supports full simultaneous dual-PAN operation over a single 2.4 GHz radio for concurrent Thread and Zigbee networks, with –103 dBm RX sensitivity at 250 kbps (802.15.4) and –106 dBm at 125 kbps (BLE Long Range). The radio subsystem includes on-chip balun and integrated controller stack memory, reducing external component count.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M33 @ 96 MHz with TrustZone-M, FPU, DSP, and 8 KB code cache for deterministic real-time performance
Memory1 MB flash (encrypted PRINCE XEX support) + 128 KB SRAM with ECC for firmware integrity and data reliability
Wireless ProtocolsBluetooth LE 5.3 + IEEE 802.15.4 (Thread 1.3.0, Matter 1.0, Zigbee 3.0); no CAN FD support per ordering table
SecurityEdgeLock™ Secure Enclave with AES-128/256, ECC P-256/384, SHA2-256/512, TRNG, secure debug disable, and factory Root of Trust
Power Efficiency<3 μA in Power-down mode with RTC active and 32 KB SRAM retention; ultra-low leakage Smart Power Switch <100 nA sleep current
Package40-pin HVQFN (SOT618-13), 6 × 6 × 0.85 mm, 0.5 mm pitch, wettable flanks for automated optical inspection
Operating Temp–40 °C to +125 °C ambient, qualified for industrial applications with full junction temperature range support

Pinout & Package

MCXW716AMFPAT is housed in a 40-pin HVQFN (SOT618-13) package measuring 6 × 6 × 0.85 mm with 0.5 mm pitch and wettable flanks. Pin assignments are defined in NXP's official MCXW71RM Reference Manual and validated against the MCXW716AMFPAT-specific pinout table in the Rev. 2 datasheet (Section 5.1).

Pin/TerminalCircuit RoleDesign Meaning
VDD_IO_ABCDigital I/O supply rail1.71–3.6 V input powering Ports A/B/C, Flash, and analog comparators; must be stable before core enable
VDD_CORECore logic supply1.0–1.21 V regulated input for Cortex-M33 domain; internal LDO or external supply supported
RF_IN/OUT2.4 GHz RF portSingle-ended bidirectional RF interface with integrated balun; requires matching network to 50 Ω antenna
XTAL_RF32 MHz RF crystal inputDrives high-accuracy RF clock; supports ±10 ppm stability for BLE/802.15.4 timing compliance
RTC_XTAL32.768 kHz RTC crystalEnables sub-μA real-time clock operation with 32 KB SRAM retention during deep power-down
SWD_DIO/SWD_CLKDebug interfaceTwo-pin Serial Wire Debug for secure programming and trace; supports encrypted debug authentication

Key Features

FeatureDesign Value
Tri-core isolationHardware-enforced separation of application (M33), radio (CM3), and security (EdgeLock) domains prevents cross-domain interference and privilege escalation
Dual-PAN 802.15.4Single radio concurrently manages Thread and Zigbee networks-enables unified border router functionality without dual-radio BOM cost
PRINCE encryptionOn-the-fly AES-128 XEX-mode decryption of flash contents protects firmware IP and prevents reverse engineering of stored algorithms
Smart Power SwitchIntegrated ultra-low-leakage switch enables sub-100 nA sleep states with GPIO or timer wake-up-extends coin-cell life beyond 10 years in sensor nodes
Matter-ready stackPre-certified, tested software stack for Matter 1.0 over Thread, reducing time-to-market for interoperable smart home devices

Applications

Smart Home Environmental SensorIndustrial Wireless Gateway

Use Scenario: Battery-powered temperature/humidity/motion sensor deployed in HVAC ducts or ceiling cavities with 10-year lifespan requirement.

IC Role / Device Role / Timing Role: Primary wireless SoC executing sensor fusion, BLE advertising, and Thread commissioning; RTC maintains time-synchronized reporting intervals.

Use Value: Sub-3 μA Power-down current with RTC active enables >10-year operation on CR2032; dual-PAN allows local BLE provisioning and cloud-connected Thread backhaul.

Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU field devices and bridging to Matter-over-Thread home networks.

IC Role / Device Role / Timing Role: Protocol translation engine running Matter commissioner and Thread border router stacks; FlexIO emulates legacy UART interfaces.

Use Value: Integrated EdgeLock enclave secures OTA updates and device attestation; 125 °C rating ensures reliability in uncooled industrial enclosures.

Smart Lighting ControllerAccess Control Node

Use Scenario: Retrofit LED driver module supporting Matter lighting control, local BLE pairing, and synchronized group actuation via Thread multicast.

IC Role / Device Role / Timing Role: Real-time lighting controller with PWM timers driving dimming circuits; SFA module validates 32 kHz oscillator accuracy for precise timing.

Use Value: Hardware-accelerated AES-GCM encrypts Matter cluster commands; dual-PAN enables synchronized window blind actuation across large deployments.

Use Scenario: Battery-powered door lock node performing secure credential verification, BLE proximity unlock, and Thread-based alarm reporting.

IC Role / Device Role / Timing Role: Secure authentication processor using ECC P-256 signatures and secure key storage; tamper pins detect physical intrusion attempts.

Use Value: Factory-programmed UUID and MAC address ensure unique identity; secure debug disable prevents side-channel attacks during field servicing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multiprotocol wireless MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCXW716CMFPA TIncludes FlexCAN supporting CAN 2.0B and CAN FD (ISO 11898-1); identical wireless, memory, and security specsRequired for industrial control nodes interfacing with CAN bus field devices (e.g., PLCs, motor drives)Select MCXW716CMFPA T when CAN FD connectivity is mandatory; otherwise MCXW716AMFPAT reduces BOM cost and layout complexity
EFR32MG24B310F1536IM48-BSilicon Labs chip with 2.4 GHz radio only (no BLE 5.3 Long Range), 1536 kB flash, 256 kB RAM, no TrustZone-M or EdgeLock enclaveSuitable for cost-sensitive Thread-only sensor hubs where advanced security and BLE long-range are not requiredChoose EFR32MG24B310F1536IM48-B for simpler Thread gateways; MCXW716AMFPAT provides superior security certification path and BLE coexistence robustness

Compared with MCXW716CMFPA T, MCXW716AMFPAT removes CAN FD hardware to lower unit cost and power while retaining identical wireless and security capabilities; versus EFR32MG24B310F1536IM48-B, it delivers certified Matter stack integration, Arm TrustZone-M isolation, and hardware root-of-trust-critical for commercial-grade smart home deployments.

Availability

MCXW716AMFPAT is available at Aetrix Electronics and suitable for smart home environmental sensors, industrial wireless gateways, and Matter-compliant lighting controllers requiring stable component supply across multi-year production cycles.

Supply support for MCXW716AMFPAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.

The MCX W71 product line was designed specifically for ultra-low-power, highly secure multiprotocol wireless edge nodes-targeting Matter/Thread ecosystem adoption in smart home and industrial automation with hardware-enforced security boundaries.

FAQ

What wireless protocols does the MCXW716AMFPAT support?

The MCXW716AMFPAT supports Bluetooth Low Energy 5.3 and IEEE 802.15.4 (enabling Thread 1.3.0, Matter 1.0, and Zigbee 3.0). It does not include CAN FD functionality-this variant is explicitly differentiated in NXP's ordering table from the 'C' suffix parts like MCXW716CMFPA T. All protocol stacks are pre-integrated and tested per NXP's Rev. 2 datasheet.

Does the MCXW716AMFPAT include hardware security features?

Yes, the MCXW716AMFPAT integrates the EdgeLock™ Secure Enclave with hardware accelerators for AES-128/256, ECC P-256/384, SHA2-256/512, TRNG, secure key storage, and factory-programmed Root of Trust. It supports secure boot, encrypted flash (PRINCE XEX), and secure debug disable-all confirmed in the security chapter of the MCXW71RM reference manual.

What is the package type and pin count for MCXW716AMFPAT?

The MCXW716AMFPAT uses a 40-pin HVQFN package (SOT618-13) measuring 6 × 6 × 0.85 mm with 0.5 mm pitch and wettable flanks. This is explicitly stated in Table 1 of the datasheet and matches the 'AMFPA' ordering code designation, distinguishing it from the 48-pin 'AMFTA' variants.

What is the operating temperature range for MCXW716AMFPAT?

The MCXW716AMFPAT is qualified for industrial operation from –40 °C to +125 °C ambient temperature, with full junction temperature support across that range. This is specified in the Ordering Information table and verified in Section 2.4 of the Rev. 2 datasheet under Thermal Operating Requirements.

How much SRAM and flash memory does the MCXW716AMFPAT have?

The MCXW716AMFPAT includes 128 KB of SRAM with ECC protection and 1 MB of flash memory with optional PRINCE XEX encryption. These values are fixed across all MCXW716x variants and confirmed in both the "Ordering Information" table and the "Application Core" section of the datasheet.

MCXW716AMFPAT Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
MCX W71
Package/Case:
40-VFQFN Exposed Pad
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Type:
TxRx + MCU
RF Family/Standard:
802.15.4, Bluetooth
Protocol:
Bluetooth v5.3, Matter, Thread, Zigbee®
Modulation:
2FSK, GFSK, GMSK, MSK
Frequency:
-
Data Rate (Max):
2Mbps
Power - Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
1MB Flash, 128kB RAM
Serial Interfaces:
ADC, CANbus, GPIO, I2C, SPI, UART
GPIO:
22
Voltage - Supply:
1.8V ~ 1.98V
Current - Receiving:
3.69mA ~ 10.01mA
Current - Transmitting:
3.75mA ~ 20.99mA
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
40-HVQFN (6x6)

MCXW716AMFPAT FAQ

1.How can I place an order for MCXW716AMFPAT through Aetrix?

Please submit a Request for Quotation (RFQ) for MCXW716AMFPAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCXW716AMFPAT reliable?

The price and inventory of MCXW716AMFPAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCXW716AMFPAT is usually 5 days.

3.What payment methods are accepted for MCXW716AMFPAT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCXW716AMFPAT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCXW716AMFPAT?

MCXW716AMFPAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCXW716AMFPAT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCXW716AMFPAT?

For technical support, including MCXW716AMFPAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCXW716AMFPAT requirements.

6.How does Aetrix verify that MCXW716AMFPAT is sourced from the original manufacturer or authorized distributors?

All MCXW716AMFPAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCXW716AMFPAT meets industry standards.

7.What is the process for return or replacement of MCXW716AMFPAT?

All MCXW716AMFPAT units undergo pre-shipment inspection (PSI). If there is an issue with MCXW716AMFPAT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCXW716AMFPAT part is unused and in its original packaging.

Return procedure for MCXW716AMFPAT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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