NXP Semiconductors MCZ33903CD5EK

Overview

MCZ33903CD5EK from NXP (formerly Freescale) is a second-generation automotive System Basis Chip (SBC) integrating high-speed CAN transceiver (ISO 11898-2/5), dual LIN 2.1/J2602-2 interfaces, 5.0 V MCU regulator (150 mA), internal 5.0 V CAN regulator, and fail-safe state machine. It operates from 5.5–28 V input, supports -40 °C to 125 °C ambient, and delivers 15 µA quiescent current in VDD-OFF low-power mode - used in body control modules and gateway ECUs requiring robust networked power management.

For engineers reviewing the MCZ33903CD5EK datasheet, MCZ33903CD5EK pinout, MCZ33903CD5EK application, or MCZ33903CD5EK equivalent, key selection criteria include dual-LIN support with configurable wake-up/I/O mapping, ISO 11898-5 compliance, cranking pulse resilience, secured SPI with watchdog, and SOIC-32 exposed-pad packaging for thermal performance in automotive under-hood environments.

Technical Context

The MCZ33903CD5EK implements a fail-safe state machine linked to the SAFE pin, enabling hardware-configurable default behavior during fault conditions. Its dual LIN interfaces operate at 10.4–20 kB/s (100 kB/s fast mode), each with dedicated LIN-TERM outputs and RXD/TXD pins, while the CAN physical layer supports 40 kB/s–1 MB/s data rates with bus failure diagnostics and SPLIT termination support.

Power architecture includes independent regulators: fixed 5.0 V VDD LDO (150 mA, no external PNP support), internal 5.0 V VCAN supply, and analog monitoring via VSUP sense with MUX-OUT for multiplexed voltage inputs. Wake-up capability is configurable across three I/O pins - supporting combinations of wake-up inputs and LIN master terminations per design requirements.

Key Specifications

Pinout & Package

MCZ33903CD5EK is housed in a Pb-free 32-pin SOIC Wide-body package with exposed thermal pad (suffix EK), optimized for automotive thermal dissipation and board-level reliability. Pin functions are validated per MC33903D Simplified Application Drawing and Freescale document MC33903_4_5FS Rev. 6.0.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Compared with MCZ33905CD5EK/R2 and MCZ33904C5EK/R2, the MCZ33903CD5EK/R2 uniquely balances dual-LIN support, minimal pin count (32-pin SOIC), and fail-safe operation - making it ideal for cost-sensitive, space-constrained body ECUs requiring two LIN subnets and CAN integration.

Availability

MCZ33903CD5EK is available at Aetrix Electronics and suitable for body control modules, gateway ECUs, seat modules, and column modules requiring stable component supply across automotive production lifecycles.

Supply support for MCZ33903CD5EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive semiconductor solutions, specializing in SMARTMOS analog-power integration and functional safety-certified ICs for body, powertrain, and chassis systems.

The MC33903 family is part of NXP's System Basis Chip Gen2 platform, designed specifically for automotive electronic control units requiring integrated high-speed CAN, dual LIN, fail-safe power management, and ultra-low-quiescent-current operation.

FAQ

What is the maximum output current of the VDD regulator in MCZ33903CD5EK?

The VDD regulator in MCZ33903CD5EK delivers a fixed 5.0 V output with a maximum continuous current of 150 mA. Unlike other variants in the MC33903/4/5 family, this device does not support external PNP transistor ballasting - so output current cannot be scaled beyond 150 mA. This specification is confirmed in the MC33903D Simplified Application Drawing and MC33903_4_5FS Rev. 6.0 datasheet.

Does MCZ33903CD5EK support ISO 11898-5 partial networking?

Yes, MCZ33903CD5EK supports ISO 11898-5 partial networking through its enhanced high-speed CAN interface. This enables selective wake-up of the device via specific CAN identifiers while remaining in low-power mode - a key requirement for automotive gateways managing multiple domains. The feature is documented in the "Enhanced High-speed CAN Physical Interface" block diagram and conformance statements in MC33903_4_5FS Rev. 6.0.

How many LIN interfaces does MCZ33903CD5EK integrate, and what standards do they meet?

MCZ33903CD5EK integrates two fully independent LIN 2.1 interfaces compliant with SAE J2602-2. Each includes dedicated TXD-L1/RXD-L1 and TXD-L2/RXD-L2 pins plus LIN-TERM1/LIN-TERM2 outputs for master termination. Both interfaces support data rates from 10.4 kB/s to 20 kB/s (100 kB/s in fast mode), as specified in the Key Characteristics table of MC33903_4_5FS Rev. 6.0.

What package type and thermal features does MCZ33903CD5EK use?

MCZ33903CD5EK uses a Pb-free 32-pin SOIC Wide-body package with exposed thermal pad (suffix EK), referenced in Freescale document 98ASA10556D. The exposed pad enhances thermal dissipation for under-hood operation and requires solder connection to PCB ground plane per IPC-7351B guidelines - critical for maintaining junction temperature within -40 °C to +125 °C operating limits.

Is MCZ33903CD5EK pin-compatible with other MC33903 variants like MCZ33903BD5EK/R2?

Yes, MCZ33903CD5EK is pin-compatible with all MC33903x5EK variants in the same SOIC-32 exposed-pad package, including MCZ33903BD5EK/R2. Differences are limited to internal configuration (e.g., reset timing, watchdog type, UVLO threshold) and do not affect pin function or electrical interface - enabling drop-in replacement for design revisions without PCB changes.