NXP Semiconductors MCZ33889DEGR2

Overview

MCZ33889DEGR2 from NXP Semiconductors is a system basis chip (SBC) integrating a 5.0 V LDO regulator (200 mA), low-speed fault-tolerant CAN transceiver (125 kbps), dual-mode high-side switch (HS1), programmable watchdog, SPI interface, and four operational modes (Normal/Standby/Stop/Sleep). It powers microcontrollers and peripherals in automotive body electronics while providing bus wake-up, overtemperature prewarning, and supply monitoring.

For engineers reviewing the MCZ33889DEGR2 datasheet, MCZ33889DEGR2 pinout, MCZ33889DEGR2 application, or MCZ33889DEGR2 equivalent, this page delivers verified electrical specs, mode-dependent current consumption (e.g., 55–90 μA in Sleep2), CAN threshold differences between D/B variants, HS1 R_DS(on) (≤5.0 Ω @ 125°C), and SPI timing compliance up to 4 MHz.

Technical Context

The MCZ33889DEGR2 implements a SMARTMOS-based architecture with two independent voltage regulation paths: VDD1 (5.0 V ±2%, 200 mA) for MCU supply and V2 (tracking regulator controlled via V2CTRL) for peripheral rails using an external PNP transistor. Its CAN physical layer complies with ISO 11898-3 for fault-tolerant operation at 125 kbps, featuring differential thresholds (VDIFF1 = 3.5 V min for recessive-to-dominant) and single-ended wake-up detection on CANH/CANL.

Four power modes are managed by internal state machine logic: Normal (full functionality), Standby (CAN active, reduced current), Stop (VDD1 on, oscillator optional), and Sleep (VDD1/V2 off, ultra-low I_SUP = 55–90 μA). Wake-up sources include CAN bus activity, L0/L1 digital inputs, and external HS1-controlled signals - all with configurable deglitching and timeout.

Key Specifications

Pinout & Package

MCZ33889DEGR2 is housed in a 28-pin SOICW (wide-body) package with exposed thermal pad, Pb-free (RoHS-compliant) finish, and 1.27 mm pitch. Pin layout supports automotive PCB routing with dedicated ground pins (6,7,8,9,20,21,22,23) for thermal dissipation and noise immunity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar system basis chip applications.

Compared with MC33889DEGR2, MC33886DEGR2 trades CAN integration and dual regulation for higher motor drive capability, while TCAN1042DRBR offers superior CAN ESD performance (+8 kV contact) but zero power management - making MCZ33889DEGR2 uniquely suited for compact, self-contained automotive nodes requiring regulated power, communication, and supervision in one die.

Availability

MCZ33889DEGR2 is available at Aetrix Electronics and suitable for automotive body electronics, door modules, seat control units, and roof modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCZ33889DEGR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The MCZ33889DEGR2 belongs to NXP's System Basis Chip product line, engineered specifically for automotive electronic control units needing integrated power management, fault-tolerant CAN communication, and intelligent wake-up capabilities in harsh environments.

FAQ

What is the maximum supply voltage rating for MCZ33889DEGR2?

The MCZ33889DEGR2 supports a continuous VSUP range of 4.5 V to 27 V, with transient tolerance up to 40 V during load dump events per ISO 7637-2 Pulse 5a. This ensures robust operation in 12 V and 24 V automotive systems where voltage spikes are common. The device remains fully functional across the extended 4.5–5.5 V and 18–27 V ranges, though some features like oscillator operation may be limited outside nominal 5.5–18 V.

How does the MCZ33889DEGR2 differ from the MC33889B variant?

The MCZ33889DEGR2 (D version) differs from the B version primarily in CAN receiver thresholds and loop timing: VDIFF1 min is 3.5 V (vs. 3.2 V for B), tLOOPRD max is 1.5 μs (vs. N/A for B), and wake-up detection on CANL/CANH requires ≥16 μs dominant time (vs. ≥30 μs for B). These tighter tolerances improve noise immunity and bus recovery speed in electrically noisy vehicle networks, making MCZ33889DEGR2 preferred for new designs demanding enhanced fault tolerance.

Can MCZ33889DEGR2 operate in battery-less systems or with backup power sources?

Yes - MCZ33889DEGR2 supports TermVbat mode, where CANH/CANL receivers remain active even when VSUP is disconnected, allowing wake-up from bus traffic during battery disconnect scenarios. In this mode, V2INT must be maintained at 0–5.25 V, and CANH/CANL short-to-battery detection uses reduced thresholds (VSUP/2 + 4.55 V). This enables fail-operational behavior in redundant power architectures used in ADAS and gateway modules.

What is the purpose of the RTH and RTL pins on MCZ33889DEGR2?

The RTH and RTL pins on MCZ33889DEGR2 provide active control of CAN bus termination resistors. RTH connects to CANH and RTL to CANL, allowing the SBC to enable or disable termination via SPI commands. This eliminates manual resistor placement and supports dynamic network topology changes - such as adding/removing ECUs - without hardware modification. Each pin has programmable on-resistance (10–90 Ω) and supports both normal and TermVbat modes.

Does MCZ33889DEGR2 support SPI communication during Stop or Sleep modes?

Yes - MCZ33889DEGR2 allows SPI wake-up and configuration during Stop mode: a rising edge on CS initiates normal request mode within 15–90 μs, enabling immediate register access. However, SPI is disabled in Sleep mode; wake-up requires L0/L1 input or CAN activity first. This design balances ultra-low power consumption with responsive reconfiguration - critical for systems that must react quickly to external events while minimizing quiescent current.