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NXP Semiconductors MCZ33880EGR2
- Part No.:
- MCZ33880EGR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
MCZ33880EGR2.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:8 28SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,614
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Product details
Overview
MCZ33880EGR2 from NXP Semiconductors (formerly Freescale) is a configurable octal high-side/low-side power switch IC with 8-bit SPI control and dual PWM-direct inputs (IN5, IN6). It delivers RDS(ON) ≤ 0.55 Ω at 25°C, supports 0.8–2.0 A current limiting per output, and features ±45 V / −20 V output clamping for inductive load protection. It is used in automotive body control modules to drive lamps, solenoids, and relays.
For engineers reviewing the MCZ33880EGR2 datasheet, MCZ33880EGR2 pinout, MCZ33880EGR2 application, or MCZ33880EGR2 equivalent, key selection criteria include its hardware-configurable high-/low-side topology, cascaded fault reporting via DO, thermal ground pins (TGND) on SOICW-32, and compatibility with 3.3 V/5.0 V SPI interfaces in harsh automotive environments.
Technical Context
The MCZ33880EGR2 integrates SMARTMOS™ 5 technology-combining CMOS logic, bipolar/MOS analog circuitry, and double-diffused DMOS power transistors-to achieve low standby current (≤5.0 μA at 13 V, 95 °C) and robust fault management. Its internal charge pump enables gate drive without external components, while independent overtemperature shutdown (TLIM = 155–185 °C) and open-load detection (IOCO = 0.3–1.0 mA) operate per-output.
It implements an 8-bit SPI interface with CS/SCLK/DI/DO timing compliant up to 6.0 MHz, supports daisy-chained fault reporting, and allows direct PWM control of outputs 5 and 6 via OR-gated IN5/IN6 pins-enabling real-time dimming or motor control without SPI overhead. All eight outputs are individually configurable as high-side or low-side switches.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range (VPWR) | 5.5 V to 24.5 V - supports full automotive battery range including cold-crank and load-dump conditions. |
| RDS(ON) (25°C) | 0.55 Ω typical - enables <1.4 W conduction loss at 2 A, reducing thermal stress in compact PCB layouts. |
| Output Current Limit | 0.8 A to 2.0 A - programmable per-output via external resistor; protects incandescent lamps and inductive coils. |
| Output Clamp Voltage | +45 V (low-side), −20 V (high-side) - suppresses inductive kickback without external TVS diodes. |
| Standby Current (IPWR) | 5.0 μA max at 13 V, 95 °C - meets automotive "always-on" module quiescent current requirements. |
| SPI Compatibility | 3.3 V / 5.0 V logic - interoperates with legacy 5 V MCUs and modern 3.3 V microcontrollers without level shifters. |
| Thermal Protection | Independent per-output overtemperature shutdown - prevents latch-up during sustained overload or ambient rise. |
| Package | 32-pin SOICW (Case 1324-02) with four thermal ground pins (pins 8, 9, 24, 25) - improves heat dissipation by 40% vs. 28-pin variant. |
Pinout & Package
MCZ33880EGR2 uses a 32-pin SOICW (wide-body) package (Case 1324-02) with integrated thermal ground leads (TGND) on pins 8, 9, 24, and 25-designed for direct connection to PCB ground plane to enhance thermal performance in automotive under-hood applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 1) | Digital reference ground | Reference for logic circuitry; must be star-connected to minimize noise coupling into SPI interface. |
| VDD (Pin 2) | Logic supply input | 5.0 V ±5%; removal disables charge pump and forces sleep mode (IPWR ≤ 5 μA). |
| S1–S8 (Pins 3–4, 10, 13, 18, 23, 27, 29–30) | Source terminals for MOSFET outputs | Connected to load (high-side) or GND (low-side); configuration determines driver topology per channel. |
| D1–D8 (Pins 5, 7, 11, 19, 22, 26, 28, 32) | Drain terminals for MOSFET outputs | Connected to VPWR (high-side) or load return (low-side); clamped to +45 V or −20 V during switching transients. |
| IN5 / IN6 (Pins 14, 17) | PWM direct control inputs | OR-gated with SPI bits; enable real-time pulse-width modulation of outputs 5 and 6 without SPI transaction latency. |
| EN (Pin 15) | Charge pump enable | Must be high to activate drivers and fault detection; tied to VDD if PWM override not required. |
| CS / SCLK / DI / DO (Pins 16, 18, 19, 32) | SPI interface signals | Full-duplex 8-bit serial interface; DO reports per-output fault status synchronously with command write. |
| VPWR (Pin 31) | Main power supply | 5.5–24.5 V input with internal reverse-battery protection; powers all output stages and clamp circuits. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware-configurable high-/low-side topology | Each of 8 outputs independently wired as source (high-side) or drain (low-side) - eliminates need for external routing or discrete driver selection. |
| Cascadable fault reporting | Single DO line reports faults across multiple daisy-chained MCZ33880EGR2 devices - reduces MCU GPIO count and simplifies diagnostic firmware. |
| Thermal ground pins (TGND) | Pins 8, 9, 24, 25 internally connected to die substrate - lowers RθJL to 18 °C/W, enabling 1.7 W power dissipation at TA = 25 °C. |
| Independent per-output diagnostics | Open-load detect (0.3–1.0 mA), short-circuit limit, and overtemperature shutdown operate per channel - isolates faults without disabling entire device. |
| Internal reverse-battery protection | VPWR pin withstands −16 V - eliminates need for external series diode or protection IC in 12 V automotive systems. |
| Low-impedance paralleling support | All 8 outputs share positive RDS(ON) tempco - enables safe current sharing when paralleled for >2 A loads without external ballast resistors. |
Applications
| Automotive Body Control Module (BCM) | Industrial PLC Output Stage |
|---|---|
Use Scenario: Centralized control of headlights, fog lamps, interior lighting, and door lock actuators in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Octal high-/low-side switch providing load isolation, PWM dimming (via IN5/IN6), and real-time fault feedback to BCM MCU over SPI. Use Value: Reduces BOM count by replacing eight discrete drivers and associated protection components; meets ISO 16750-2 load-dump immunity without external clamps. | Use Scenario: Driving 24 V DC solenoid valves, indicator lamps, and small relays in factory automation I/O modules. IC Role / Device Role / Timing Role: SPI-controlled power switch with per-channel open-load detection and thermal shutdown - replaces mechanical relay banks with solid-state reliability. Use Value: Enables predictive maintenance via continuous fault logging; supports hot-swap capability due to low IPWR and no latch-up behavior. |
| Commercial Vehicle Lighting Controller | Off-Road Equipment Power Distribution Unit |
Use Scenario: Managing multi-color LED arrays and incandescent warning lights on construction and agricultural machinery. IC Role / Device Role / Timing Role: Configurable low-side driver for LED strings and high-side driver for halogen lamps - accommodates mixed load types on single IC. Use Value: Eliminates need for separate high-/low-side driver families; ±45 V/−20 V clamping handles voltage spikes from hydraulic valve coils. | Use Scenario: Distributed power switching for cab controls, HVAC actuators, and sensor excitation in rugged off-road vehicles. IC Role / Device Role / Timing Role: Fault-tolerant octal switch with cascaded DO reporting across multiple nodes - simplifies CAN-based diagnostic architecture. Use Value: Achieves ASIL-B readiness via independent per-output monitoring; TGND pins maintain junction temperature <125 °C at 1.2 A/channel in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal high-/low-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33883 | Higher RDS(ON) (0.75 Ω typ), no IN5/IN6 PWM inputs, 28-pin SOICW only | Lacks direct PWM control and thermal ground pins; suited for cost-sensitive non-PWM applications | Select MC33883 only if PWM capability and enhanced thermal performance are unnecessary. |
| TPS27081A | Single-channel, 1.2 A, no SPI interface, no fault reporting, 8-pin SOIC | Requires 8x units + MCU GPIOs for same functionality; no diagnostics or daisy-chain capability | Choose TPS27081A only for ultra-low-cost, low-channel-count designs where diagnostics are handled externally. |
Compared with MC33883 and TPS27081A, MCZ33880EGR2 uniquely combines per-output configurability, integrated PWM override, cascaded fault reporting, and thermal-enhanced packaging-making it optimal for space-constrained, safety-aware automotive and industrial power distribution.
Availability
MCZ33880EGR2 is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC output stages, commercial vehicle lighting controllers, and off-road equipment power distribution units requiring stable component supply across extended temperature ranges.
Supply support for MCZ33880EGR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and scalable silicon solutions.
The MCZ33880EGR2 belongs to NXP's SMARTMOS™ power switch product line, engineered specifically for automotive-grade load driving with integrated protection, diagnostics, and SPI configurability in harsh environments.
FAQ
What is the maximum operating junction temperature for MCZ33880EGR2?
The MCZ33880EGR2 has a maximum operating junction temperature of 150 °C, with overtemperature shutdown triggering between 155 °C and 185 °C. This ensures reliable operation in under-hood automotive environments where case temperatures reach 125 °C, and the thermal ground pins (TGND) help maintain safe junction limits under full-load conditions.
Does MCZ33880EGR2 support both high-side and low-side configurations simultaneously?
Yes, MCZ33880EGR2 supports simultaneous high-side and low-side configurations: each of the eight outputs can be independently wired as either high-side (source to load, drain to VPWR) or low-side (drain to load, source to GND). This flexibility allows mixed-load systems-such as headlamps (high-side) and turn signals (low-side)-to be driven from a single IC without external reconfiguration.
How does the fault reporting work on MCZ33880EGR2?
MCZ33880EGR2 reports faults via the DO pin during SPI transactions: as each command bit is clocked in on DI, the corresponding output's fault status (open load, short circuit, or overtemperature) is shifted out on DO. A logic [1] indicates fault; logic [0] indicates normal operation. Faults are latched until cleared by reprogramming the output, enabling deterministic diagnostic polling in safety-critical systems.
Can MCZ33880EGR2 be used in daisy-chain SPI configurations?
Yes, MCZ33880EGR2 supports daisy-chain SPI operation: the DO pin of one device connects to the DI pin of the next, with shared SCLK and CS lines. During each CS assertion, fault status from all chained devices shifts out sequentially-reducing MCU pin count and simplifying firmware for multi-switch systems like vehicle lighting zones or modular I/O racks.
What is the purpose of the TGND pins on MCZ33880EGR2?
The TGND pins (8, 9, 24, 25) on MCZ33880EGR2 are internal thermal ground connections to the die substrate. When soldered to a large PCB ground plane, they reduce thermal resistance from junction to thermal ground (RθJL = 18 °C/W), improving power dissipation capability by ~40% over the 28-pin variant-critical for sustained 2 A loads in confined automotive enclosures.
MCZ33880EGR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 8
- Ratio - Input:Output:
- 1:8
- Output Configuration:
- High Side or Low Side
- Output Type:
- N-Channel
- Interface:
- SPI
- Voltage - Load:
- 5.5V ~ 24.5V
- Voltage - Supply (Vcc/Vdd):
- 4.75V ~ 5.25V
- Current - Output (Max):
- 800mA
- Rds On (Typ):
- 550mOhm
- Input Type:
- -
- Features:
- -
- Fault Protection:
- Current Limiting (Fixed), Open Load Detect, Over Voltage
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOIC
MCZ33880EGR2 FAQ
1.How can I place an order for MCZ33880EGR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33880EGR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33880EGR2 reliable?
The price and inventory of MCZ33880EGR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33880EGR2 is usually 5 days.
3.What payment methods are accepted for MCZ33880EGR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33880EGR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33880EGR2?
MCZ33880EGR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33880EGR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33880EGR2?
For technical support, including MCZ33880EGR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33880EGR2 requirements.
6.How does Aetrix verify that MCZ33880EGR2 is sourced from the original manufacturer or authorized distributors?
All MCZ33880EGR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33880EGR2 meets industry standards.
7.What is the process for return or replacement of MCZ33880EGR2?
All MCZ33880EGR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33880EGR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33880EGR2 part is unused and in its original packaging.
Return procedure for MCZ33880EGR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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