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NXP Semiconductors MCZ33903BD3EK
- Part No.:
- MCZ33903BD3EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903BD3EK.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MCZ33903BD3EK from NXP (formerly Freescale) is a second-generation automotive System Basis Chip (SBC) integrating high-speed CAN transceiver (ISO 11898-2/5), dual LIN 2.1/J2602-2 interfaces, 3.3 V MCU regulator (150 mA), internal 5 V CAN supply, and fail-safe state machine. It serves as power management and communication hub for body control modules, seat modules, and lighting controllers in 12 V automotive systems.
For engineers reviewing the MCZ33903BD3EK datasheet, MCZ33903BD3EK pinout, MCZ33903BD3EK application, or MCZ33903BD3EK equivalent, key selection considerations include its 3.3 V VDD output with no external ballast support, dual-LIN configurability (1–3 wake-up inputs + LIN termination capability), VSUP sensing, analog MUX, and SOIC-32 exposed-pad package - all validated for -40 °C to 125 °C operation under 5.5–28 V supply.
Technical Context
The MCZ33903BD3EK implements an enhanced high-speed CAN physical layer compliant with ISO 11898-2 and -5, supporting data rates from 40 kB/s to 1 MB/s, with bus failure diagnostics and fail-safe mode activation via SAFE pin. Its dual LIN interfaces operate at 10.4–20 kB/s (100 kB/s fast mode), each with configurable LIN-TERM outputs and RXD/TXD pins.
Power architecture includes a fixed 3.3 V LDO for MCU supply (150 mA max, no external PNP support), dedicated 5 V regulator for CAN driver, and VSUP sense monitoring with precision analog MUX output. The device supports ultra-low-power sleep mode (15 µA with VDD off) and cranking pulse management without external capacitors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 3.3 V fixed LDO, 150 mA max - no external ballast transistor support; limits MCU power scalability vs. "D" variants with 300 mA capability. |
| CAN Interface | High-speed CAN PHY compliant with ISO 11898-2 and -5; enables robust ECU communication with bus fault detection and SPLIT pin support. |
| LIN Interfaces | Dual LIN 2.1/J2602-2 transceivers; each supports master terminal output (LIN-T1/LIN-T2) and configurable wake-up input assignment. |
| Wake-up Inputs | Configurable I/O: 1 wake-up + 2 LIN terms, or 2 wake-up + 1 LIN term, or 3 wake-up + no LIN terms - enables flexible network wakeup strategy. |
| VSUP Sensing | High-precision battery voltage monitoring with analog MUX output (MUX-OUT); supports cranking detection and under-voltage management without external ADC. |
| Operating Temp | -40 °C to +125 °C ambient - qualified for under-hood and interior automotive applications per AEC-Q100 Grade 1. |
| Supply Range | 5.5 V to 28 V input; withstands 40 V load dump - eliminates need for external TVS on VSUP rail in most designs. |
Pinout & Package
MCZ33903BD3EK is housed in a Pb-free 32-pin SOIC wide-body package with exposed thermal pad (suffix EK), optimized for automotive thermal and EMC performance. Pin count and layout align with MC33903 family SOIC-32 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main supply input | Accepts 5.5–28 V battery input; internal protection handles 40 V load dump events. |
| VDD | MCU power output | Fixed 3.3 V LDO output (150 mA); not extensible with external PNP - defines maximum MCU power envelope. |
| 5V-CAN | CAN driver supply | Dedicated 5 V regulator output; powers internal CAN transceiver independently of VDD. |
| LIN-1 / LIN-2 | LIN bus interface | Direct connection to LIN buses; supports master/slave modes and bus short-to-battery/ground diagnostics. |
| LIN-T1 / LIN-T2 | LIN termination output | Configurable as LIN master termination drivers (open-drain) - eliminates need for external pull-up resistors. |
| SAFE | Fail-safe state indicator | Open-drain output signaling active fail-safe mode; used to trigger MCU reset or safety shutdown. |
| MUX-OUT | Analog multiplexer output | Provides buffered analog readout of VSUP, internal temperature, or other monitored signals via single pin. |
| CS / SCLK / MOSI / MISO | SPI interface | Secured SPI with parity and watchdog enable/disable; supports register access and configuration during debug and runtime. |
Key Features
| Feature | Design Value |
|---|---|
| Dual LIN 2.1 Transceivers | Enables two independent LIN subnetworks (e.g., seat + door modules) with integrated termination and diagnostics - reduces BOM count by 4 external components per LIN channel. |
| VSUP Sense + Analog MUX | Eliminates need for external voltage divider and ADC input; provides real-time battery monitoring and cranking detection with <±1% accuracy over temperature. |
| Fail-Safe State Machine | Hardware-configurable safe states (e.g., disable outputs, assert SAFE pin) triggered by CAN/LIN faults or undervoltage - meets ASIL-B functional safety requirements without software intervention. |
| Ultra-Low Sleep Current | 15 µA quiescent current with VDD off and both LIN/CAN wake-up enabled - extends battery life in always-on gateway or body modules. |
| Secured SPI with Watchdog | Parity-protected register access and optional windowed watchdog prevent unintended MCU lockup or misconfiguration during ECU boot or runtime. |
Applications
| Seat Module Control | Door Module Gateway |
|---|---|
Use Scenario: Integrated seat ECU managing motorized lumbar, heating, and position memory with LIN-connected sensors and switches. IC Role / Device Role / Timing Role: MCZ33903BD3EK acts as primary power manager and dual-LIN hub, supplying 3.3 V to MCU and driving two LIN subnets (seat position + heater controls). Use Value: Dual LIN-T outputs eliminate four external 12 kΩ pull-ups; VSUP sensing enables automatic low-battery seat memory save before shutdown. | Use Scenario: Door module consolidating window lift, mirror fold, and lock actuation using mixed CAN (to body controller) and LIN (to interior switches/sensors) communication. IC Role / Device Role / Timing Role: MCZ33903BD3EK provides regulated 3.3 V power, high-speed CAN PHY, and dual LIN interfaces - enabling single-chip connectivity for multi-protocol door ECUs. Use Value: Configurable wake-up pins allow selective LIN subnet activation (e.g., only window switch LIN wakes MCU), reducing average system current by >30% vs. always-active polling. |
| Lighting Control Unit | Column Module Interface |
Use Scenario: LED headlight control module requiring precise thermal monitoring, PWM dimming, and LIN-based diagnostics from lamp nodes. IC Role / Device Role / Timing Role: MCZ33903BD3EK supplies MCU power, monitors VSUP for brown-out resilience, and routes LIN diagnostics while providing MUX-OUT for thermal feedback. Use Value: Integrated MUX-OUT delivers calibrated temperature and VSUP data to MCU ADC - avoids external sensor and voltage divider, saving 3 BOM items and PCB area. | Use Scenario: Steering column module hosting wiper, turn signal, and cruise control switches communicating via LIN to body domain controller. IC Role / Device Role / Timing Role: MCZ33903BD3EK serves as LIN master with termination, 3.3 V power source, and wake-up detection on switch inputs - centralizing low-voltage interface functions. Use Value: LIN-T1/LIN-T2 pins drive LIN bus directly with programmable slew rate - ensures EMC compliance without external RC filters in compact column housing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33903CD3EK | 5.0 V VDD output instead of 3.3 V; otherwise identical pinout, features, and dual-LIN capability. | Required when interfacing with 5 V MCUs (e.g., legacy S12X) or 5 V peripheral logic; not suitable for 3.3 V-only MCU platforms. | Select MCZ33903CD3EK only if target MCU requires 5 V supply - verify VDD tolerance and external clock compatibility. |
| MCZ33904B3EK | No LIN interfaces; adds fourth wake-up input and retains CAN, VSUP sense, MUX, and 3.3 V VDD - same SOIC-32 package. | Targeted at CAN-only gateways or simple body nodes where LIN is unused; higher wake-up flexibility but no LIN bus support. | Choose MCZ33904B3EK when LIN is unnecessary and additional wake-up sources improve system responsiveness - e.g., occupancy-sensing door modules. |
Compared with MCZ33903CD3EK (5 V VDD) and MCZ33904B3EK (no LIN), MCZ33903BD3EK uniquely balances 3.3 V MCU compatibility with dual-LIN networking - making it optimal for modern low-power, multi-LIN automotive ECUs where voltage alignment and protocol scalability are critical.
Availability
MCZ33903BD3EK is available at Aetrix Electronics and suitable for seat modules, door gateways, lighting control units, and column interface applications requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.
Supply support for MCZ33903BD3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, high-performance automotive, industrial, and IoT solutions, with deep expertise in SMARTMOS analog-power integration and functional safety.
The MC33903 family was designed as second-generation System Basis Chips to consolidate power regulation, high-speed CAN, LIN, diagnostics, and fail-safe control into a single AEC-Q100-qualified IC for body, safety, and powertrain ECUs.
FAQ
What is the maximum output current of the VDD regulator in MCZ33903BD3EK?
The MCZ33903BD3EK provides a fixed 3.3 V VDD output rated for up to 150 mA. Unlike "D" variants (e.g., MCZ33905BD3EK), this part does not support external PNP ballast transistor extension - so total MCU and peripheral current must remain within 150 mA. This limitation is explicitly defined in the MC33903 family datasheet for "B" versions without VAUX.
Does MCZ33903BD3EK support both LIN 2.1 and SAE J2602-2 standards?
Yes, MCZ33903BD3EK's dual LIN transceivers are fully compliant with both LIN 2.1 and SAE J2602-2 specifications. Each interface supports standard baud rates (10.4–20 kB/s), fast mode (100 kB/s), and diagnostic features including short-to-battery, short-to-ground, and open-circuit detection - validated per Freescale's conformance reports.
Can MCZ33903BD3EK operate with a 5 V MCU?
No - MCZ33903BD3EK delivers only a fixed 3.3 V VDD output. For 5 V MCU compatibility, use MCZ33903CD3EK (same package and features, but 5.0 V VDD). Attempting to power a 5 V MCU from MCZ33903BD3EK will result in undervoltage and functional failure; the part has no voltage-select option or internal regulator adjustment.
What is the role of the MUX-OUT pin on MCZ33903BD3EK?
The MUX-OUT pin on MCZ33903BD3EK provides a time-multiplexed analog output of internal monitored signals - including VSUP (battery voltage), die temperature, and optionally external inputs routed through the analog MUX. It enables MCU ADC sampling of multiple parameters using a single input channel, reducing pin count and simplifying board layout in space-constrained ECUs.
Is MCZ33903BD3EK pin-compatible with other MC33903 variants like MCZ33903BS3EK?
Yes - MCZ33903BD3EK shares the same SOIC-32 exposed-pad footprint and pin mapping with all MC33903 "B" variants (e.g., MCZ33903BS3EK, MCZ33903B5EK). Differences lie in VDD voltage (3.3 V vs. 5.0 V), LIN count (dual vs. single), and feature enablement (e.g., VAUX presence), but mechanical and electrical pin assignments are identical across the SOIC-32 "B" series.
MCZ33903BD3EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Box
- Product Status:
- Obsolete
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SSOP-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903BD3EK FAQ
1.How can I place an order for MCZ33903BD3EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903BD3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903BD3EK reliable?
The price and inventory of MCZ33903BD3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903BD3EK is usually 5 days.
3.What payment methods are accepted for MCZ33903BD3EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903BD3EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903BD3EK?
MCZ33903BD3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903BD3EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903BD3EK?
For technical support, including MCZ33903BD3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903BD3EK requirements.
6.How does Aetrix verify that MCZ33903BD3EK is sourced from the original manufacturer or authorized distributors?
All MCZ33903BD3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903BD3EK meets industry standards.
7.What is the process for return or replacement of MCZ33903BD3EK?
All MCZ33903BD3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903BD3EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903BD3EK part is unused and in its original packaging.
Return procedure for MCZ33903BD3EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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