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NXP Semiconductors MCZ33903BD3EKR2
- Part No.:
- MCZ33903BD3EKR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903BD3EKR2.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,573
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Product details
Overview
MCZ33903BD3EKR2 from NXP (formerly Freescale) is a second-generation automotive System Basis Chip (SBC) integrating high-speed CAN transceiver (ISO 11898-2/5), dual LIN 2.1/J2602-2 interfaces, 3.3 V MCU voltage regulator (150 mA), internal 5 V CAN supply, and fail-safe state machine. It supports body control modules and door modules requiring robust wake-up management, cranking pulse handling, and <15 µA sleep current.
For engineers reviewing the MCZ33903BD3EKR2 datasheet, MCZ33903BD3EKR2 pinout, MCZ33903BD3EKR2 application, or MCZ33903BD3EKR2 equivalent, key selection criteria include dual-LIN configurability, VSUP sense monitoring, SAFE-pin-linked fail-safe behavior, SPI watchdog security, and SOIC-32EP package compatibility with automotive ECU thermal and layout constraints.
Technical Context
The MCZ33903BD3EKR2 implements a hardware-configurable fail-safe state machine triggered by SAFE pin assertion, with cranking pulse management that maintains degraded functionality during battery dips to 5.5 V. Its dual LIN physical layers support independent 10.4–20 kB/s operation (100 kB/s fast mode), each with configurable LIN termination outputs.
It integrates a precision VSUP sensing path with analog MUX output for external ADC monitoring, and supports three I/O wake-up configurations: 1 wake-up + 2 LIN terminations, 2 wake-up + 1 LIN termination, or 3 wake-up only - all without VAUX or VSENSE functionality per its variant specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CAN Interface | ISO 11898-2 and -5 compliant high-speed transceiver; enables ECU connectivity to vehicle backbone networks with bus failure diagnostics. |
| LIN Interfaces | Dual LIN 2.1 / SAE J2602-2 compliant; supports two independent sub-buses (e.g., mirror + seat controls) with selectable termination drive capability. |
| VDD Regulator Output | 3.3 V ±2%, 150 mA fixed internal LDO; powers MCU core without external PNP ballast - simplifies BOM vs. 300 mA variants. |
| Low-Power Sleep Current | 15 µA typical with VDD OFF and LIN/CAN wake-up active; meets OEM requirements for ultra-low quiescent current in always-on domains. |
| Operating Voltage Range | 5.5 V to 28 V input; withstands 40 V load dump pulses - eliminates need for external TVS in most body module designs. |
| Temperature Range | −40 °C to +125 °C ambient; qualified per AEC-Q100 Grade 1 for under-hood and interior ECU placement. |
| Package | SOIC-32 wide-body with exposed pad; provides thermal performance for 1.5 W dissipation in compact automotive PCB layouts. |
Pinout & Package
MCZ33903BD3EKR2 uses a 32-pin SOIC wide-body package with exposed thermal pad (98ASA10556D footprint). Pin functions are validated per MC33903D simplified application drawing and Freescale MC33903_4_5FS Rev. 6.0.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main supply input | Accepts 5.5–28 V battery rail; feeds internal regulators and enables overvoltage/undervoltage detection. |
| VDD | MCU power output | 3.3 V regulated output (150 mA); directly powers compatible S12x/MPC560x microcontrollers without external pass transistor. |
| SAFE | Fail-safe state machine output | Open-drain signal asserting safe state on fault; used to disable external drivers or trigger MCU reset via external logic. |
| CS, SCLK, MOSI, MISO | SPI interface | Secured 4-wire SPI with parity checking; enables configuration of watchdog window, reset timing, and LIN/CAN enable states. |
| RST | Reset input | Asynchronous active-low reset; synchronizes internal state machine and releases MCU from reset after power stabilization. |
| INT | Interrupt output | Open-drain interrupt signaling LIN/CAN activity, wake-up events, or regulator faults to MCU host. |
| LIN-1 / LIN-2 | LIN bus outputs | Two independent LIN physical layer outputs; each configurable as master or slave with integrated termination control. |
| IO-0 / IO-1 / IO-2 | Configurable I/O | Three pins supporting wake-up input or LIN termination drive; enables flexible routing for multi-sensor door modules. |
| CANH / CANL | CAN differential pair | High-speed CAN bus interface compliant with ISO 11898-2; includes bus failure diagnostics and short-to-battery protection. |
| 5V-CAN | CAN transceiver supply | Dedicated 5 V regulator output; powers external CAN driver if internal transceiver not used, or supplies auxiliary 5 V loads. |
Key Features
| Feature | Design Value |
|---|---|
| Dual LIN 2.1/J2602-2 interfaces | Enables simultaneous control of two LIN sub-networks (e.g., left/right door modules) without external transceivers or routing complexity. |
| Hardware fail-safe state machine | Automatically transitions to preconfigured safe state on VSUP undervoltage, overtemperature, or watchdog timeout - no MCU intervention required. |
| Innovative cranking pulse management | Maintains LIN/CAN wake-up capability and basic regulator function during engine start (down to 5.5 V), eliminating need for large hold-up capacitors. |
| Secured SPI with watchdog | Supports time-out and window watchdog modes with parity-protected register access - prevents unintended configuration changes in noisy automotive environments. |
| Configurable I/O wake-up pins | Three pins can be assigned as wake-up inputs or LIN termination drivers, enabling single-chip support for variable sensor count across platform variants. |
Applications
| Door Module Control | Seat Module Interface |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in automotive door assemblies. IC Role / Device Role / Timing Role: System Basis Chip providing MCU power, dual-LIN communication to mirror/lock actuators, and CAN gateway to body domain controller. Use Value: Reduces component count by integrating dual LIN transceivers and 3.3 V MCU supply - eliminates four discrete transceivers and one LDO in legacy designs. |
Use Scenario: Seat position memory, heating, and lumbar adjustment controlled via LIN sub-networks and coordinated over CAN. IC Role / Device Role / Timing Role: Power management and communication hub connecting seat MCU to vehicle CAN backbone and local LIN sensors/actuators. Use Value: Enables <15 µA sleep current while maintaining dual-LIN wake-up capability - extends battery life in parked vehicle scenarios. |
| Body Control Gateway | Lighting Control Unit |
Use Scenario: Aggregation of signals from multiple LIN-based body nodes (e.g., HVAC, lighting, wipers) into a unified CAN message stream. IC Role / Device Role / Timing Role: Gateway SBC managing protocol translation, power sequencing, and fail-safe shutdown during bus errors or supply faults. Use Value: Hardware-based fail-safe state machine ensures deterministic response to CAN bus off or LIN timeout - meets ASIL-B functional safety decomposition requirements. |
Use Scenario: LED headlight and interior lighting control with dimming, diagnostics, and thermal monitoring. IC Role / Device Role / Timing Role: Power regulator and LIN interface for LED driver MCUs, with VSUP sense input feeding analog MUX for real-time voltage monitoring. Use Value: Integrated VSUP sensing and MUX output allow MCU to sample battery voltage without additional op-amp circuitry - reduces BOM cost and board space. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33904B3EK/R2 | Single CAN, zero LIN interfaces; 4 wake-up I/Os; includes VAUX and VSENSE; same SOIC-32EP package. | Targeted at CAN-only gateways or modules requiring auxiliary 5 V/3.3 V supply and analog monitoring but no LIN. | Select when LIN is unnecessary and VAUX/VSENSE functionality is required for auxiliary loads or battery sensing. |
| MCZ33905BD3EK/R2 | Dual LIN, 54-pin SOIC-EP package; adds VAUX regulator and VSENSE input; supports up to 300 mA VDD with external PNP. | Designed for higher-power ECUs needing scalable MCU supply, auxiliary regulation, and enhanced analog monitoring. | Choose when >150 mA MCU current or VAUX-powered peripherals (e.g., sensors, RF modules) are required. |
Compared with MCZ33903BD3EKR2, MCZ33904B3EK/R2 removes LIN but adds VAUX/VSENSE for broader analog integration, while MCZ33905BD3EK/R2 expands I/O count, power capability, and analog features at the cost of larger footprint - making MCZ33903BD3EKR2 optimal for cost- and space-constrained dual-LIN door modules.
Availability
MCZ33903BD3EKR2 is available at Aetrix Electronics and suitable for automotive body electronics, door control modules, and seat interface units requiring stable component supply, AEC-Q100 compliance, and long-term lifecycle support.
Supply support for MCZ33903BD3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in automotive semiconductor solutions, delivering AEC-Q100-qualified analog, power management, and system basis chips for safety-critical vehicle systems.
The MC33903 family targets cost-optimized, dual-LIN automotive ECUs - specifically engineered for door, seat, and lighting modules where integration of CAN, LIN, power regulation, and fail-safe logic reduces system-level BOM and design complexity.
FAQ
What is the maximum output current of the VDD regulator in MCZ33903BD3EKR2?
The MCZ33903BD3EKR2 provides a fixed 3.3 V VDD output rated for 150 mA continuous current. Unlike variants with external PNP support, this device does not allow ballast transistor implementation - the 150 mA limit is internal and non-scalable. This rating is sufficient for S12x and MPC560x microcontrollers in door and seat modules where peak current remains below threshold.
Does MCZ33903BD3EKR2 support LIN termination drive capability?
Yes, MCZ33903BD3EKR2 supports LIN termination drive on both LIN-1 and LIN-2 pins. Each LIN interface includes dedicated termination outputs (LIN-T1/LIN-T2) that can be enabled via configuration registers. The device allows flexible assignment of its three I/O pins (IO-0/IO-1/IO-2) as either wake-up inputs or LIN termination drivers - enabling mixed-mode use in multi-actuator door modules.
What fail-safe mechanisms are implemented in MCZ33903BD3EKR2?
MCZ33903BD3EKR2 implements a hardware-based fail-safe state machine linked to the SAFE pin. On detection of VSUP undervoltage, overtemperature, or watchdog timeout, it asserts SAFE to signal external circuitry and disables non-critical outputs while preserving LIN/CAN wake-up capability. This behavior is configurable via SPI but operates autonomously - no MCU firmware dependency is required for basic fail-safe response.
Can MCZ33903BD3EKR2 monitor battery voltage for system diagnostics?
Yes, MCZ33903BD3EKR2 includes a high-precision VSUP sense path routed to MUX-OUT, allowing the host MCU to read battery voltage via a single ADC channel. Although it lacks dedicated VSENSE pin (unlike MCZ33905 variants), the internal VSUP monitoring provides ±1.5% accuracy across −40 °C to +125 °C - sufficient for cranking detection, low-voltage warning, and state-of-charge estimation in body ECUs.
What is the purpose of the DBG pin on MCZ33903BD3EKR2?
The DBG pin on MCZ33903BD3EKR2 disables the internal watchdog timer during debug sessions. When pulled high, it inhibits watchdog timeout resets, allowing engineers to pause MCU execution, inspect registers, or step through code without unintended system resets. This feature accelerates hardware/software co-debugging in development - especially when validating LIN/CAN initialization sequences or fail-safe transitions.
MCZ33903BD3EKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SSOP-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903BD3EKR2 FAQ
1.How can I place an order for MCZ33903BD3EKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903BD3EKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903BD3EKR2 reliable?
The price and inventory of MCZ33903BD3EKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903BD3EKR2 is usually 5 days.
3.What payment methods are accepted for MCZ33903BD3EKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903BD3EKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903BD3EKR2?
MCZ33903BD3EKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903BD3EKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903BD3EKR2?
For technical support, including MCZ33903BD3EKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903BD3EKR2 requirements.
6.How does Aetrix verify that MCZ33903BD3EKR2 is sourced from the original manufacturer or authorized distributors?
All MCZ33903BD3EKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903BD3EKR2 meets industry standards.
7.What is the process for return or replacement of MCZ33903BD3EKR2?
All MCZ33903BD3EKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903BD3EKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903BD3EKR2 part is unused and in its original packaging.
Return procedure for MCZ33903BD3EKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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