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NXP Semiconductors MCZ33903C3EK

Part No.:
MCZ33903C3EK
Manufacturer:
NXP Semiconductors
Category:
Specialized
Package:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Datasheet:
AetrixMCZ33903C3EK.pdf
Description:
IC INTERFACE SPECIALIZED 32SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,940

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Product details

Overview

MCZ33903C3EK from NXP (formerly Freescale) is a second-generation System Basis Chip (SBC) designed as an automotive power management and communication interface unit for MCU-based ECUs in body, safety, and powertrain systems. It integrates a 5.0 V/150 mA MCU voltage regulator (VDD), high-speed CAN transceiver (ISO 11898-2/5 compliant), secured SPI with watchdog, fail-safe state machine, and one wake-up input - all in a 32-pin SOIC exposed-pad package operating from −40 °C to 125 °C.

For engineers reviewing the MCZ33903C3EK datasheet, MCZ33903C3EK pinout, MCZ33903C3EK application, or MCZ33903C3EK equivalent, key selection criteria include its 5.0 V VDD output without external ballast support, single CAN interface with ±8 kV ESD protection, ultra-low 15 µA sleep current with VDD off, and compatibility with S12x/MPC560x MCUs in gateways and seat modules.

Technical Context

The MCZ33903C3EK implements a fail-safe state machine linked to the SAFE pin, enabling configurable degraded operation during fault conditions. Its CAN physical layer supports data rates from 40 kB/s to 1.0 MB/s and includes bus failure diagnostics, local/remote wake-up detection, and split termination support.

It features a secured SPI interface with parity checking and windowed watchdog capability, plus high-precision VSUP sensing for cranking pulse management. Unlike MC33903D/S variants, this part lacks VAUX, VSENSE, and MUX functionality - confirming its minimal-feature configuration within the MC33903 family.

Key Specifications

ParameterValue and Actual Design Meaning
VDD Output Voltage5.0 V fixed; powers MCU directly without external PNP ballast support
VDD Output Current150 mA max; limits total MCU + peripheral load without external transistor
CAN InterfaceHigh-speed, ISO 11898-2 and -5 compliant; supports 40 kB/s–1 MB/s data rates
Sleep Current (VDD OFF)15 µA typical; enables ultra-low-power ECU standby with active CAN/LIN wake-up
Operating Voltage Range5.5 V–28 V; withstands 40 V load dump per ISO 7637-2 Pulse 5a
ESD Protection (CAN)±8000 V HBM; meets module-level EMC robustness requirements
Temperature Range−40 °C to +125 °C ambient; qualified for under-hood and chassis applications

Pinout & Package

MCZ33903C3EK is housed in a Pb-free 32-pin SOIC wide-body package with exposed thermal pad (suffix EK), optimized for automotive PCB thermal dissipation and reflow compatibility.

Pin/TerminalCircuit RoleDesign Meaning
VDDMCU Power Supply Output5.0 V regulated LDO output; supplies MCU core logic; no external ballast support
VSUPMain Battery InputAccepts 5.5–28 V battery rail; feeds internal regulators and monitors cranking events
CANH / CANLCAN Bus Differential PairDirect connection to high-speed CAN bus; integrated termination and fault protection
SPI_CS / SCLK / MOSI / MISOSecured Serial Peripheral InterfaceConfigurable for register access, diagnostics, and watchdog control with parity validation
SAFEFail-Safe State Machine OutputOpen-drain signal indicating safe/fault state; drives external reset or monitoring circuitry
WAKEWake-Up InputDedicated pin for edge-triggered wake-up from sleep mode; supports LIN/CAN bus activity detection
RSTReset OutputActive-low MCU reset signal synchronized with internal state machine transitions
DBGDebug Mode ControlPull-low disables watchdog during development; avoids false resets during firmware debug

Key Features

FeatureDesign Value
Fail-Safe State MachineHardware-configurable default behavior on fault; SAFE pin asserts to coordinate system-level recovery
Secured SPI InterfaceParity-checked register access with windowed watchdog; prevents unintended MCU lockup
Cranking Pulse ManagementMonitors VSUP ramp rate and maintains partial functionality during engine start (e.g., CAN listen-only mode)
Ultra-Low Sleep Current15 µA with VDD off and CAN wake-up enabled; reduces parasitic drain in parked vehicle state
ISO 11898-2/5 CAN ComplianceValidated physical layer performance including common-mode rejection, bus fault tolerance, and timing jitter

Applications

Body ControllerSeat Module

Use Scenario: Centralized control of door locks, windows, mirrors, and interior lighting in mid-tier automotive body electronics.

IC Role / Device Role / Timing Role: Primary power manager and CAN interface for S12x-based controller; provides regulated 5.0 V VDD and handles network wake-up.

Use Value: Eliminates discrete CAN transceiver and LDO; reduces BOM count by 3 components while maintaining ISO 11898-2 compliance and <15 µA sleep current.

Use Scenario: Occupant detection, position memory, and heating control in premium front seat assemblies.

IC Role / Device Role / Timing Role: System basis chip supplying 5.0 V to MCU and enabling CAN communication with gateway; uses WAKE pin for LIN-initiated wake events.

Use Value: Enables seamless integration with MPC560x MCUs and supports functional safety requirements via SAFE pin assertion during overvoltage faults.

Door ModuleLighting Control Module

Use Scenario: Smart door handle, anti-pinch window lift, and proximity-sensing mirror fold/unfold functions.

IC Role / Device Role / Timing Role: Power and communication hub connecting MCU to CAN bus and local sensors; manages cranking-mode voltage sag gracefully.

Use Value: Maintains CAN listen mode during engine start (VSUP down to 5.5 V), ensuring no message loss during critical vehicle startup sequence.

Use Scenario: Adaptive front-lighting (AFS), dynamic rear lighting, and LED driver coordination in exterior lighting clusters.

IC Role / Device Role / Timing Role: Regulated 5.0 V supply source and CAN interface for S08x-based lighting controller; supports diagnostic reporting via SPI.

Use Value: Provides ±8 kV ESD-protected CAN I/O and failsafe state signaling to meet OEM lighting module EMC and functional safety targets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCZ33903B3EK3.3 V VDD output; identical pinout and feature set except voltage levelRequired when interfacing with 3.3 V MCUs (e.g., S08x, certain MPC56xx derivatives)Select MCZ33903B3EK if MCU core voltage is 3.3 V; otherwise MCZ33903C3EK is optimal for 5.0 V MCU systems.
MCZ33904C3EKSame 5.0 V VDD, but adds four wake-up inputs (vs. one on MCZ33903C3EK); no LIN interfaceBetter suited for CAN-only ECUs requiring multiple sensor-initiated wake sources (e.g., HVAC actuators, pedal position)Choose MCZ33904C3EK when >1 wake-up input is needed and LIN is not required; MCZ33903C3EK prioritizes minimal footprint and cost for basic CAN+MCU power use cases.

Compared with MCZ33903B3EK and MCZ33904C3EK, the MCZ33903C3EK delivers optimal balance of 5.0 V MCU support, CAN compliance, and ultra-low sleep current in the smallest 32-pin SOIC footprint - making it ideal for cost-sensitive, space-constrained body ECU designs where single-wake capability suffices.

Availability

MCZ33903C3EK is available at Aetrix Electronics and suitable for body controller, seat module, door module, and lighting control applications requiring stable component supply across automotive production lifecycles.

Supply support for MCZ33903C3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive semiconductors, delivering SMARTMOS-based analog, power, and mixed-signal ICs for safety-critical and high-reliability vehicle systems.

The MC33903 family was engineered as a Gen2 System Basis Chip targeting cost-optimized, CAN-centric ECUs in body electronics - emphasizing low quiescent current, fail-safe behavior, and seamless integration with Freescale/NXP MCU platforms.

FAQ

What is the maximum output current capability of the VDD regulator in MCZ33903C3EK?

The MCZ33903C3EK provides a fixed 5.0 V VDD output rated for up to 150 mA continuous current. Unlike higher-current variants (e.g., MC33903D), this part does not support external PNP ballast transistor implementation, so the 150 mA limit is absolute and must be respected in MCU + peripheral load calculations. Exceeding this current may cause VDD droop or thermal shutdown.

Does MCZ33903C3EK support LIN communication?

No, MCZ33903C3EK does not integrate any LIN transceiver or LIN master terminal outputs. It belongs to the base MC33903 variant group (non-D/non-S suffix), which includes only CAN interface, one wake-up input, and no LIN or auxiliary regulation features. For LIN-capable alternatives, consider MCZ33903BS3EK or MCZ33903BD3EK.

What package type and thermal characteristics does MCZ33903C3EK use?

MCZ33903C3EK is packaged in a Pb-free 32-pin SOIC wide-body (SOICW) with exposed thermal pad (suffix EK). The exposed pad enhances thermal conduction to the PCB, supporting operation up to +125 °C ambient. Its thermal resistance θJA is 45 °C/W typical on 2-layer JEDEC standard board, enabling reliable performance in under-dash and door module environments.

How does the fail-safe state machine operate in MCZ33903C3EK?

The MCZ33903C3EK implements a hardware-based fail-safe state machine that monitors VSUP, VDD, temperature, and internal errors. On fault detection, it asserts the open-drain SAFE pin and can force RST low to reset the MCU. Behavior is configurable via external resistor networks on pins like RSTTIME and UVTH, allowing OEMs to define custom safe states without firmware dependency.

Is MCZ33903C3EK compatible with NXP's evaluation boards?

Yes, MCZ33903C3EK is supported by the KIT33903BD3EVBE and KIT33903BD5EVBE evaluation boards, both designed for the MC33903 family. These kits provide full SPI access, CAN bus connectivity, debug interfaces, and test points for measuring VDD, VSUP, and SAFE pin behavior - enabling rapid validation of MCZ33903C3EK in target ECU configurations.

MCZ33903C3EK Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Applications:
System Basis Chip
Interface:
CAN
Voltage - Supply:
5.5V ~ 28V
Supplier Device Package:
32-SOIC-EP
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

MCZ33903C3EK FAQ

1.How can I place an order for MCZ33903C3EK through Aetrix?

Please submit a Request for Quotation (RFQ) for MCZ33903C3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCZ33903C3EK reliable?

The price and inventory of MCZ33903C3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903C3EK is usually 5 days.

3.What payment methods are accepted for MCZ33903C3EK?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903C3EK transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCZ33903C3EK?

MCZ33903C3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCZ33903C3EK order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCZ33903C3EK?

For technical support, including MCZ33903C3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903C3EK requirements.

6.How does Aetrix verify that MCZ33903C3EK is sourced from the original manufacturer or authorized distributors?

All MCZ33903C3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903C3EK meets industry standards.

7.What is the process for return or replacement of MCZ33903C3EK?

All MCZ33903C3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903C3EK, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCZ33903C3EK part is unused and in its original packaging.

Return procedure for MCZ33903C3EK:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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