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NXP Semiconductors MCZ33903BD5EKR2
- Part No.:
- MCZ33903BD5EKR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903BD5EKR2.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,627
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Product details
Overview
MCZ33903BD5EKR2 from NXP (formerly Freescale) is a second-generation automotive System Basis Chip (SBC) integrating high-speed CAN transceiver, dual LIN 2.1/J2602-2 interfaces, 5.0 V MCU regulator (150 mA), internal 5.0 V CAN supply, and fail-safe state machine. It operates from 5.5–28 V input, supports -40 °C to 125 °C ambient, and delivers 15 µA quiescent current in VDD-OFF low-power mode. Used in body control modules and gateway ECUs for centralized power and communication management.
For engineers reviewing the MCZ33903BD5EKR2 datasheet, MCZ33903BD5EKR2 pinout, MCZ33903BD5EKR2 application, or MCZ33903BD5EKR2 equivalent, key selection criteria include dual-LIN support with configurable wake-up/I/O mapping, ISO 11898-2/5 CAN compliance, cranking pulse resilience, secured SPI with watchdog, and analog sensing via integrated MUX - all in a Pb-free 32-pin SOICW-EP package.
Technical Context
The MCZ33903BD5EKR2 implements an advanced fail-safe state machine linked to the SAFE pin, enabling hardware-configurable default behavior during fault conditions. Its dual LIN transceivers comply with LIN 2.1 and SAE J2602-2, supporting data rates from 10.4 to 20 kB/s (100 kB/s fast mode), while the embedded high-speed CAN physical layer meets ISO 11898-2 and -5 standards with bus failure diagnostics and protection.
Power architecture includes a fixed 5.0 V LDO for MCU supply (150 mA, no external PNP support), dedicated 5.0 V regulator for CAN driver (VCAN), and high-precision VSUP sensing with analog MUX output. Wake-up capability is configurable across three I/O pins - each usable as either wake-up input or LIN master termination - with ±8 kV module-level ESD protection on CAN/LIN buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output Voltage | 5.0 V fixed, supplies MCU directly without external ballast transistor |
| Max VDD Output Current | 150 mA - sufficient for mid-tier automotive MCUs like S12x or S08x |
| CAN Interface | High-speed, ISO 11898-2 and -5 compliant, with bus fault diagnostics |
| LIN Interfaces | Dual LIN 2.1/J2602-2 transceivers, each with independent TXD/RXD and LIN-Term |
| Low-Power Quiescent Current | 15 µA in VDD-OFF mode with active CAN/LIN wake-up detection |
| Operating Voltage Range | 5.5 V to 28 V - supports cold-crank (4.5 V min) and load dump (40 V transient) |
| Temperature Range | -40 °C to +125 °C ambient - qualified for under-hood and chassis applications |
Pinout & Package
MCZ33903BD5EKR2 is housed in a Pb-free 32-pin SOICW with exposed thermal pad (package code EK), optimized for automotive thermal and EMC performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Battery Input Sense | High-precision monitoring of battery voltage for cranking detection and under-voltage management |
| VDD | MCU Power Output | 5.0 V regulated supply for connected microcontroller; 150 mA max, no external PNP support |
| 5V-CAN | CAN Transceiver Supply | Dedicated 5.0 V LDO output powering internal CAN driver stage |
| SAFE | Fail-Safe State Indicator | Open-drain output signaling active fail-safe mode; drives external safety logic or MCU interrupt |
| CS / SCLK / MOSI / MISO | SPI Interface | Secured SPI bus with parity checking and watchdog integration for configuration and diagnostics |
| RST | Reset Input/Output | Asynchronous reset input; also outputs device-initiated reset pulses during fault recovery |
| DBG | Debug Mode Control | Active-low pin disabling watchdog during development to prevent false timeouts |
| CANH / CANL / SPLIT | CAN Physical Layer | Differential high-speed CAN interface with common-mode choke support via SPLIT pin |
| LIN-1 / LIN-2 / LIN-T1 / LIN-T2 | LIN Master Terminals | Two independent LIN channels; each includes TXD, RXD, and configurable LIN-Term for bus biasing |
| I/O-0 / I/O-1 / I/O-2 | Configurable I/O | Three pins supporting wake-up input or LIN master termination - selectable per application need |
| MUX-OUT | Analog Multiplexer Output | Single-ended analog output aggregating VSUP, temperature, or other monitored signals |
Key Features
| Feature | Design Value |
|---|---|
| Dual LIN 2.1 Transceivers | Enables two independent LIN subnetworks (e.g., seat + door modules) with shared MCU resources |
| Fail-Safe State Machine | Hardware-configurable default behavior (e.g., safe shutdown or limp-home mode) triggered by SAFE pin assertion |
| Secured SPI with Watchdog | Prevents unauthorized register access and detects MCU lockup via time-out and window watchdog modes |
| Innovative Cranking Pulse Management | Maintains critical functions (CAN/LIN wake-up, SAFE signaling) during 4.5 V battery dips without external capacitors |
| Configurable Wake-up I/O Mapping | Three I/O pins dynamically assigned as wake-up inputs or LIN terminations - reduces BOM count and layout complexity |
Applications
| Body Control Module | Gateway ECU |
|---|---|
Use Scenario: Centralized control of lighting, windows, mirrors, and door locks in modern vehicle body electronics. IC Role / Device Role / Timing Role: Primary SBC providing regulated 5.0 V power to MCU, dual-LIN connectivity to peripheral nodes, and CAN gateway functionality. Use Value: Reduces component count by integrating CAN PHY, dual LIN PHY, power regulation, and fail-safe logic - validated for S12x/MPC560x-based designs. | Use Scenario: Bridging between high-speed CAN backbone and multiple LIN subnetworks in vehicle communication architecture. IC Role / Device Role / Timing Role: CAN-to-LIN protocol translator and power manager for gateway MCU, with simultaneous bus monitoring and wake-up arbitration. Use Value: Enables deterministic wake-up prioritization across CAN and both LIN buses - critical for low-latency network entry during sleep exit. |
| Seat Module | Door Module |
Use Scenario: Actuation and position feedback control for electric seat motors, heaters, and memory functions. IC Role / Device Role / Timing Role: Local power manager and LIN node controller interfacing with seat MCU and sensors. Use Value: Dual-LIN support allows co-location of seat position and heater control on separate LIN channels - improving signal integrity and fault isolation. | Use Scenario: Integration of window lift, mirror fold, lock actuation, and anti-pinch sensing in compact door electronics. IC Role / Device Role / Timing Role: LIN master and power regulator for door MCU, with wake-up capability from key fob RF or door handle switch. Use Value: Configurable I/O pins serve as both wake-up inputs and LIN terminations - eliminating discrete bias resistors and saving PCB area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33903CD5EKR2 | Same package and pinout; 5.0 V VDD output with identical 150 mA rating but 'C' revision oscillator and VSUP ramp behavior | No functional difference in LIN/CAN operation or fail-safe behavior; minor timing calibration updates | Select MCZ33903CD5EKR2 only if legacy design validation requires 'C' silicon revision |
| MCZ33904B5EKR2 | Single CAN, zero LIN interfaces; adds quad wake-up I/O and VAUX/VSENSE/MUX features absent in MCZ33903BD5EKR2 | Targeted at CAN-only ECUs requiring broader analog monitoring and more wake-up sources - not suitable for LIN-dependent systems | Choose MCZ33904B5EKR2 when dual-LIN is unnecessary and enhanced analog sensing or four wake-up inputs are required |
Compared with MCZ33903CD5EKR2 and MCZ33904B5EKR2, the MCZ33903BD5EKR2 uniquely balances dual-LIN support, compact 32-pin footprint, and fail-safe state machine - making it optimal for cost-sensitive, space-constrained body electronics where LIN expansion is mandatory.
Availability
MCZ33903BD5EKR2 is available at Aetrix Electronics and suitable for body control modules, gateway ECUs, seat modules, and door modules requiring stable component supply across automotive production lifecycles.
Supply support for MCZ33903BD5EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, high-reliability automotive, industrial, and IoT solutions, with deep expertise in SMARTMOS analog-power integration.
The MC33903 family was designed as a second-generation System Basis Chip targeting automotive body, safety, and gateway applications - delivering integrated power, communication, and fail-safe management in a single IC.
FAQ
What is the maximum output current of the VDD regulator in MCZ33903BD5EKR2?
The MCZ33903BD5EKR2 provides a fixed 5.0 V VDD output rated for up to 150 mA. Unlike variants with external ballast support (e.g., MC33904 or MC33905), the MCZ33903BD5EKR2 does not support external PNP transistor augmentation - its 150 mA limit is strictly internal and sufficient for S12x or S08x-class MCUs in body electronics applications.
Does MCZ33903BD5EKR2 support both LIN 2.1 and SAE J2602-2 protocols?
Yes, MCZ33903BD5EKR2 integrates two fully compliant LIN transceivers supporting both LIN 2.1 and SAE J2602-2 standards. Each channel operates at data rates from 10.4 to 20 kB/s (100 kB/s in fast mode), with independent TXD, RXD, and LIN-Term pins - enabling simultaneous operation on two distinct LIN subnetworks without software arbitration.
How does the fail-safe state machine function in MCZ33903BD5EKR2?
The MCZ33903BD5EKR2 implements a hardware-based fail-safe state machine linked to the SAFE pin. When triggered by internal faults (e.g., overtemperature, VDD undervoltage, or watchdog timeout), it asserts SAFE as open-drain output to signal the MCU or external safety circuitry. Default behavior - such as disabling non-critical regulators or entering safe sleep - is configurable via hardware straps, not software.
Can MCZ33903BD5EKR2 operate during automotive cranking events?
Yes, MCZ33903BD5EKR2 includes innovative cranking pulse management that maintains core functionality - including CAN/LIN wake-up detection, SAFE signaling, and VSUP monitoring - down to 4.5 V battery input. This eliminates need for large hold-up capacitors while preserving system responsiveness during engine start, as verified in ISO 16750-2 crank profile testing.
What package type and thermal characteristics does MCZ33903BD5EKR2 use?
MCZ33903BD5EKR2 uses a Pb-free 32-pin SOICW with exposed thermal pad (suffix EK). The exposed pad enables direct thermal coupling to PCB ground plane, achieving junction-to-board thermal resistance (RθJB) of 22 °C/W - critical for sustained operation at 125 °C ambient in under-dash or door module environments.
MCZ33903BD5EKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SSOP-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903BD5EKR2 FAQ
1.How can I place an order for MCZ33903BD5EKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903BD5EKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903BD5EKR2 reliable?
The price and inventory of MCZ33903BD5EKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903BD5EKR2 is usually 5 days.
3.What payment methods are accepted for MCZ33903BD5EKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903BD5EKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903BD5EKR2?
MCZ33903BD5EKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903BD5EKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903BD5EKR2?
For technical support, including MCZ33903BD5EKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903BD5EKR2 requirements.
6.How does Aetrix verify that MCZ33903BD5EKR2 is sourced from the original manufacturer or authorized distributors?
All MCZ33903BD5EKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903BD5EKR2 meets industry standards.
7.What is the process for return or replacement of MCZ33903BD5EKR2?
All MCZ33903BD5EKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903BD5EKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903BD5EKR2 part is unused and in its original packaging.
Return procedure for MCZ33903BD5EKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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