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NXP Semiconductors MCZ33903CP3EK
- Part No.:
- MCZ33903CP3EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903CP3EK.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,713
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Product details
Overview
MCZ33903CP3EK from NXP (formerly Freescale) is a second-generation System Basis Chip (SBC) designed as an automotive power management and communication interface unit for MCU-based ECUs in body, safety, and powertrain systems. It integrates a 3.3 V/150 mA MCU voltage regulator (VDD), high-speed CAN transceiver (ISO 11898-2/5 compliant), no LIN interface, single wake-up input, and failsafe state machine - deployed in door modules, lighting control, and seat belt pre-tensioners.
For engineers reviewing the MCZ33903CP3EK datasheet, MCZ33903CP3EK pinout, MCZ33903CP3EK application, or MCZ33903CP3EK equivalent, key selection criteria include its 3.3 V VDD output with 150 mA limit (no external ballast support), absence of LIN, single wake-up capability, SOIC-32 exposed pad package, and compliance with ISO 11898-2/5 and automotive AEC-Q100 Grade 1 requirements.
Technical Context
The MCZ33903CP3EK implements a dedicated 5.0 V internal regulator for CAN driver supply (VCAN), supports cranking pulse management during low-VDD conditions, and features a secured SPI interface with watchdog capability. Its fail-safe state machine is linked to the SAFE pin and enables configurable default behavior during fault conditions.
It provides high-precision VSUP sensing (with VSENSE and MUX support), operates across 5.5–28 V input range, withstands 40 V load dump, and delivers ultra-low quiescent current of 15 µA in VDD-OFF sleep mode - all within −40 °C to +125 °C ambient temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output Voltage | 3.3 V fixed; powers MCU core logic without external ballast transistor support |
| VDD Output Current | 150 mA max; insufficient for >150 mA MCU loads without supplemental regulation |
| CAN Interface | High-speed CAN per ISO 11898-2 and ISO 11898-5; includes bus failure diagnostics and fail-safe operation |
| Wake-up Inputs | 1 dedicated wake-up pin; supports cyclic sense and low-power wake event detection |
| Operating Voltage Range | 5.5 V to 28 V; tolerates 40 V load dump transients per ISO 7637-2 |
| Quiescent Current (VDD-OFF) | 15 µA typical; enables long-term battery-off ECU monitoring without excessive drain |
| Temperature Range | −40 °C to +125 °C ambient; qualified to AEC-Q100 Grade 1 |
Pinout & Package
MCZ33903CP3EK is housed in a Pb-free 32-pin SOIC wide-body package with exposed thermal pad (suffix EK), optimized for automotive PCB thermal management and EMC robustness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main supply input | Accepts 5.5–28 V battery input; dual pins reduce IR drop and improve noise immunity |
| VDD | MCU power output | 3.3 V regulated output; 150 mA max; not extensible with external PNP |
| VCAN | CAN transceiver supply | Dedicated 5.0 V LDO output; powers internal CAN PHY independently of VDD |
| CANH / CANL | CAN differential bus interface | Direct connection to vehicle CAN bus; integrated termination and fault protection |
| SAFE | Failsafe state machine output | Open-drain signal indicating active fail-safe mode; drives external safety circuitry |
| RST | Reset output | Active-low reset signal synchronized to internal state machine; asserts on VDD under-voltage or fault |
| WAKE | Wake-up input | Single digital input supporting edge-triggered wake from sleep; configurable sensitivity |
| SPI_CS / SCLK / MOSI / MISO | Configurable SPI interface | Secured 4-wire SPI for register access, watchdog control, and diagnostics reporting |
| DBG | Debug inhibit | Active-high pin disabling watchdog during development; eliminates false resets during debug |
| GND | Power and signal ground | Multiple GND pins including dedicated analog and power return paths for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine | Hardware-configurable default behavior on fault; SAFE pin asserts to trigger external safety actions |
| Secured SPI with watchdog | Parity-checked register access plus time-out and window watchdog modes; prevents MCU lockup |
| High-precision VSUP sensing | VSENSE input + analog MUX support enables accurate battery voltage monitoring for cranking detection |
| Innovative cranking pulse management | Maintains partial functionality (e.g., CAN monitoring) during 3–5 V battery dips without external capacitor |
| Ultra-low sleep current | 15 µA VDD-OFF mode enables >1-year battery-off monitoring in always-on ECUs |
Applications
| Door Module Control | Lighting Control Module |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary SBC providing MCU power (VDD), CAN communication, and wake-up response to door handle sensors or RF signals. Use Value: Enables single-chip integration of power, CAN, and wake-up - reducing BOM count and PCB area vs. discrete regulators + CAN transceivers. | Use Scenario: Intelligent headlight, fog light, and interior LED control with dimming, diagnostics, and CAN-based configuration. IC Role / Device Role / Timing Role: Power management and CAN interface for 3.3 V microcontroller; monitors battery voltage during cranking to prevent false shutdown. Use Value: 15 µA sleep current extends battery life during vehicle off-state; VCAN-regulated CAN PHY ensures reliable bus communication at low battery. |
| Seat Belt Pre-tensioner | Column Module |
Use Scenario: Safety-critical deployment of pyrotechnic seat belt tensioners triggered by crash sensors and coordinated via CAN. IC Role / Device Role / Timing Role: Fail-safe power manager with SAFE pin assertion and deterministic reset timing for ASIL-B–aligned subsystems. Use Value: Hardware-linked fail-safe state machine meets functional safety requirements without software intervention; ISO 11898-5 compliance ensures robust CAN communication during crash events. | Use Scenario: Integration of steering wheel controls, paddle shifters, and airbag sensor interfaces in column-mounted ECUs. IC Role / Device Role / Timing Role: 3.3 V MCU power source and CAN node with wake-up on button press or CAN message; supports cyclic sense for low-power polling. Use Value: Single wake-up input suffices for momentary switch inputs; ultra-low 15 µA sleep current minimizes parasitic drain on 12 V battery over extended parking periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33903B3EK | Same 3.3 V VDD, 150 mA, no LIN, SOIC-32 EK; "B" revision resolves VSUP slow ramp-up and improves oscillator stability | Identical pinout and function; preferred for new designs due to enhanced startup reliability | Select MCZ33903B3EK when requiring improved VSUP ramp behavior and lower sleep current vs. "C" version |
| MCZ33904B3EK | 3.3 V VDD, 150 mA, no LIN, but adds 4 wake-up inputs and VSENSE/MUX support - same SOIC-32 EK package | Enables multi-sensor wake sources (e.g., door, seat, ambient); suitable where system requires >1 wake event channel | Choose MCZ33904B3EK if additional wake-up flexibility or analog monitoring is needed beyond MCZ33903CP3EK's single wake-up capability |
Compared with MCZ33903CP3EK, MCZ33903B3EK offers verified improvements in VSUP ramp-up and oscillator performance, while MCZ33904B3EK expands wake-up and analog sensing capability - both retain identical CAN functionality, 3.3 V/150 mA VDD, and SOIC-32 EK footprint.
Availability
MCZ33903CP3EK is available at Aetrix Electronics and suitable for door module control, lighting control modules, seat belt pre-tensioners, and column modules requiring stable component supply across automotive production lifecycles.
Supply support for MCZ33903CP3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in automotive, industrial, and IoT semiconductor solutions, with deep expertise in SMARTMOS analog-power integration and functional safety design.
The MC33903 family is part of NXP's System Basis Chip portfolio - engineered specifically for automotive ECU power management, communication interface consolidation, and fail-safe operation in body, safety, and powertrain domains.
FAQ
What is the maximum output current of the VDD regulator in MCZ33903CP3EK?
The MCZ33903CP3EK provides a fixed 3.3 V VDD output rated for up to 150 mA. Unlike variants such as MCZ33903D or MCZ33904, it does not support external ballast transistor implementation - so the 150 mA limit is absolute and non-scalable. This makes MCZ33903CP3EK suitable for low-power MCUs like S08x or entry-level S12x derivatives, but not for higher-current MPC56xx devices without supplemental regulation.
Does MCZ33903CP3EK include a LIN interface?
No, MCZ33903CP3EK does not integrate any LIN transceiver. It belongs to the base variant of the MC33903 family with only high-speed CAN (ISO 11898-2/5) and no LIN capability. LIN support is present only in MC33903S (single LIN), MC33903D (dual LIN), and MC33905 variants. The "P" suffix in MCZ33903CP3EK explicitly denotes zero LIN interfaces.
What wake-up capabilities does MCZ33903CP3EK support?
MCZ33903CP3EK provides exactly one dedicated wake-up input pin (WAKE). It supports edge-triggered wake events and cyclic sense functionality to minimize state transitions during low-power monitoring. This differs from MCZ33904 (four wake-up inputs) and MCZ33903D (up to three wake-up inputs depending on LIN terminal configuration), making MCZ33903CP3EK optimal for simple, cost-sensitive nodes with minimal wake sources.
Is MCZ33903CP3EK qualified for automotive use?
Yes, MCZ33903CP3EK is AEC-Q100 Grade 1 qualified (−40 °C to +125 °C), certified to ISO 11898-2 and ISO 11898-5 for CAN physical layer robustness, and validated for EMC/ESD per automotive standards including ISO 7637-2 (40 V load dump). Its fail-safe state machine, cranking pulse management, and secured SPI make it suitable for ASIL-B–aligned body and safety applications.
What package type is used for MCZ33903CP3EK?
MCZ33903CP3EK uses a Pb-free 32-pin SOIC wide-body package with exposed thermal pad (suffix EK), designated as 98ASA10556D in NXP documentation. This package supports efficient heat dissipation in automotive under-hood environments and provides mechanical robustness for reflow soldering in high-volume manufacturing.
MCZ33903CP3EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- System Basis Chip
- Interface:
- CAN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SSOP-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903CP3EK FAQ
1.How can I place an order for MCZ33903CP3EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903CP3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903CP3EK reliable?
The price and inventory of MCZ33903CP3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903CP3EK is usually 5 days.
3.What payment methods are accepted for MCZ33903CP3EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903CP3EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903CP3EK?
MCZ33903CP3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903CP3EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903CP3EK?
For technical support, including MCZ33903CP3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903CP3EK requirements.
6.How does Aetrix verify that MCZ33903CP3EK is sourced from the original manufacturer or authorized distributors?
All MCZ33903CP3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903CP3EK meets industry standards.
7.What is the process for return or replacement of MCZ33903CP3EK?
All MCZ33903CP3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903CP3EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903CP3EK part is unused and in its original packaging.
Return procedure for MCZ33903CP3EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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