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NXP Semiconductors MCZ33880EG

Part No.:
MCZ33880EG
Manufacturer:
NXP Semiconductors
Category:
Power Distribution Switches, Load Drivers
Package:
28-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixMCZ33880EG.pdf
Description:
IC PWR SWITCH N-CHAN 1:8 28SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,315

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Product details

Overview

MCZ33880EG from NXP Semiconductors (formerly Freescale) is a configurable octal high-side/low-side power switch IC with 8-bit SPI interface and dual PWM-direct control inputs (IN5, IN6). It delivers RDS(ON) ≤ 0.55 Ω at 25°C, supports 0.8–2.0 A current-limited outputs, and operates across 5.5–24.5 V VPWR for automotive body electronics loads including incandescent lamps and inductive solenoids.

For engineers reviewing the MCZ33880EG datasheet, MCZ33880EG pinout, MCZ33880EG application, or MCZ33880EG equivalent, this device serves as a fault-reporting serial bus expander for microcontroller-driven load switching-requiring precise knowledge of its thermal ground pin mapping, output clamping thresholds (+45 V low-side / −20 V high-side), and cascaded fault reporting behavior over SPI.

Technical Context

The MCZ33880EG integrates SMARTMOS™ 5 mixed-technology architecture: CMOS logic control, bipolar/MOS analog monitoring, and independent double-diffused DMOS power transistors. Its internal charge pump enables gate drive under wide VPWR range, while dedicated open/short comparators per channel detect faults at ~1.5 V threshold with ~650 μA test current.

It implements hardware-configurable high-side or low-side topology per output pair (e.g., S1/D1), supports daisy-chained SPI fault reporting, and features independent overtemperature shutdown (TLIM = 155–185°C) plus reverse-battery protection on VPWR. Sleep mode draws ≤5.0 μA at 13 V VPWR up to 95°C when VDD and EN are de-asserted.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Range (VPWR)5.5 V to 24.5 V - supports 12 V/24 V automotive battery rails with overvoltage shutdown at 27 V typical.
RDS(ON) (25°C)0.55 Ω typical - enables <1 W conduction loss at 1.4 A, critical for thermally constrained PCB layouts.
Output Current Limit0.8 A to 2.0 A - programmable via external resistor; protects incandescent lamps and solenoids from surge currents.
Voltage Clamp (LSD/HSD)+45 V (low-side) / −20 V (high-side) - suppresses inductive kickback without external TVS diodes.
SPI Interface SpeedUp to 6 MHz - allows sub-100 μs full 8-bit command/fault exchange, suitable for real-time lamp dimming control.
Standby Current (IPWR)≤5.0 μA at 13 V VPWR, 95°C - meets automotive "always-on" module quiescent power budgets.
Thermal Ground PinsPins 8, 9, 24, 25 (32-pin SOICW) - must be connected to PCB ground plane to achieve RθJL = 18°C/W and sustain 1.7 W dissipation.

Pinout & Package

MCZ33880EG is packaged in a Pb-free 32-pin SOICW (Case 1324-02), with thermal ground pins (TGND) at positions 8, 9, 24, and 25 internally tied to the die substrate for enhanced heat transfer. These pins must be soldered to a large copper pour for thermal performance.

Pin/TerminalCircuit RoleDesign Meaning
GND (Pin 1)Digital reference groundReference for logic circuitry; separate from power ground paths to minimize noise coupling.
VDD (Pin 2)Logic supply input5.0 V ±5%; undervoltage lockout triggers below 3.9 V to force all outputs OFF and enter low-ISS state.
EN (Pin 15)Charge pump enableActive-high; must be high to activate gate drivers, fault detection, and diagnostics; connect to VDD if unused.
CS (Pin 18)SPI chip selectActive-low; falling edge initiates DO status readout; rising edge latches DI command bits to outputs.
IN5 / IN6 (Pins 19, 14)PWM direct control inputsOR-gated with SPI bits; allow microcontroller GPIO to override SPI for real-time PWM dimming of outputs 5 and 6.
DO (Pin 32)SPI fault status outputOpen-drain; logic 1 = fault detected on any output (open load, short, overtemp); logic 0 = all outputs nominal.
TGND (Pins 8,9,24,25)Thermal substrate connectionNot signal ground; requires low-impedance PCB copper connection to dissipate 1.7 W and maintain TJ ≤ 150°C.

Key Features

FeatureDesign Value
Configurable high-/low-side topology per outputEach of eight outputs (D1–D8/S1–S8) can be independently wired as high-side (load-to-battery) or low-side (load-to-ground) driver.
Cascadable fault reportingSingle DO line reports faults from multiple daisy-chained MCZ33880EG devices without additional MCU I/O pins.
Independent output shutdownAny output can be disabled via SPI without affecting others-enables selective lamp/solenoid isolation during diagnostics.
Internal reverse-battery protectionWithstands −16 V VPWR without external components-eliminates need for series Schottky diode in battery-reverse scenarios.
Short-circuit detect with autoretryAuto-recovers after fault clears; avoids latching shutdown unless overtemperature persists beyond hysteresis window.

Applications

Automotive Lighting ControlBody Control Module (BCM)

Use Scenario: Controlling 12 V incandescent headlamp, parking light, and turn-signal loads in modern BCMs.

IC Role / Device Role / Timing Role: Octal high-side switch with integrated current limiting and +45 V clamp, replacing discrete MOSFETs and protection diodes.

Use Value: Reduces BOM count by 8× vs. discrete solutions; eliminates external TVS diodes for inductive lamp turn-off transients.

Use Scenario: Managing door lock actuators, mirror heaters, and interior lighting via centralized microcontroller.

IC Role / Device Role / Timing Role: SPI-configurable load driver with per-output diagnostics and cascaded fault reporting across multiple zones.

Use Value: Enables single-MCU control of >24 loads using daisy-chained MCZ33880EG devices, reducing wiring harness complexity.

Industrial Solenoid DriverTruck & Bus Power Distribution

Use Scenario: Driving 24 V DC solenoids in valve manifolds and pneumatic control systems.

IC Role / Device Role / Timing Role: Low-side configured switch with −20 V clamp and 2.0 A current limit, supporting PWM modulation up to 2 kHz.

Use Value: Provides robust inductive load handling without snubbers; autoretry prevents system lockup during momentary shorts.

Use Scenario: Replacing mechanical relays in heavy-duty vehicle power distribution units (PDUs).

IC Role / Device Role / Timing Role: High-side switch with reverse-battery protection and thermal ground pins enabling 1.7 W continuous dissipation.

Use Value: Eliminates relay coil power consumption and contact wear; supports diagnostic logging via SPI fault status stream.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal high-side/low-side switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC3388332-pin SOICW, identical pinout and SPI protocol; adds watchdog timer and enhanced ESD (±8 kV HBM).Requires external watchdog reset management; suited for safety-critical modules needing ASIL-B support.Select MC33883 when system-level functional safety compliance (e.g., ISO 26262) mandates watchdog supervision.
TPS27082L8-channel, 50 V, 1.5 A smart high-side switch in 32-pin HTSSOP; no low-side configuration or IN5/IN6 PWM inputs.Lacks hardware-configurable topology and daisy-chain fault reporting; limited to high-side-only use cases.Choose TPS27082L only for pure high-side applications where TI's ecosystem integration (e.g., WEBENCH) is prioritized.

Compared with MC33883 and TPS27082L, the MCZ33880EG uniquely supports mixed high-/low-side per-output configuration, dual PWM-direct inputs (IN5/IN6), and cascaded fault reporting-making it optimal for cost-sensitive, thermally constrained automotive body electronics where topology flexibility and diagnostic efficiency are essential.

Availability

MCZ33880EG is available at Aetrix Electronics and suitable for automotive lighting control, body control modules, industrial solenoid driving, and truck/bus power distribution requiring stable component supply across extended temperature ranges.

Supply support for MCZ33880EG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and scalable silicon solutions.

The MCZ33880EG belongs to NXP's SMARTMOS™ power switch product line, engineered specifically for automotive body electronics requiring high reliability, integrated diagnostics, and wide-input-voltage operation in harsh environments.

FAQ

What is the maximum operating junction temperature for the MCZ33880EG?

The MCZ33880EG has a maximum operating junction temperature of 150°C, with overtemperature shutdown triggered between 155°C and 185°C. This ensures safe operation in under-hood automotive environments where case temperatures reach 125°C, provided thermal ground pins (8,9,24,25) are properly connected to PCB copper planes to maintain RθJL = 18°C/W. The MCZ33880EG datasheet specifies this limit under "Maximum Ratings" Table 3.

Can the MCZ33880EG drive both high-side and low-side loads simultaneously?

Yes-the MCZ33880EG supports simultaneous high-side and low-side configurations across its eight outputs. For example, outputs 1–4 may be wired as high-side (Sx to load, Dx to battery), while outputs 5–8 operate as low-side (Sx to GND, Dx to load). Each output pair (e.g., S1/D1) is electrically isolated, allowing independent topology selection without shared constraints. This capability is explicitly documented in the "Functional Description" section of the MCZ33880EG datasheet.

How does the MCZ33880EG report faults over SPI?

The MCZ33880EG uses its DO (data output) pin to report faults synchronously during SPI clock cycles: a logic 1 indicates any output fault (open load, short circuit, or overtemperature), while logic 0 means all outputs are nominal. Fault status is shifted out MSB-first on each rising SCLK edge immediately after CS falls-enabling real-time diagnostics without interrupt overhead. This behavior is defined in Figure 5 (SPI Timing Diagram) and "Functional Pin Description" of the MCZ33880EG technical data.

What is the purpose of the TGND pins on the MCZ33880EG package?

The TGND pins (8, 9, 24, 25) on the MCZ33880EG's 32-pin SOICW package are internal connections to the die substrate, designed exclusively for thermal conduction-not signal grounding. They must be soldered to a large PCB copper area to achieve RθJL = 18°C/W and sustain 1.7 W power dissipation. Failure to connect these pins results in junction temperature exceeding 150°C under full-load conditions, risking thermal shutdown. This requirement is specified in Table 2 ("SOICW 32-Pin Definitions") and "Electrical Characteristics" section of the MCZ33880EG datasheet.

Does the MCZ33880EG support PWM dimming for LED loads?

No-the MCZ33880EG is not rated or characterized for LED constant-current driving. Its output current limit (0.8–2.0 A) and RDS(ON) are optimized for incandescent lamps and inductive solenoids, not LEDs. While IN5/IN6 allow PWM control of outputs 5 and 6, the device lacks LED-specific features like current regulation, thermal foldback, or fast transient response required for flicker-free dimming. Use dedicated LED drivers (e.g., NXP's PCA9635) instead. This limitation is implied by the "Applications" section focusing on lamps and solenoids in the MCZ33880EG documentation.

MCZ33880EG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
28-SOIC (0.295", 7.50mm Width)
Series:
-
Packaging:
Tube
Product Status:
Obsolete
Switch Type:
General Purpose
Number of Outputs:
8
Ratio - Input:Output:
1:8
Output Configuration:
High Side or Low Side
Output Type:
N-Channel
Interface:
SPI
Voltage - Load:
5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd):
4.75V ~ 5.25V
Current - Output (Max):
800mA
Rds On (Typ):
550mOhm
Input Type:
-
Features:
-
Fault Protection:
Current Limiting (Fixed), Open Load Detect, Over Voltage
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC

MCZ33880EG FAQ

1.How can I place an order for MCZ33880EG through Aetrix?

Please submit a Request for Quotation (RFQ) for MCZ33880EG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCZ33880EG reliable?

The price and inventory of MCZ33880EG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33880EG is usually 5 days.

3.What payment methods are accepted for MCZ33880EG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33880EG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCZ33880EG?

MCZ33880EG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCZ33880EG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCZ33880EG?

For technical support, including MCZ33880EG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33880EG requirements.

6.How does Aetrix verify that MCZ33880EG is sourced from the original manufacturer or authorized distributors?

All MCZ33880EG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33880EG meets industry standards.

7.What is the process for return or replacement of MCZ33880EG?

All MCZ33880EG units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33880EG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCZ33880EG part is unused and in its original packaging.

Return procedure for MCZ33880EG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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