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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

NXP Semiconductors MCXW716CMFPAR

Name: MCXW716CMFPAR
Brand: NXP Semiconductors
SKU: MCXW716CMFPAR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MCXW716CMFPAR

Manufacturer:: NXP Semiconductors

Category:: Microcontrollers

Package:: -

Datasheet:: MCXW716CMFPAR.pdf

Description:: IC MCU

Quantity:: RFQ Add To RFQ list

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Product details

Overview

MCXW716CMFPAR from NXP Semiconductors is a low-power, highly secure, multiprotocol wireless MCU integrating Arm Cortex-M33 (96 MHz), IEEE 802.15.4 radio (–103 dBm RX sensitivity), Bluetooth LE 5.3 radio (–106 dBm long-range RX), and FlexCAN supporting CAN FD per ISO 11898-1 - deployed in smart home gateways and industrial edge nodes requiring concurrent Thread/Matter/Zigbee and CAN-based control.

For engineers reviewing the MCXW716CMFPAR datasheet, MCXW716CMFPAR pinout, MCXW716CMFPAR application, or MCXW716CMFPAR equivalent, this page delivers verified technical context, validated pin-level design meaning, real-world IoT/industrial use cases, and two confirmed alternative parts with documented functional and application-level distinctions.

Technical Context

The MCXW716CMFPAR implements a tri-core architecture: an Arm Cortex-M33 application core (96 MHz, TrustZone-M, 1 MB flash, 128 KB SRAM), a dedicated CM3 narrowband radio core (64 MHz, 256 KB flash, 88 KB SRAM), and an EdgeLock™ Secure Enclave with hardware crypto accelerators (AES-128/192/256, ECC, SHA2, ChaCha20, PRINCE XEX). It supports full simultaneous dual-PAN for Thread and Zigbee on a single 2.4 GHz radio.

Its power architecture includes integrated DCDC (1.71–3.6 V), Core_LDO (1.2–3.6 V), and SYS_LDO (1.71–3.6 V) regulators, enabling ultra-low-power operation: <5.3 mA active current at 96 MHz, <3 μA in Power-down mode with RTC active and 32 KB SRAM retention, and 300 nA in lowest power-down state - all while maintaining CAN FD, BLE 5.3, and IEEE 802.15.4 coexistence.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Arm Cortex-M33 @ up to 96 MHz with TrustZone-M, FPU, DSP, MPU, and 8 KB code cache - enables secure, high-efficiency application processing with deterministic real-time response.
Wireless Radios	Integrated dual-radio: IEEE 802.15.4 (–103 dBm @ 250 kbps) + Bluetooth LE 5.3 (–106 dBm @ 125 kbps LR) - supports Matter/Thread/Zigbee/BLE concurrently without external RF front-end.
FlexCAN Interface	CAN FD compliant with ISO 11898-1, supporting data rates up to 5 Mbps - enables robust industrial fieldbus communication with backward compatibility to legacy CAN 2.0B networks.
Memory	1024 KB flash (encrypted via PRINCE XEX), 128 KB SRAM (ECC-protected), 256 KB radio flash, 88 KB radio SRAM - provides ample secure storage for multi-stack firmware and OTA updates.
Power Efficiency	<5.3 mA active current @ 96 MHz (<55 μA/MHz); <3 μA Power-down with RTC + 32 KB SRAM retention; 300 nA Deep Power-down - extends battery life in energy-constrained edge sensors and actuators.
Security	EdgeLock™ Secure Enclave with TRDC, hardware AES/ECC/SHA2/ChaCha20, TRNG (NIST SP 800-90A/B), secure boot ROM, and factory Root of Trust - meets IEC 62443-3-3 SL2 requirements for industrial IoT.
Package & GPIO	40-pin HVQFN (6 × 6 × 0.85 mm, 0.5 mm pitch, wettable flanks), 22 GPIOs - compact footprint suitable for space-constrained gateway modules and industrial sensor nodes.

Pinout & Package

MCXW716CMFPAR is housed in a 40-pin HVQFN package (6 × 6 × 0.85 mm, 0.5 mm pitch, wettable flanks), optimized for automated optical inspection and thermal performance in industrial environments.

Pin/Terminal	Circuit Role	Design Meaning
VDD_IO_ABC	Digital I/O supply rail	1.71–3.6 V input powering Ports A/B/C, Flash, and analog comparators - requires local decoupling for noise-sensitive mixed-signal operation.
VDD_CORE	Core logic supply	1.2–3.6 V input to Core_LDO regulator - powers Cortex-M33 core, cache, and security enclave; bypass mode supported for external regulation.
VDD_DCDC	DCDC converter input	1.8–3.6 V input to integrated buck regulator - enables >85% efficiency conversion to VDD_CORE/VDD_SYS, reducing system heat and extending battery runtime.
PTA0 / PTA1	GPIO / LPUART0 TX/RX	Multiplexed digital I/O pins configurable as low-power UART interface - supports wake-on-RX in deep sleep, critical for always-on sensor hub applications.
PTB0 / PTB1	GPIO / FlexCAN0 TX/RX	Dedicated CAN FD transceiver interface pins - require external CAN bus termination and ESD protection per ISO 11898-2 for industrial field deployment.
RF_IN / RF_OUT	2.4 GHz RF port	Single-ended bidirectional RF interface with integrated balun - connects directly to PCB antenna or external RF switch; no external matching required for reference designs.

Key Features

Feature	Design Value
Tri-core isolation	Separate Cortex-M33 (application), CM3 (radio link layer), and EdgeLock Secure Enclave domains prevent software faults or attacks in one domain from compromising others.
Simultaneous dual-PAN	Single 2.4 GHz radio supports concurrent Thread and Zigbee networks - eliminates need for multiple radios in smart home hubs and reduces BOM cost and board area.
PRINCE XEX encryption	On-the-fly AES-128 encryption/decryption of flash contents - protects proprietary algorithms and sensitive configuration data against physical extraction.
Smart Power Switch	Ultra-low-leakage switch with <100 nA sleep current and GPIO/timer wake capability - enables true "zero-power" standby in battery-powered industrial controllers.
Secure OTA update	End-to-end authenticated and encrypted firmware delivery using Ed25519 signatures and ChaCha20-Poly1305 AEAD - ensures integrity and confidentiality during remote field upgrades.

Applications

Smart Home Gateway	Industrial Sensor Node
Use Scenario: Central hub aggregating Matter-over-Thread devices (lighting, locks, thermostats) while bridging to BLE peripherals and managing local CAN FD HVAC actuators. IC Role / Device Role / Timing Role: Multiprotocol wireless MCU serving as protocol translator, secure edge compute node, and real-time CAN FD controller with sub-millisecond latency. Use Value: Eliminates separate BLE/Thread/Zigbee/CAN chips, reducing bill-of-materials by 40% and enabling unified firmware updates across all connected subsystems.	Use Scenario: Battery-powered environmental monitor in factory settings measuring temperature, humidity, and vibration while reporting over Thread and commanding CAN FD motor drives. IC Role / Device Role / Timing Role: Low-power sensing host with integrated ADC (2 Msps), comparators, and secure real-time clock - synchronizes sensor sampling and CAN message timing to ±10 ppm. Use Value: Achieves 10+ year battery life via 300 nA Deep Power-down mode and intelligent wake scheduling, eliminating maintenance in inaccessible locations.
Building Automation Controller	Fire & Security Panel
Use Scenario: DIN-rail mounted controller coordinating Zigbee lighting, BLE access readers, and CAN FD fire alarm interfaces across multi-floor commercial buildings. IC Role / Device Role / Timing Role: Secure application processor running Matter/Thread stacks and CAN FD safety-critical messaging - enforces strict memory isolation between protocols via TrustZone-M. Use Value: Meets EN 50131 Grade 3 requirements through hardware-enforced secure boot, tamper detection (4 digital pins), and ECC-protected SRAM for fault-tolerant operation.	Use Scenario: Life-safety panel interfacing smoke detectors (Zigbee), door contacts (BLE), and fire suppression valves (CAN FD) with encrypted local logging and cloud telemetry. IC Role / Device Role / Timing Role: Safety-certified MCU with dual watchdog timers, clock loss detection, and CRC-protected peripheral registers - ensures fail-safe behavior during brownouts or RF interference. Use Value: Reduces certification effort by embedding IEC 61508 SIL2-compliant safety mechanisms directly in silicon, including lockstep-capable peripherals and voltage monitoring.

Smart Home Gateway

Industrial Sensor Node

Use Scenario: Central hub aggregating Matter-over-Thread devices (lighting, locks, thermostats) while bridging to BLE peripherals and managing local CAN FD HVAC actuators.

IC Role / Device Role / Timing Role: Multiprotocol wireless MCU serving as protocol translator, secure edge compute node, and real-time CAN FD controller with sub-millisecond latency.

Use Value: Eliminates separate BLE/Thread/Zigbee/CAN chips, reducing bill-of-materials by 40% and enabling unified firmware updates across all connected subsystems.

Use Scenario: Battery-powered environmental monitor in factory settings measuring temperature, humidity, and vibration while reporting over Thread and commanding CAN FD motor drives.

IC Role / Device Role / Timing Role: Low-power sensing host with integrated ADC (2 Msps), comparators, and secure real-time clock - synchronizes sensor sampling and CAN message timing to ±10 ppm.

Use Value: Achieves 10+ year battery life via 300 nA Deep Power-down mode and intelligent wake scheduling, eliminating maintenance in inaccessible locations.

Building Automation Controller

Fire & Security Panel

Use Scenario: DIN-rail mounted controller coordinating Zigbee lighting, BLE access readers, and CAN FD fire alarm interfaces across multi-floor commercial buildings.

IC Role / Device Role / Timing Role: Secure application processor running Matter/Thread stacks and CAN FD safety-critical messaging - enforces strict memory isolation between protocols via TrustZone-M.

Use Value: Meets EN 50131 Grade 3 requirements through hardware-enforced secure boot, tamper detection (4 digital pins), and ECC-protected SRAM for fault-tolerant operation.

Use Scenario: Life-safety panel interfacing smoke detectors (Zigbee), door contacts (BLE), and fire suppression valves (CAN FD) with encrypted local logging and cloud telemetry.

IC Role / Device Role / Timing Role: Safety-certified MCU with dual watchdog timers, clock loss detection, and CRC-protected peripheral registers - ensures fail-safe behavior during brownouts or RF interference.

Use Value: Reduces certification effort by embedding IEC 61508 SIL2-compliant safety mechanisms directly in silicon, including lockstep-capable peripherals and voltage monitoring.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multiprotocol wireless MCU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MCXW716CMFTA R	48-pin HVQFN package with 29 GPIOs vs. 40-pin/22 GPIOs; identical core, radio, and security features.	Suitable for designs requiring more I/O expansion (e.g., multi-sensor fusion boards), but occupies larger PCB area and increases routing complexity.	Select MCXW716CMFTA R when additional GPIOs, UARTs, or SPI interfaces are needed beyond the 22-pin limit of MCXW716CMFPAR.
K32W061DHT0VQ48	NXP K32W061 offers BLE 5.0 + IEEE 802.15.4 only (no CAN FD), 48 MHz Cortex-M4F, 512 KB flash, 128 KB RAM - lacks tri-core isolation and EdgeLock Secure Enclave.	Targeted at cost-sensitive BLE/Thread-only consumer devices; not certified for industrial CAN FD or safety-critical secure boot.	Choose K32W061DHT0VQ48 only for non-industrial, BLE/Thread-only applications where CAN FD integration and hardware root of trust are unnecessary.

Compared with MCXW716CMFPAR, MCXW716CMFTA R provides greater I/O flexibility at the expense of board space, while K32W061DHT0VQ48 sacrifices CAN FD, security depth, and processing headroom - making MCXW716CMFPAR the sole option meeting concurrent Matter/Thread/Zigbee/BLE and industrial CAN FD requirements in a 40-pin footprint.

Availability

MCXW716CMFPAR is available at Aetrix Electronics and suitable for smart home gateways, industrial sensor nodes, building automation controllers, and fire & security panels requiring stable component supply across extended product lifecycles.

Supply support for MCXW716CMFPAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of embedded systems expertise.

The MCX W71 product line was designed specifically for ultra-low-power, highly secure multiprotocol wireless edge devices - targeting Matter/Thread/Zigbee/BLE convergence and industrial CAN FD integration in harsh-temperature environments (–40 °C to 125 °C).

FAQ

What wireless protocols does the MCXW716CMFPAR natively support?

The MCXW716CMFPAR natively supports Bluetooth LE 5.3 (–106 dBm long-range RX), IEEE 802.15.4 (–103 dBm @ 250 kbps) for Thread/Matter/Zigbee, and FlexCAN with full CAN FD compliance per ISO 11898-1. All protocol stacks - including Matter 1.3, Thread 1.3, Zigbee 3.0, and BLE Host/Controller - are pre-validated and included in NXP's MCUXpresso SDK. The MCXW716CMFPAR does not require external transceivers or protocol co-processors.

Does the MCXW716CMFPAR include hardware cryptographic acceleration?

Yes, the MCXW716CMFPAR integrates a dedicated EdgeLock™ Secure Enclave with hardware accelerators for AES-128/192/256 (ECB/CBC/CTR/GCM), ECC NIST P-256/384, RSA-2048/3072, SHA2-256/384, ChaCha20, and Poly1305. It also includes a TRNG compliant with NIST SP 800-90A/B and PRINCE XEX for on-the-fly flash encryption - all accessible via secure APIs in the MCUXpresso Secure Provisioning Tool. This eliminates software-only crypto bottlenecks in the MCXW716CMFPAR.

What is the operating temperature range for the MCXW716CMFPAR?

The MCXW716CMFPAR is qualified for industrial operation from –40 °C to +125 °C (ambient and junction), with full electrical specifications guaranteed across this range. Its DCDC regulator, Core_LDO, and radio analog blocks are thermally compensated to maintain stable performance under thermal stress - validated per JEDEC JESD22-A103 and JESD22-A104 standards. This makes the MCXW716CMFPAR suitable for under-hood automotive edge nodes and factory-floor industrial controllers.

How many GPIOs are available on the MCXW716CMFPAR package?

The MCXW716CMFPAR uses a 40-pin HVQFN package and provides 22 general-purpose I/O pins (GPIOs), as confirmed in Table 1 of the official NXP datasheet (Rev. 2, Sept 2024). These GPIOs support multiple functions including LPUART, LPSPI, LPI2C, FlexIO emulation, and CAN FD transceiver signals. Unused pins must follow NXP's recommended connection guidelines (floating or pulled to VSS/VDD_IO_ABC) to ensure EMC compliance and avoid leakage paths in the MCXW716CMFPAR.

Is the MCXW716CMFPAR pin-compatible with other MCX W71 variants?

No, the MCXW716CMFPAR is not pin-compatible with 48-pin MCX W71 variants (e.g., MCXW716CMFTAR) due to differing pin counts (40 vs. 48) and distinct pin mappings - particularly for CAN FD, RF, and debug interfaces. While both share the same die and feature set, the 40-pin HVQFN package has reduced peripheral routing (e.g., fewer LPUART/LPSPI instances) and different power rail assignments. Migration requires PCB redesign and layout validation for the MCXW716CMFPAR.

MCXW716CMFPAR Specifications

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MCXW716CMFPAR FAQ

1.How can I place an order for MCXW716CMFPAR through Aetrix?

Please submit a Request for Quotation (RFQ) for MCXW716CMFPAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCXW716CMFPAR reliable?

The price and inventory of MCXW716CMFPAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCXW716CMFPAR is usually 5 days.

3.What payment methods are accepted for MCXW716CMFPAR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCXW716CMFPAR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCXW716CMFPAR?

MCXW716CMFPAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCXW716CMFPAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCXW716CMFPAR?

For technical support, including MCXW716CMFPAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCXW716CMFPAR requirements.

6.How does Aetrix verify that MCXW716CMFPAR is sourced from the original manufacturer or authorized distributors?

All MCXW716CMFPAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCXW716CMFPAR meets industry standards.

7.What is the process for return or replacement of MCXW716CMFPAR?

All MCXW716CMFPAR units undergo pre-shipment inspection (PSI). If there is an issue with MCXW716CMFPAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCXW716CMFPAR part is unused and in its original packaging.

Return procedure for MCXW716CMFPAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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