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NXP Semiconductors MCZ33291EGR2
- Part No.:
- MCZ33291EGR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
MCZ33291EGR2.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:8 24SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,737
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Product details
Overview
MCZ33291EGR2 from NXP Semiconductors (formerly Freescale) is an eight-channel low-side power switch IC with SPI serial interface, designed for automotive load control. It delivers 1.0 A peak per channel, features 53 V output clamping, 25 μA sleep current, and operates across 5.5–26.5 V supply range. It interfaces directly with microcontrollers to drive inductive or incandescent loads such as solenoids, relays, and lamps in body electronics modules.
For engineers reviewing the MCZ33291EGR2 datasheet, MCZ33291EGR2 pinout, MCZ33291EGR2 application, or MCZ33291EGR2 equivalent, key selection criteria include its SPI-controlled 8-output architecture, integrated open-load/short-circuit diagnostics, thermal shutdown behavior, and Pb-free SOICW-24 packaging suitable for under-hood automotive environments.
Technical Context
The MCZ33291EGR2 implements SMARTMOS technology-integrating CMOS logic, bipolar/MOS analog monitoring, and DMOS power MOSFETs-to enable independent per-output fault detection (open-load, overcurrent, overtemperature) and reporting via tri-state SO pin. Its SPI interface supports up to 3.0 MHz clock rate with daisy-chain capability for multi-device systems.
Each of the eight low-side outputs features programmable current limiting (1.0–3.0 A), internal 53 V clamp for inductive kickback suppression, and dedicated diagnostic feedback. Fault reporting is configurable via SFPD pin: grounded for latched-off shutdown on overcurrent, or pulled high for current-limit-only operation without shutdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output count | 8 independent low-side switches with individual diagnostics |
| Peak output current | 1.0 A per channel, self-limiting to 1.0–3.0 A during overcurrent events |
| RDS(ON) @ TJ=150°C | Max 1.6 Ω at VPWR=13 V - ensures <1.6 W dissipation per channel at 1 A |
| SPI interface speed | Up to 3.0 MHz - enables sub-100 μs command latency for real-time load control |
| Sleep supply current | 25 μA max - meets automotive quiescent current requirements for always-on modules |
| Operating voltage range | 5.5 V to 26.5 V VPWR - supports cold-crank (5.5 V) and load-dump (26.5 V) conditions |
| Output clamp voltage | 45–65 V (typ. 53 V) - protects against inductive transients without external TVS diodes |
Pinout & Package
MCZ33291EGR2 is housed in a 24-pin SOICW (wide-body) package with exposed thermal pad (DW/EG suffix), optimized for automotive thermal performance and Pb-free reflow compatibility per JEDEC J-STD-020C.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| OP0–OP7 | Power output drains | Eight low-side switched outputs; each connects to load cathode/ground return path |
| VPWR | Main power supply input | Drives DMOS gate drivers and output stages; accepts 5.5–26.5 V with transient tolerance to 60 V |
| VDD | Logic supply | 5.0 V ±10% CMOS-compatible supply for internal logic and SPI interface |
| CS | Chip select | Active-low SPI frame sync; rising edge latches new output states, falling edge reads fault status |
| SCLK | SPI clock input | Accepts up to 3.0 MHz; data sampled on falling edge, SO updated on rising edge |
| SI | SPI data input | Serial command stream (8-bit register) defining ON/OFF state for all eight outputs |
| SO | SPI data output | Tri-state serial fault report - indicates overvoltage, overtemperature, short, or open-load per output |
| RST | Hardware reset | Active-low asynchronous clear of SPI register and all outputs; forces OFF state |
| SFPD | Short-fault protection disable | Grounded = latch-off on overcurrent; pulled high = current-limit only, no shutdown |
| GND | Power ground | Pins 5–8 and 17–20 serve as primary thermal and electrical ground return paths |
Key Features
| Feature | Design Value |
|---|---|
| Per-output diagnostics | Detects open-load (OFF state), short-to-battery (ON state), overtemperature, and overvoltage independently |
| SPI cascade fault reporting | Single SO line reports faults from multiple daisy-chained MCZ33291EGR2 devices without additional I/O |
| Thermal management | Overtemperature shutdown at 155–180°C junction; hysteresis ≥10°C prevents oscillation near limit |
| Inductive load handling | Integrated 53 V clamp per output eliminates need for external flyback diodes or TVS in most solenoid/relay apps |
| Automotive-grade biasing | 25 μA sleep current and 4.0 mA operating IDD meet OEM requirements for module-level quiescent power |
Applications
| Body Control Module (BCM) | Engine Bay Power Distribution |
|---|---|
|
Use Scenario: Centralized switching of door locks, interior lighting, seat heaters, and mirror controls in modern BCMs. IC Role / Device Role / Timing Role: Low-side driver IC managing 8 discrete loads via SPI from main MCU; replaces discrete transistor arrays and discrete protection circuits. Use Value: Reduces PCB area by >60% vs. discrete solutions while enabling per-channel fault logging and diagnostics over CAN via MCU translation. |
Use Scenario: Controlling radiator fans, fuel pumps, cooling valves, and auxiliary relays in engine compartment junction boxes. IC Role / Device Role / Timing Role: High-reliability power switch with built-in 53 V clamp and thermal foldback, operating across -40°C to 125°C ambient. Use Value: Eliminates external transient suppressors and thermal sensors, simplifying design validation for ISO 7637-2 pulse 5a/b compliance. |
| Commercial Vehicle Lighting Control | Industrial PLC Output Stage |
|
Use Scenario: Driving LED headlamps, turn signals, brake lights, and fog lamps in heavy-duty trucks and buses. IC Role / Device Role / Timing Role: SPI-configurable low-side driver with open-load detection to verify lamp filament integrity during startup. Use Value: Enables automated bulb-out detection without added sense resistors or ADC channels, reducing BOM cost and firmware complexity. |
Use Scenario: Replacing electromechanical relay outputs in DIN-rail mounted industrial PLCs for machine tool I/O modules. IC Role / Device Role / Timing Role: Solid-state replacement for 8-channel relay banks, supporting 1 kHz PWM-capable switching with fast rise/fall times (<20 μs). Use Value: Extends service life beyond 100 million cycles, eliminates contact wear, and enables predictive maintenance via continuous fault telemetry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-side SPI-controlled power switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPIC6B595N | 8-bit shift-register + DMOS sink outputs; no per-output diagnostics, no thermal/overvoltage protection, no open-load detect | Basic LED/relay driving where fault reporting is handled externally; lacks automotive qualification | Lower-cost option when diagnostics and protection are implemented at system level, not IC level |
| MAX14912AUB+ | 8-channel industrial-grade low-side switch with SPI; includes 60 V clamp, 1.2 A rating, but requires external 5 V regulator and has higher 100 μA sleep current | Designed for industrial automation; wider temp range (-40°C to +125°C), but not AEC-Q100 qualified | Better for non-automotive industrial use with tighter timing specs; less suitable for battery-sensitive automotive modules |
Compared with TPIC6B595N and MAX14912AUB+, the MCZ33291EGR2 uniquely combines AEC-Q100 qualification, 25 μA sleep current, per-output open-load detection, and integrated 53 V clamping - making it the only choice for automotive body electronics requiring full diagnostic autonomy and low-quiescent-power operation.
Availability
MCZ33291EGR2 is available at Aetrix Electronics and suitable for automotive body control modules, engine bay power distribution units, commercial vehicle lighting systems, and industrial PLC output stages requiring stable component supply and long-term lifecycle support.
Supply support for MCZ33291EGR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in high-reliability mixed-signal ICs and automotive qualification standards.
The MCZ33291EGR2 belongs to NXP's SMARTMOS automotive power switch family, engineered specifically for intelligent, diagnostic-rich load control in harsh automotive environments - emphasizing functional safety, thermal robustness, and SPI-based scalability.
FAQ
What is the maximum operating temperature for the MCZ33291EGR2?
The MCZ33291EGR2 is specified for operation up to 125°C ambient temperature and supports junction temperatures up to 150°C. Overtemperature shutdown activates between 155°C and 180°C, with ≥10°C hysteresis to prevent thermal cycling. This ensures reliable operation in under-hood automotive locations where ambient can exceed 105°C. The MCZ33291EGR2 thermal design uses the exposed pad and GND pins (5–8, 17–20) for effective heat sinking.
Does the MCZ33291EGR2 support daisy-chaining via SPI?
Yes, the MCZ33291EGR2 supports SPI daisy-chaining using its tri-state SO pin and standard SI/SCLK/CS interface. Multiple devices can be cascaded so that one MCU SPI port controls up to 32+ loads with minimal GPIO usage. Fault status from all devices appears sequentially on the shared SO line, eliminating the need for separate interrupt lines. The MCZ33291EGR2's SFPD pin must be tied consistently across the chain for uniform fault response behavior.
What protection features does the MCZ33291EGR2 provide per output?
The MCZ33291EGR2 provides four independent per-output protections: (1) open-load detection (when output is OFF), (2) short-to-battery detection (when output is ON), (3) overtemperature shutdown, and (4) 53 V output clamping during inductive switching. Each is reported individually via the SO pin. The MCZ33291EGR2 also includes global overvoltage shutdown at 28–36 V VPWR and undervoltage lockout on VDD below 2.5 V.
Is the MCZ33291EGR2 pin-compatible with earlier Freescale MC33291 variants?
Yes, the MCZ33291EGR2 is functionally and pin-compatible with the legacy MC33291DW/R2, sharing identical 24-pin SOICW footprint, pinout, and electrical specifications. The "Z" prefix and "EG" suffix denote NXP's post-acquisition branding and Pb-free packaging, respectively - both fully backward-compatible. No PCB layout changes are required when upgrading from MC33291DW/R2 to MCZ33291EGR2.
What is the purpose of the SFPD pin on the MCZ33291EGR2?
The SFPD (Short-Fault Protection Disable) pin on the MCZ33291EGR2 determines overcurrent response behavior: when grounded, the affected output latches OFF upon detecting >1.0 A; when pulled high to 5.0 V, the output remains in current-limit mode (1.0–3.0 A) without shutdown. This allows flexible system-level fault strategy - e.g., sustaining critical loads during brief inrush while disabling non-critical ones. The MCZ33291EGR2's SFPD pin enables this dual-mode operation without firmware intervention.
MCZ33291EGR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 8
- Ratio - Input:Output:
- 1:8
- Output Configuration:
- Low Side
- Output Type:
- N-Channel
- Interface:
- SPI
- Voltage - Load:
- 9V ~ 26.5V
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Current - Output (Max):
- 500mA
- Rds On (Typ):
- 550mOhm
- Input Type:
- -
- Features:
- -
- Fault Protection:
- Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
MCZ33291EGR2 FAQ
1.How can I place an order for MCZ33291EGR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33291EGR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33291EGR2 reliable?
The price and inventory of MCZ33291EGR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33291EGR2 is usually 5 days.
3.What payment methods are accepted for MCZ33291EGR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33291EGR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33291EGR2?
MCZ33291EGR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33291EGR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33291EGR2?
For technical support, including MCZ33291EGR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33291EGR2 requirements.
6.How does Aetrix verify that MCZ33291EGR2 is sourced from the original manufacturer or authorized distributors?
All MCZ33291EGR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33291EGR2 meets industry standards.
7.What is the process for return or replacement of MCZ33291EGR2?
All MCZ33291EGR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33291EGR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33291EGR2 part is unused and in its original packaging.
Return procedure for MCZ33291EGR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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